摘要
为了使我所微电路封装产品能广泛满足航空、航天及其他特殊领域对内部水汽含量的要求(≤5000ppm),提出了降低金属或陶瓷结构封装的微电路封装产品内部水汽含量的控制方法和工艺要求。
In order to make Packaged microcircuit product by 24th Institute meet the requirement of aviation and space, as well as other fields, on the moisture content of packaged devices (≤5000 ppm), techniques and process requirement to reduce the moisture content in metal or ceramic packaged devices are presented in the paper.
出处
《电子与封装》
2004年第3期20-23,共4页
Electronics & Packaging
关键词
微电路封装产品
水汽含量
PPM
Packaged Microcircuit Product Moisture Content ppm
