摘要
文章详细介绍了一种用于集成电路自热效应研究的电热耦合模拟软件(ETsim2)。针对具体的集成电路封装结构以及特定的封装材料,该软件利用有限差分数值算法(FDM),求解三维热扩散方程;对集成电路芯片进行了精确的三维热学分析和电学性能验证。
A new electro-thermal simulator (ETsim2) for self-heat effect of integrated circuits is presented. For specific IC packages and special packaging materials, the simulator solves 3-D thermal diffusion equation by using the finite difference method (FDM). Substrate thermal distribution of IC chips is accurately estimated and their electrical performances are validated using this model.
出处
《微电子学》
CAS
CSCD
北大核心
2004年第3期295-297,301,共4页
Microelectronics
基金
国家自然科学基金资助项目(59995550-01)
