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Co-Si界面低温(≤450℃)相变的电子显微术研究 被引量:2
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作者 张灶利 肖治纲 杜国维 《Journal of Semiconductors》 EI CAS CSCD 北大核心 1995年第3期195-200,共6页
本文用透射电镜的衍射方法,研究Co薄膜和衬底之间的界面的低温相变.用小角解理方法制备的室温原始样品经分析发现:室温下薄膜没有相变.在250℃,Co2Si为最先形成的硅化物;250℃30分钟处理后,产生大量的CoSi相... 本文用透射电镜的衍射方法,研究Co薄膜和衬底之间的界面的低温相变.用小角解理方法制备的室温原始样品经分析发现:室温下薄膜没有相变.在250℃,Co2Si为最先形成的硅化物;250℃30分钟处理后,产生大量的CoSi相.450℃1小时处理形成单相的CoSi.从本实验结果与前人研究结果对比发现:观察手段、样品制备方法、镀膜方法等因素会影响低温相变结果. 展开更多
关键词 硅化物薄膜 相变 电子显微术 Co-Si界面 低温
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Co/Si和Co/SiO_2界面反应的观察 被引量:1
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作者 张灶利 翟启华 +2 位作者 纪箴 肖治纲 杜国维 《Journal of Semiconductors》 EI CAS CSCD 北大核心 1996年第4期265-268,共4页
本文用X射线衍射(XRD)和高分辨电镜研究Co薄膜在氩气气氛或真空条件下热处理时Co/Si和Co/SiO2体系的界面反应.结果表明:在氩气氛下450℃处理时,Co薄膜均发生氧化,在Co/Si界面同时有硅化物形成,而在... 本文用X射线衍射(XRD)和高分辨电镜研究Co薄膜在氩气气氛或真空条件下热处理时Co/Si和Co/SiO2体系的界面反应.结果表明:在氩气氛下450℃处理时,Co薄膜均发生氧化,在Co/Si界面同时有硅化物形成,而在Co/SiO2界面,无硅化物产生.在真空条件下500℃处理1小时,薄膜没有氧化,在Co/Si界面形成完整的CoSi2外延层. 展开更多
关键词 Co/Si Co/SiO2 界面反应 硅化物薄膜
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Optoelectronic switching of nanowire-based hybrid organic/oxide/semiconductor field-effect transistors 被引量:1
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作者 Eunhye Baek Sebastian Pregl +6 位作者 Mehrdad Shaygan Lotta Romhildt Walter M. Weber Thomas Mikolajick DmitryA. Ryndyk Larysa Baraban Gianaurelio Cuniberti 《Nano Research》 SCIE EI CAS CSCD 2015年第4期1229-1240,共12页
A novel photosensitive hybrid field-effect transistor (FET) which consists of a multiple-shell of organic porphyrin film/oxide/silicon nanowires is presented. Due to the oxide shell around the nanowires, photoswitch... A novel photosensitive hybrid field-effect transistor (FET) which consists of a multiple-shell of organic porphyrin film/oxide/silicon nanowires is presented. Due to the oxide shell around the nanowires, photoswitching of the current in the hybrid nanodevices is guided by the electric field effect, induced by charge redistribution within the organic film. This principle is an alternative to a photoinduced electron injection, valid for devices relying on direct junctions between organic molecules and metals or semiconductors. The switching dynamics of the hybrid nanodevices upon violet light illumination is investigated and a strong dependence on the thickness of the porphyrin film wrapping the nanowires is found. Furthermore, the thickness of the organic films is found to be a crucial parameter also for the switching efficiency of the nanowire FET, represented by the ratio of currents under light illumination (ON) and in dark conditions (OFF). We suggest a simple model of porphyrin film charging to explain the optoelectronic behavior of nanowire FETs mediated by organic film/oxide/semiconductor junctions. 展开更多
关键词 hybrid nanoelectronics silicon nanowirefield-effect transistors porphyrin optoelectronic switching organic/oxide/semiconductor junctions
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Stress control of silicon nitride films deposited by plasma enhanced chemical vapor deposition
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作者 李东玲 冯小飞 +2 位作者 温志渝 尚正国 佘引 《Optoelectronics Letters》 EI 2016年第4期285-289,共5页
Stress controllable silicon nitride(Si Nx) films deposited by plasma enhanced chemical vapor deposition(PECVD) are reported. Low stress Si Nx films were deposited in both high frequency(HF) mode and dual frequency(HF/... Stress controllable silicon nitride(Si Nx) films deposited by plasma enhanced chemical vapor deposition(PECVD) are reported. Low stress Si Nx films were deposited in both high frequency(HF) mode and dual frequency(HF/LF) mode. By optimizing process parameters, stress free(-0.27 MPa) Si Nx films were obtained with the deposition rate of 45.5 nm/min and the refractive index of 2.06. Furthermore, at HF/LF mode, the stress is significantly influenced by LF ratio and LF power, and can be controlled to be 10 MPa with the LF ratio of 17% and LF power of 150 W. However, LF power has a little effect on the deposition rate due to the interaction between HF power and LF power. The deposited Si Nx films have good mechanical and optical properties, low deposition temperature and controllable stress, and can be widely used in integrated circuit(IC), micro-electro-mechanical systems(MEMS) and bio-MEMS. 展开更多
关键词 DEPOSITION Deposition rates Integrated circuits MEMS Nitrides Optical properties Plasma CVD Refractive index Silicon nitride Stresses Vapor deposition
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