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Determination of Some Physical and Mechanical Properties of the Wood-Based Panels Modified by Acrylic Textile Fiber

Determination of Some Physical and Mechanical Properties of the Wood-Based Panels Modified by Acrylic Textile Fiber
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摘要 In this research, a series of wood-based panels were produced by using wood chips [beech (Fagus Sylvatica L.) and Scotch pine (Pinus sylvestris L.)] as wastes of wood-working workshops and acrylic fibers as wastes of textiles factory. Four kinds of different panels (Eltapan I, II, III and IV) were obtained by mixing these components in different composition (0%, 25% and 50%). Some physical and mechanical properties of the samples taken from these panels were determined in accordance with ASTM D1037-12 and ASTM-C 1113. The values were compared to properties of industrially produced chipboard. As a result, the textile fibers used as additive material reduced density, thermal conductivity and bending resistance of wood panel and increased dimensional stability of wood panel. In this research, a series of wood-based panels were produced by using wood chips [beech (Fagus Sylvatica L.) and Scotch pine (Pinus sylvestris L.)] as wastes of wood-working workshops and acrylic fibers as wastes of textiles factory. Four kinds of different panels (Eltapan I, II, III and IV) were obtained by mixing these components in different composition (0%, 25% and 50%). Some physical and mechanical properties of the samples taken from these panels were determined in accordance with ASTM D1037-12 and ASTM-C 1113. The values were compared to properties of industrially produced chipboard. As a result, the textile fibers used as additive material reduced density, thermal conductivity and bending resistance of wood panel and increased dimensional stability of wood panel.
出处 《Materials Sciences and Applications》 2015年第6期519-526,共8页 材料科学与应用期刊(英文)
关键词 Modification ACRYLIC Fiber WOOD CHIPS WOOD Based Composites Density Thermal CONDUCTIVITY DIMENSIONAL Stability BENDING Strength Modification Acrylic Fiber Wood Chips Wood Based Composites Density Thermal Conductivity Dimensional Stability Bending Strength
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