摘要
Wetting is one of the omnipresent phenomena governed via natural laws. Moreover, surface wettability at non-ambient temperature especially at high temperature (30°C to 90°C) is of great importance in many industrial processes. In this study, Si wafers with various structures were fabricated to investigate wettability at different temperatures. Three shapes with micro-pillar structured surfaces were designed and fabricated. Pillar-structured surfaces were fabricated by photolithography and ICP etching. The temperature-dependent wettability of single-phase regime droplets was characterized using contact angle measurements. The wetting behavior of a water droplet was observed.
Wetting is one of the omnipresent phenomena governed via natural laws. Moreover, surface wettability at non-ambient temperature especially at high temperature (30°C to 90°C) is of great importance in many industrial processes. In this study, Si wafers with various structures were fabricated to investigate wettability at different temperatures. Three shapes with micro-pillar structured surfaces were designed and fabricated. Pillar-structured surfaces were fabricated by photolithography and ICP etching. The temperature-dependent wettability of single-phase regime droplets was characterized using contact angle measurements. The wetting behavior of a water droplet was observed.
