贮存剖面下考虑镀层厚度的电连接器接触性能退化模型研究

Study on Contact Degradation Model of Elec-trical Connectors Considering Plating Thickness under Storage Profile

针对镀层厚度对电连接器接触件贮存可靠性的影响机制问题,分析了电连接器接触件在贮存剖面下的贮存应力及相应的接触失效机理,并基于Wiener过程建立了在温度应力下考虑镀层厚度的电连接器接触性能退化模型,量化了镀层厚度对接触件性能退化的影响程度;为了检验模型,设计了3组对比试验,对试验结果进行残差分析和正态性检验,结果验证了所建性能退化模型的正确性。运用扫描电镜对不同镀厚样品进行微观分析,验证失效机理分析和建模过程的合理性,证实镀金层厚度对接触性能退化的影响机制,进一步说明镀金层越厚越能有效延缓接触性能退化。为贮存剖面下的电连接器接触可靠性设计以及可靠性评估提供了理论基础。

In view of the influence mechanism of plating thickness on the storage reliability of electrical con-nector contact parts, the storage stress and the corresponding contact failure mechanism of electri-cal connector contact parts under the storage section were analyzed. In addition, a contact perfor-mance degradation model of electrical connectors considering coating thickness under temperature stress is established based on the Wiener process, which is capable of quantifying the influence of coating thickness on the performance degradation of contacts. In order to test the model, three groups of comparative tests were designed, and residual analysis and normality test were conduct-ed on the test results. The results verified the correctness of the proposed performance degradation model. Scanning electron microscopy is leveraged to analyze various thickness samples to testify to the rationality of the failure mechanism analysis and modeling, confirm the influence mechanism of gold plating thickness on contact performance degradation, and further explain that the thicker the gold plating layer, the more effective it can serve as a decelerator to the contact performance deg-radation. It provides a theoretical basis for the contact reliability design and reliability evaluation of the electrical connector under the storage profile.