摘要
介绍了合成酞菁铜(CuPc)及通过电化学聚合将其以PolyCuPc的形式固定在Au丝微电极的表面,制作高分子聚合物类化学修饰电极的方法。比较了空白电极及修饰电极对O2的敏感特性差异,讨论了PolyCuPc对O2的催化机理和浓度响应关系。通过实验发现:对电极的活化处理可以使O2在电极上反应的"杂峰"减少甚至消失,并使反应的基底电流趋于平坦。
Recommended the process of CuPc synthesization and fasting it on the surface of Au-microelectrode in the form of PolyCuPc to make chemical electrode modefied by macromolecule polymer.Compared the difference of oxygen sensitivity characteristic of blank and modified electrodes and discussed the catalyze mechanism and respond of concentration of the PolyCuPc to oxygen.The activate transaction to electrode could down or disappear the miscellaneous peaks of reaction on the electrode surface and make the fundus electricity to flatness.
出处
《仪表技术与传感器》
CSCD
北大核心
2004年第6期48-50,共3页
Instrument Technique and Sensor
关键词
酞菁铜
Au丝微电极
气敏特性
活化处理
Cu-phthalocyanine
Au-Microelectrode
Gas Sensitivity Characteristic
Activate Transact
