摘要
This paper reports thermal conductivity studies carried out on room temperature cure (RT) epoxy resin (LY556 + HY951) containing three different particulate fillers such as Graphite (Gr) a soft material, Silicon carbide (SiC) a hard material and a hybrid graphite & silicon carbide (Gr-SiC). The weight fractions of three different fillers were varied from 10 wt% to 40 wt% in steps of 10%. Increased filler fraction increases the thermal conductivity of epoxy composites for all the three types of fillers. The results show that the synergic effect of hybrid filler (Gr-SiC) improves the thermal conductivity of epoxy composites compared to that of Graphite or Silicon carbide. The improvement in thermal conductivity for the epoxy hybrid composite containing 20% SiC, 20% Gr and 60% epoxy is 136% when compared with neat epoxy. Significant improvement in the thermal conductivity is observed for 40% filled epoxies. The experimental results were compared with analytical models such as Maxwell, Hashin, Hamilton-Crosser, Nielsen, and Cheng-Vachon. The predicted thermal conductivity by analytical models is in agreement with experimental results.
This paper reports thermal conductivity studies carried out on room temperature cure (RT) epoxy resin (LY556 + HY951) containing three different particulate fillers such as Graphite (Gr) a soft material, Silicon carbide (SiC) a hard material and a hybrid graphite & silicon carbide (Gr-SiC). The weight fractions of three different fillers were varied from 10 wt% to 40 wt% in steps of 10%. Increased filler fraction increases the thermal conductivity of epoxy composites for all the three types of fillers. The results show that the synergic effect of hybrid filler (Gr-SiC) improves the thermal conductivity of epoxy composites compared to that of Graphite or Silicon carbide. The improvement in thermal conductivity for the epoxy hybrid composite containing 20% SiC, 20% Gr and 60% epoxy is 136% when compared with neat epoxy. Significant improvement in the thermal conductivity is observed for 40% filled epoxies. The experimental results were compared with analytical models such as Maxwell, Hashin, Hamilton-Crosser, Nielsen, and Cheng-Vachon. The predicted thermal conductivity by analytical models is in agreement with experimental results.
