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LTCC微型巴伦设计

Design of a Miniature Balun Based on LTCC
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摘要 本文提出了一种基于LTCC (低温共烧陶瓷)技术的微型巴伦的设计与实现方法。此种巴伦采用Marchand型结构,运用LTCC多层三维立体集成技术,通过宽边耦合的螺旋型结构实现1/4波长耦合线,大大减小了巴伦的实际体积。随后通过带状线末端电容加载技术的改进型结构,近一步缩小了耦合线长,实现了结构的微型化。最终设计的巴伦工作频带1.5~3 GHz,具有插损小,幅度平坦性好,相位一致性高的优点,巴伦尺寸为2.5 mm ×3 mm ×1.2 mm。文章讨论了该巴伦工作原理、微型化的设计思路、三维结构,最后给出了设计的仿真和测试结果,两者一致性较好。 A method of designing and implementing a miniature LTCC balun is proposed in this paper. This kind of balun is based on the structure of Marchand microstrip balun in order to realize the mi-niaturization. LTCC multilayer 3D technology, broadband coupling spiral stripline and loading terminal capacitors structure have been used to achieve quarter-wave coupling line to reduce the size. The operation frequency ranges from 1 GHz to 3 GHz with the advantages of low insertion loss, well amplitude balance and strong phase consistency. The dimension was only 2.5 mm ×3 mm ×1.2 mm. The operation principle, design thoughts of miniaturization and the structure of balun were discussed in this paper. At last, the results from the simulation and those from the measurement are in good agreement.
作者 孙超 戴永胜 Chao Sun;Yongsheng Dai(School of Electronic Engineering and Optoelectronic Technology, Nanjing University of Science and Technology,Nanjing Jiangsu)
机构地区 南京理工大学电子工程与光电技术学院
出处 《应用物理》 2016年第3期36-41,共6页 Applied Physics
关键词 巴伦 低温共烧陶瓷(LTCC) 微型化 电容加载 Balun Low Temperature Co-Fired Ceramic (LTCC) Miniature Loading Capacitors
分类号 TN7 [电子电信—电路与系统]
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  • 1LEW D W, PARK J S, AHN D, et al. A design of the ceramic chip balun using the multilayer configuration [J]. IEEE Trans MTT, 2001, 49(1): 220-224.
  • 2SCHWINDT R, NGUYEN C. A CAD procedure for the double-layer broadside-coupled Marchand balun [C]//1994 IEEE MTT-S Int Dig. San Diego, USA: IEEE, 1994.
  • 3ROGERS J, BHATIA R. A 6 to 20 OHz planar balun using a Wilkinson divider and Lange couplers [C]// 1991 IEEE MTT-S lnt Dig. Boston, USA: IEEE, 1991.
  • 4FUJIKI Y, MANDAI H, MORIKAWA T. Chip type spiral broadside coupled directional couplers and baluns using low temperature co-fired ceramic [C]// 1999 IEEE Electronic Components and Technology Conference. San Diego, USA: IEEE, 1999.
  • 5TANG C W, SHEEN J W, CHANG C Y. Chip-type LTCC-MLC baluns using the stepped impedance method [J]. IEEE Trans MTT, 2001, 49: 2342-2349.
  • 6CHONGCHEAWCHAMNAN M C Y, ROBERTSON I D. Analysis and design of a high-performance planar Marchand balun [C]//2002 IEEE MTT-S Dig. Washington, USA: IEEE, 2002.
  • 7TANG C W, CHANG C Y. A semi-lumped balun fabricated by low temperature co-fired ceramic [C]//2002 IEEE MTT-S Dig. Washington, USA: IEEE, 2002.
  • 8TANG C W, CHANG C Y. LTCC-MLC chip-type balun realised by LC resonance method [J]. Electron Lett, 2002, 38:519-520.
  • 9TANG C W, CHANG C Y. Using buried capacitor in LTCC-MLC balun [J]. Electron Lett, 2002, 38: 801-803.
  • 10ANG K S, LEONG Y C, LEE C H. Analysis and design of miniaturized lump-distributed impedance-transforming baluns [J]. IEEE Trans MTT, 2003, 51(3): 1009-1017.

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应用物理
2016年 第3期

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