In integrated circuits, the defects associated with photolithography are assumed to be in the shape of circular discs in order to perform the estimation of yield and fault analysis. However,real defects exhibit a grea...In integrated circuits, the defects associated with photolithography are assumed to be in the shape of circular discs in order to perform the estimation of yield and fault analysis. However,real defects exhibit a great variety of shapes. In this paper,a novel yield model is presented and the critical area model of short circuit is correspondingly provided. In comparison with the circular model corrently available, the new model takes the similarity shape to an original defect, the two-dimensional distributional characteristic of defects, the feature of a layout routing and the character of yield estimation into account. As for the aspect of prediction of yield, the experimental results show that the new model may predict the yield caused by real defects more accurately than the circular model does. It is significant that the yield is accurately estimated and improved using the proposed model.展开更多
inductive fault analysis is a technique for enumerating likely bridges that is limited by the weighted critical area computation. Based on the rectangle model of a real defect and mathematical morphology, an efficient...inductive fault analysis is a technique for enumerating likely bridges that is limited by the weighted critical area computation. Based on the rectangle model of a real defect and mathematical morphology, an efficient algorithm is presented to compute the weighted critical area of a layout. The algorithm avoids the need to determine which rectangles belong to a net and the merging of the critical area corresponding to a net pair. Experimental resuits showing the algorithm＇s performance are presented.展开更多
文摘In integrated circuits, the defects associated with photolithography are assumed to be in the shape of circular discs in order to perform the estimation of yield and fault analysis. However,real defects exhibit a great variety of shapes. In this paper,a novel yield model is presented and the critical area model of short circuit is correspondingly provided. In comparison with the circular model corrently available, the new model takes the similarity shape to an original defect, the two-dimensional distributional characteristic of defects, the feature of a layout routing and the character of yield estimation into account. As for the aspect of prediction of yield, the experimental results show that the new model may predict the yield caused by real defects more accurately than the circular model does. It is significant that the yield is accurately estimated and improved using the proposed model.
文摘inductive fault analysis is a technique for enumerating likely bridges that is limited by the weighted critical area computation. Based on the rectangle model of a real defect and mathematical morphology, an efficient algorithm is presented to compute the weighted critical area of a layout. The algorithm avoids the need to determine which rectangles belong to a net and the merging of the critical area corresponding to a net pair. Experimental resuits showing the algorithm＇s performance are presented.
