基于有限元仿真铝基碳化硅磨削参数研究

Research on Grinding Parameters of Aluminum-Based Silicon Carbide Based on Finite Element Simulation

为获得低磨削比能下磨削加工铝基碳化硅(SiCp/Al)的磨削参数,通过有限元仿真研究不同磨削深度、进给速度以及主轴转速对磨削力的影响规律,揭示磨削参数对磨削力大小以及SiC颗粒失效形式的影响,结合实际磨削加工,验证仿真模型的准确性并对材料表面粗糙度进行测量。结果表明:磨削深度对材料的表面粗糙度和磨削力的影响权重最大,降低磨削深度可以显著减小磨削力并降低表面粗糙度。同时,提高主轴转速或降低进给速度,能够在减小磨削力的同时降低表面粗糙度。本文考虑到磨削比能的因素,选用20 μm的磨削深度、70 mm/min的进给速度和3000 r/min的主轴转速(即磨削线速度1.57 m/s)时,磨削比能仅为2721.70 J/mm3,有效降低了磨削比能。

In order to obtain the grinding parameters of aluminum-based silicon carbide (SiCp/Al) grinding with low energy consumption, the influence law of different grinding depths, feed speed and spindle speed on the grinding force was studied by finite element simulation, and the influence of grinding parameters on grinding force and SiC particle failure form was revealed. Verify the accuracy of the simulation model and measure the surface roughness of the material. The results show that grind-ing depth has the greatest influence on surface quality and grinding force, and reducing grinding depth can significantly reduce grinding force and surface roughness. At the same time, increasing the spindle speed or reducing the feed speed can reduce the surface roughness while reducing the grinding force. Considering the factor of energy consumption, when the grinding depth of 20 μm, the feed speed of 70 mm/min and the spindle speed of 3000 r/min (that is, the grinding line speed of 1.57 m/s) are selected, the specific grinding energy is only 2721.70 J/mm3, which effectively re-duces the specific grinding energy.