摘要
随着通信技术的发展,要求通信设备向小型化发展,而微组装工艺技术是目前设备小型化的重要手段。本文详细设计了基于微组装的SPDT开关,利用HFSS和ADS仿真工具对SPDT开关进行优化仿真,仿真结果较好,插损小于0.15 dB,隔离度大于49 dB。从理论上验证了基于微组装SPDT开关设计方法的正确性,具有一定指导意义。
With the development of communication technology, communication equipment is required to develop for miniaturization, and micro-assembly process technology is an important means of equipment miniaturization. In this paper, the SPDT switch based on micro-assembly is designed in detail, and the SPDT switch is optimized and simulated by HFSS and ADS simulation tools, and the simulation results are good, the insertion loss is less than 0.15 dB, and the isolation is greater than 49 dB. Theoretically, the correctness of the design method based on the micro-assembled SPDT switch is verified, which has certain guiding significance.
出处
《应用物理》
CAS
2022年第4期205-212,共8页
Applied Physics