期刊文献+

分子机器中链状分子热膨胀性质的理论研究 被引量:1

Theoretical Study on Thermal Expansions of Chain Molecules in Molecular Machines
下载PDF
导出
摘要 运用晶格动力学理论推导了分子机器中链状分子中原子间距热膨胀和链状分子热膨胀系数公式,并进行了数值计算。数值计算结果表明,在低温下,当短的链状分子的长度增加时,其原子间距热膨胀快速减小而热膨胀系数快速增加,从而分别快速接近无限长的链状分子的原子间距热膨胀及热膨胀系数,所以链状分子热膨胀性质呈现明显的尺寸效应;随温度升高,链状分子的热膨胀性质的尺寸效应明显减弱,直至在高温极限下消失。低温下必须考虑链状分子热膨胀性质的尺寸效应。 The formulas to describe thermal expansions of interatomic distances and thermal expansion coefficients of chain molecules in molecular machines were derived based on the lattice dynamics, and then the numerical calculations were carried out. The numerical results show that at the low temperature, when the length of short chain molecule increases, the thermal expansion of interatomic distance increases rapidly and the thermal expansion coefficient decreases rapidly, and they approach to the corresponding values of the chain molecule with infinite length rapidly. Therefore, there are size effects in the thermal expansion properties of chain molecules;the size effects of thermal expansion properties of chain molecules are weakened obviously when temperature increase and finally disappeared at high temperature limit. It is concluded that the size effects of thermal expansion properties of chain molecules must be considered at low temperature.
作者 唐婧 黄建平 Jing Tang;Jianping Huang(College of Physics and Information Science, Hunan Normal University, Changsha Hunan;College of Information Science and Technology, Hunan Normal University, Changsha Hunan)
出处 《现代物理》 2017年第6期221-226,共6页 Modern Physics
关键词 链状分子 热膨胀 热膨胀系数 尺寸效应 Chain Molecule Thermal Expansion Lattice Dynamics Perturbation Theory Size Effect
  • 相关文献

参考文献2

二级参考文献22

  • 1HUANG Jian-Ping WU Xue-Zhong LI Sheng-Yi.Thermal Expansion Coefficients of Thin Crystal Films[J].Communications in Theoretical Physics,2005,44(5X):921-924. 被引量:6
  • 2C.H. Pan, J. Micromech. Microeng. 12 (2002) 548.
  • 3C.R. Britton, M.B. Victor, and H.C. John, Proc. SPIE 2642 (1995) 22.
  • 4B. Han and Y. Guo, IEEE Trans. Compon. Packag.Manuf. Technol. A 19 (1996) 240.
  • 5W. Benecke and W. Riethmuller, Proc. IEEE Micro Electro Mechanical System, Salt Lake City (1989) p. 116.
  • 6R.A. Buser, N.F. DeRooij, H. Tischhauser, et al., Sensors Actuators A 31 (1992) 29.
  • 7W-H. Chu, M. Mehran, and L. Robert, J. Micromech.Microeng. 3 (1993) 4.
  • 8H. Guckel, J. Klein, T. Christenson, et al., IEEE Solid State Sensor and Actuator Workshop, Hilton Head Island(1992) p. 73.
  • 9P. Lerch, C.K. Slimane, B. Romanowicz, et al., J. Micromech. Microeng. 6 (1996) 134.
  • 10C.S. Pan and W. Hsu, J. Micromech. Microeng. 7 (1997)7.

共引文献5

同被引文献3

引证文献1

二级引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部