介绍Gbps无线通信试验系统中高速串行数据接口的设计与实现。按照Gbps无线通信试验系统对高速串行数据的传输要求,数据传输速率超过1 Gb/s,在基于Xilinx IP core技术上对单板上的FPGA进行逻辑设计,实现了符合系统要求的高速串行数据接...介绍Gbps无线通信试验系统中高速串行数据接口的设计与实现。按照Gbps无线通信试验系统对高速串行数据的传输要求,数据传输速率超过1 Gb/s,在基于Xilinx IP core技术上对单板上的FPGA进行逻辑设计,实现了符合系统要求的高速串行数据接口。在系统实际调试中,通过ATCA机箱背板进行数据传输,获得了高达Gbps的数据吞吐速率且传输误码率低于10-14。展开更多
A transimpedance amplifier based on InGaP/GaAs HBTs,which is applicable for 10Gbps bit rate,is developed and realized.Compact chip layout guarantees good flat gain,linear phase,and small group delay time variation.Mea...A transimpedance amplifier based on InGaP/GaAs HBTs,which is applicable for 10Gbps bit rate,is developed and realized.Compact chip layout guarantees good flat gain,linear phase,and small group delay time variation.Measured transimpedance gain is 40 dB·Ω and 3dB bandwidth is 10GHz.展开更多
ZTF Corporation achieved a wireless data transmission rate of 1 Gbps in a live demonstration at Mobile Asia Expo in Shanghai. This represents a global breakthrough in the dew^lopment of next-generation LTE-A networks.
文摘介绍Gbps无线通信试验系统中高速串行数据接口的设计与实现。按照Gbps无线通信试验系统对高速串行数据的传输要求,数据传输速率超过1 Gb/s,在基于Xilinx IP core技术上对单板上的FPGA进行逻辑设计,实现了符合系统要求的高速串行数据接口。在系统实际调试中,通过ATCA机箱背板进行数据传输,获得了高达Gbps的数据吞吐速率且传输误码率低于10-14。
文摘A transimpedance amplifier based on InGaP/GaAs HBTs,which is applicable for 10Gbps bit rate,is developed and realized.Compact chip layout guarantees good flat gain,linear phase,and small group delay time variation.Measured transimpedance gain is 40 dB·Ω and 3dB bandwidth is 10GHz.
文摘ZTF Corporation achieved a wireless data transmission rate of 1 Gbps in a live demonstration at Mobile Asia Expo in Shanghai. This represents a global breakthrough in the dew^lopment of next-generation LTE-A networks.