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复合材料热压成型过程环氧树脂流变特性研究 被引量:7

Research on Rheology Regularity of Epoxy Resin During Composite Press Molding Process
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摘要 针对复合材料热压成型过程的工艺特点,以环氧618/2E4MZ及环氧618/DDS体系为研究对象,通过测试DSC曲线、η T曲线、η γ曲线及计算不同升温速率下的流动活化能,得到温度、升温速率、剪切速率对体系黏度的影响规律。在大量实验研究基础上,利用具有可操作性的固化工艺参数(dT/dt)表征了阿累尼乌斯方程中的流动活化能、指前因子及幂律方程中的黏度系数,确定了两种树脂体系黏度平台区、下降区的黏度方程。当树脂体系一定时,所建立的黏度方程描述了树脂黏度下降区及黏度平台区的黏度变化规律,为复合材料热压成型树脂流变过程的模拟研究提供了参考依据。 The resin matrix rheology regularity during the composite curing process is described. The bisphenol epoxy resin is used as the research object, and its DSC (differential scanning calorimetry) curve, viscosity-temperature curve and viscosity-rate curve are measured. The rheology activation energy is characterized and then the regularities of the effects of temperature, temperature increase rate and shear rate are analyzed. Base on a lot of experiments, the rheology activation energy, the exponential parameter of the Arrhenius equation and the viscosity parameter of the power equation were expressed by temperature increase rate, and the viscosity equations of two resin systems are established. With a definite resin system, these numerical models have a certain extent commonality for different curing processes.
出处 《航空学报》 EI CAS CSCD 北大核心 2004年第3期312-316,共5页 Acta Aeronautica et Astronautica Sinica
基金 国家自然科学基金(59833110) 国家863计划(2001AA335020)资助项目。
关键词 复合材料 流变规律 热压成型 环氧树脂 Activation energy Differential scanning calorimetry Epoxy resins Molding Pressing (forming) Rheology
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参考文献4

  • 1Tredoux L, van der Westhuizen J. Development of a numerical code that simulation combined heat transfer, resin flowand compaction during composites processing [J].Composites Manufacturing, 1995, 6(2): 85-92.
  • 2Blest D C, Duufy B R, Mckee S, et al. Curing simulation of thermoset composites [J]. Composites Part A: applied science and manufacturing, 1999, 30:1289-1309.
  • 3Martin J S,Laza J M,Morras M L,et al. Study of the curing process of a vinyl ester resin by means of TSR and DMTA [J]. Polym, 2000, 41:4203-4211.
  • 4Kardos J L.Advanced composites manufacturing [M].New York:John Wiley & Sons lnc, 1997.43-57.

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