光学元件表面浅划痕长度的定量检测研究

Quantitative Measurement Research for the Length of Shallow Scratch on Optics Surface

对于光学元件表面的浅划痕缺陷,在利用显微散射暗场成像技术对其进行定量检测的过程中,由于其成像亮度与背景光强非常接近,因此对疵病图像直接进行二值化处理将无法有效提取其中的划痕特征,从而影响定量检测结果的准确性。为了解决上述问题,提出了一种对于浅划痕长度的准确定量分析方法,其通过将疵病图像与背景图像相减后得到目标图像,进而对目标图像进行二值化处理和分析即可得到浅划痕的准确长度信息。该方法对于光学元件表面疵病的定量检测具有重要的意义和应用。

During the process of quantitatively measuring the shallow scratches defects on the optics surface using microscopic scattering dark-field imaging technique, because the imaging brightness of defect is close to the background intensity, the characteristic of shallow scratches can’t be effectively analyzed by directly disposing the defect image with binary-state process, which will influence the accuracy of the quantitative measurement result. For solving the above problem, a method for ac-curately measuring the length of the shallow scratches is proposed. By subtracting the defect image with the background image, the target image is obtained. Then the accurate length information can be acquired by disposing the target image with binary-state process. This method has important significance and application for the quantitatively measuring the defects on optics surface.