摘要
Diamond particle dispersed copper (Cu) matrix composites were fabricated from the powder mixture composed of diamond, pure-Cu and boron (B) by spark plasma sintering (SPS). The composites were consolidated at 1173 K for 600 s by SPS. The reaction between the diamond particle and the Cu matrix in the composite was not confirmed by SEM observation and X-ray diffraction (XRD) analysis. The relative packing density of the Cu/diamond composites increased with B addition and attained 93.2% - 95.8% at the B content range between 1.8 vol.% and 13.8 vol.%. The thermal conductivity of the diamond-dispersed Cu composite drastically increased with B addition and reached the maximum value of 689 W/mK at 7.2 vol% B. Numerous transgranular fractures of diamond particles were observed on bending fracture surfaces of Cu-B/diamond composites. This indicates strong bonding between the diamond particle and the Cu matrix in the composite. The coefficient of thermal expansion of the composite falls in the upper line of Kerner’s model.
Diamond particle dispersed copper (Cu) matrix composites were fabricated from the powder mixture composed of diamond, pure-Cu and boron (B) by spark plasma sintering (SPS). The composites were consolidated at 1173 K for 600 s by SPS. The reaction between the diamond particle and the Cu matrix in the composite was not confirmed by SEM observation and X-ray diffraction (XRD) analysis. The relative packing density of the Cu/diamond composites increased with B addition and attained 93.2% - 95.8% at the B content range between 1.8 vol.% and 13.8 vol.%. The thermal conductivity of the diamond-dispersed Cu composite drastically increased with B addition and reached the maximum value of 689 W/mK at 7.2 vol% B. Numerous transgranular fractures of diamond particles were observed on bending fracture surfaces of Cu-B/diamond composites. This indicates strong bonding between the diamond particle and the Cu matrix in the composite. The coefficient of thermal expansion of the composite falls in the upper line of Kerner’s model.
作者
Kiyoshi Mizuuchi
Kanryu Inoue
Yasuyuki Agari
Motohiro Tanaka
Takashi Takeuchi
Jun-ichi Tani
Masakazu Kawahara
Yukio Makino
Mikio Ito
Kiyoshi Mizuuchi;Kanryu Inoue;Yasuyuki Agari;Motohiro Tanaka;Takashi Takeuchi;Jun-ichi Tani;Masakazu Kawahara;Yukio Makino;Mikio Ito(Osaka Municipal Technical Research Institute, Osaka, Japan;Materials Science & Engineering, University of Washington, Seattle, USA;Microbright Corporation, Toyohashi, Japan;Kawahara SPS Technical Office, Yokosuka, Japan;Forum MACKIY, Kyoto, Japan;Center for Atomic and Molecular Technologies, Graduate School of Engineering, Osaka University, Suita, Japan)
