摘要
X射线检测在当前无损检测技术方面占据着主要地位,广泛应用于各种领域。本文重点分析了X射线检测系统的组成和硬件功能的实现。对X射线像增强器、mcp准直器、FPGA的影像处理系统等各组成部分进行实验分析,详细研究了影响整个检测系统成像质量的因素,对整个无损检测系统进行改进和优化。
X-ray inspection occupies the mainposition in the field of non-destructive testing and is widely used in variousfields.In this paper,the composition of in situ X-ray detection system and the realization of hardware function areanalyzed.Experimental analysis was carried out on various components of X-ray image intensifier,MCP collimator,FPGAimage processing system,etc.,and the factors affecting the imaging quality ofthe whole testing system were studied in detail,so as to improve and optimizethe whole NDT system.
出处
《应用物理》
CAS
2019年第7期336-347,共12页
Applied Physics
