三维集成电路(three dimensional integrated circuit,3DIC)和片上网络(network on chip,NoC)是集成电路设计发展的两个趋势.将两者结合的三维片上网络(three dimensional networks on chip,3DNoC)是当前研究的热点之一.针对现有3DNoC...三维集成电路(three dimensional integrated circuit,3DIC)和片上网络(network on chip,NoC)是集成电路设计发展的两个趋势.将两者结合的三维片上网络(three dimensional networks on chip,3DNoC)是当前研究的热点之一.针对现有3DNoC的研究没有充分关注硅片内与硅片间的异构通信特征.提出了面向通信特征的硅片间单跳步(single hop inter dies,SHID)体系结构,该结构采用异构拓扑结构和硅片间扩展路由器(express inter dies router,EIDR).通过实验数据的分析表明,与3DMesh和NoC-Bus这两种已有的3DNoC结构相比,SHID结构有以下特点:1)延迟较低,4层堆叠时比3D-Mesh低15.1%,比NoC-Bus低11.5%;2)功耗与NoC-Bus相当,比3D-Mesh低10%左右;3)吞吐率随堆叠层数增加下降缓慢,16层堆叠时吞吐率比3D-Mesh高66.98%,比NoC-Bus高314.49%.SHID体系结构同时具备性能和可扩展性的优势,是未来3DNoC体系结构良好设计选择.展开更多
Integrated with an improved architectural vulnerability factor （AVF） computing model, a new architectural level soft error reliability analysis framework, SS-SERA （soft error reliability analysis based on SimpleSca...Integrated with an improved architectural vulnerability factor （AVF） computing model, a new architectural level soft error reliability analysis framework, SS-SERA （soft error reliability analysis based on SimpleScalar）, was developed. SS-SERA was used to estimate the AVFs for various on-chip structures accurately. Experimental results show that the AVFs of issue queue （IQ）, register update units （RUU）, load store queue （LSQ） and functional unit （FU） are 38.11%, 22.17%, 23.05% and 24.43%, respectively. For address-based structures, i.e., levell data cache （LID）, DTLB, level2 unified cache （L2U）, levell instruction cache （LII） and ITLB, AVFs of their data arrays are 22.86%, 27.57%, 14.80%, 8.25% and 12.58%, lower than their tag arrays＇ AVFs which are 30.01%, 28.89%, 17.69%, 10.26% and 13.84%, respectively. Furthermore, using the AVF values obtained with SS-SERA, a qualitative and quantitative analysis of the AVF variation and predictability was performed for the structures studied. Experimental results show that the AVF exhibits significant variations across different structures and workloads, and is influenced by multiple microarchitectural metrics and their interactions. Besides, AVFs of SPEC2K floating point programs exhibit better predictability than SPEC2K integer programs.展开更多
文摘三维集成电路(three dimensional integrated circuit,3DIC)和片上网络(network on chip,NoC)是集成电路设计发展的两个趋势.将两者结合的三维片上网络(three dimensional networks on chip,3DNoC)是当前研究的热点之一.针对现有3DNoC的研究没有充分关注硅片内与硅片间的异构通信特征.提出了面向通信特征的硅片间单跳步(single hop inter dies,SHID)体系结构,该结构采用异构拓扑结构和硅片间扩展路由器(express inter dies router,EIDR).通过实验数据的分析表明,与3DMesh和NoC-Bus这两种已有的3DNoC结构相比,SHID结构有以下特点:1)延迟较低,4层堆叠时比3D-Mesh低15.1%,比NoC-Bus低11.5%;2)功耗与NoC-Bus相当,比3D-Mesh低10%左右;3)吞吐率随堆叠层数增加下降缓慢,16层堆叠时吞吐率比3D-Mesh高66.98%,比NoC-Bus高314.49%.SHID体系结构同时具备性能和可扩展性的优势,是未来3DNoC体系结构良好设计选择.
基金Projects(60970036,60873016,61170045)supported by the National Natural Science Foundation of ChinaProjects(2009AA01Z102,2009AA01Z124)supported by the National High Technology Development Program of China
文摘Integrated with an improved architectural vulnerability factor （AVF） computing model, a new architectural level soft error reliability analysis framework, SS-SERA （soft error reliability analysis based on SimpleScalar）, was developed. SS-SERA was used to estimate the AVFs for various on-chip structures accurately. Experimental results show that the AVFs of issue queue （IQ）, register update units （RUU）, load store queue （LSQ） and functional unit （FU） are 38.11%, 22.17%, 23.05% and 24.43%, respectively. For address-based structures, i.e., levell data cache （LID）, DTLB, level2 unified cache （L2U）, levell instruction cache （LII） and ITLB, AVFs of their data arrays are 22.86%, 27.57%, 14.80%, 8.25% and 12.58%, lower than their tag arrays＇ AVFs which are 30.01%, 28.89%, 17.69%, 10.26% and 13.84%, respectively. Furthermore, using the AVF values obtained with SS-SERA, a qualitative and quantitative analysis of the AVF variation and predictability was performed for the structures studied. Experimental results show that the AVF exhibits significant variations across different structures and workloads, and is influenced by multiple microarchitectural metrics and their interactions. Besides, AVFs of SPEC2K floating point programs exhibit better predictability than SPEC2K integer programs.
