摘要
A new flexible substrate for flexible electronics has been developed. The developed substrate consists of an ultra thin glass and TAC (triacethyl cellulose) film. An ultra thin glass and TAC film were joined with TEOS-DAC (TEOS: tetraethyl orthosilicate, DAC: diacethy cellulose) adhesive resin synthesized by sol-gel method by means of thermo-compression bonding. This substrate has high transparency in visible-light region (90%), high flexibility (torsion strength and bending strength) and high gas barrier characteristics due to an ultra thin glass. The newly-developed substrate is superior to the substrates fabricated with commercially available adhesive resin in the same way in characteristics of heat resistance, transparency and flexibility.
A new flexible substrate for flexible electronics has been developed. The developed substrate consists of an ultra thin glass and TAC (triacethyl cellulose) film. An ultra thin glass and TAC film were joined with TEOS-DAC (TEOS: tetraethyl orthosilicate, DAC: diacethy cellulose) adhesive resin synthesized by sol-gel method by means of thermo-compression bonding. This substrate has high transparency in visible-light region (90%), high flexibility (torsion strength and bending strength) and high gas barrier characteristics due to an ultra thin glass. The newly-developed substrate is superior to the substrates fabricated with commercially available adhesive resin in the same way in characteristics of heat resistance, transparency and flexibility.
