固体继电器介质耐电压的研究进展

Research Progress of Dielectric Voltage Resistance in Solid State Relays

近年来,由于2类固体继电器开关速度快、灵敏度高、功耗低、可靠性高、在整机系统中干扰小等优势被广泛应用于航空航天电子、汽车飞机控制开关、工业控制系统、电信仪表等领域。固体继电器的介质耐电压可以直接表征电路所用元器件的质量,从而以此判断继电器的可靠性。然而随着继电器小型化、模块化的快速发展,继电器的耐压值越来越无法满足使用要求。为解决固体继电器低耐压值的问题,本文从空气湿度、大气压强环境因素分析了耐压值低的内在原因。从继电器印制电路板布局、元器件选型、管壳镀膜、金属多余物控制角度阐述了优化介质耐电压相应的物理机制。

In recent years, due to the advantages of fast switching speed, high sensitivity, low power consumption, high reliability and low interference in the whole system, Class 2 solid relay is widely used in aerospace electronics, automotive and aircraft control switches, industrial control systems, tele-communications instruments and other fields. The dielectric withstand voltage of a solid state relay can directly characterize the quality of the components used in the circuit, so as to judge the reliability of the relay. However, with the rapid development of miniaturization and modularization of relays, the voltage withstand value of relays is more and more unable to meet the requirements of use. In order to solve the problem of low withstand voltage value of solid state relay, the internal reasons of low withstand voltage value are analyzed from the environmental factors of air humidity and atmospheric pressure. The physical mechanism of optimizing dielectric voltage resistance is described from the perspectives of relay PCB layout, component selection, shell coating and metal particle control.