Cu附着膜的屈服强度与退火温度的关系

RELATIONSHIP BETWEEN THE YIELD STRENGTH AND ANNEALING TEMPERATURE OF A Cu FILM ADHERENT TO SUBSTRATE

利用X射线拉伸实验研究了具有二维残余应力的Cu附着膜的屈服强度与退火温度的关系.结果表明, Cu附着膜的条件屈服点随着退火温度的增高而减小,退火温度在150-300℃间变化时,减小幅度最大,出现明显的拐点.这主要由于Cu附着膜在该温度范围内发生了再结晶,使得原有的大部分组织结构强化因素消失了. Cu附着膜的屈服强度远远高于块体Cu材的屈服强度.

Using X-ray tensile test, the relationship between the yield strength and annealing temperature for a Cu film with biaxial residual stress adherent to substrate was investigated. The results indicate that the proof stress of the film decreases with increasing annealing temperature. When annealing temperature rose from 150 degreesC to 300 degreesC, the decreasing amplitude of proof stress is the largest. The reason of this phenomenon is that recrystallization in film occurred at 300 degreesC, and a majority of structure strengthening effects disappeared. The yield strength of the Cu film on the steel substrate is greatly higher than that of block Cu.