高导热热解石墨(Highly Thermal Conductivity Pyrolytic Graphite, HTPG)是一种导热系数约为1600 W/(m·K)的新型材料。可以利用HTPG的这种特性来开发高导热复合材料,用于需要有效热管理的设备。本文采用钎焊方法将HTPG包覆在铝中...高导热热解石墨(Highly Thermal Conductivity Pyrolytic Graphite, HTPG)是一种导热系数约为1600 W/(m·K)的新型材料。可以利用HTPG的这种特性来开发高导热复合材料,用于需要有效热管理的设备。本文采用钎焊方法将HTPG包覆在铝中,并在5 W,10 W,15 W三种不同加热功率下对复合基板与纯铝件的热性能进行了对比。结果表明,高导热热解石墨–铝复合基板的热性能明显优于纯铝件,热扩散性能提高了约4倍。High Thermal Conductivity Pyrolytic Graphite (HTPG) is a new material with a thermal conductivity of about 1600 W/(m·K). This characteristic of HTPG can be used to develop high thermal conductivity composites for equipment requiring effective thermal management. In this paper, HTPG has been encapsulated in aluminum by brazing, and the thermal properties of composite substrate and pure aluminum were compared under three different heating power of 5 W, 10 W and 15 W. The results show that the thermal performance of high thermal conductivity pyrolytic graphite-aluminum composite substrate is obviously better than that of pure aluminum, and the thermal diffusivity is improved by about 4 times.展开更多
本文综述了大功率LED散热技术的发展现状与挑战,特别是针对高导热石墨/铝复合散热基板的研究进展。随着LED功率密度的提高,散热问题成为制约其性能的关键因素。高导热热解石墨(PG)因其卓越的导热性能被视为理想的热管理材料,但其低强度...本文综述了大功率LED散热技术的发展现状与挑战,特别是针对高导热石墨/铝复合散热基板的研究进展。随着LED功率密度的提高,散热问题成为制约其性能的关键因素。高导热热解石墨(PG)因其卓越的导热性能被视为理想的热管理材料,但其低强度和难焊接性限制了其广泛应用。本文分析了PG与金属复合材料的制备方法及其在大功率LED散热中的应用潜力,并探讨了高发射率辐射散热涂层作为解决密闭环境散热问题的新思路。此外,还介绍了微弧氧化技术在构建多功能导热/辐射散热涂层方面的前景,为解决高功率器件的散热难题提供了新方向。This paper reviews the current status and challenges of LED thermal management, particularly focusing on the research progress of high thermal conductivity graphite/aluminum composite thermal management substrates. As the power density of LEDs increases, thermal management becomes a critical factor limiting their performance. High thermal conductivity pyrolytic graphite (PG) is considered an ideal thermal management material due to its excellent thermal conductivity, but its low strength and difficulty in welding limit its widespread application. This paper analyzes the preparation methods of PG-metal composite materials and their potential application in LED thermal management, and discusses the new idea of using high emissivity radiation heat dissipation coating to solve the heat dissipation problem in enclosed environments. In addition, it introduces the prospect of microarc oxidation technology in building multifunctional thermal/radiation heat dissipation coatings, providing a new direction for solving the heat dissipation problem of high-power devices.展开更多
文摘高导热热解石墨(Highly Thermal Conductivity Pyrolytic Graphite, HTPG)是一种导热系数约为1600 W/(m·K)的新型材料。可以利用HTPG的这种特性来开发高导热复合材料,用于需要有效热管理的设备。本文采用钎焊方法将HTPG包覆在铝中,并在5 W,10 W,15 W三种不同加热功率下对复合基板与纯铝件的热性能进行了对比。结果表明,高导热热解石墨–铝复合基板的热性能明显优于纯铝件,热扩散性能提高了约4倍。High Thermal Conductivity Pyrolytic Graphite (HTPG) is a new material with a thermal conductivity of about 1600 W/(m·K). This characteristic of HTPG can be used to develop high thermal conductivity composites for equipment requiring effective thermal management. In this paper, HTPG has been encapsulated in aluminum by brazing, and the thermal properties of composite substrate and pure aluminum were compared under three different heating power of 5 W, 10 W and 15 W. The results show that the thermal performance of high thermal conductivity pyrolytic graphite-aluminum composite substrate is obviously better than that of pure aluminum, and the thermal diffusivity is improved by about 4 times.
文摘本文综述了大功率LED散热技术的发展现状与挑战,特别是针对高导热石墨/铝复合散热基板的研究进展。随着LED功率密度的提高,散热问题成为制约其性能的关键因素。高导热热解石墨(PG)因其卓越的导热性能被视为理想的热管理材料,但其低强度和难焊接性限制了其广泛应用。本文分析了PG与金属复合材料的制备方法及其在大功率LED散热中的应用潜力,并探讨了高发射率辐射散热涂层作为解决密闭环境散热问题的新思路。此外,还介绍了微弧氧化技术在构建多功能导热/辐射散热涂层方面的前景,为解决高功率器件的散热难题提供了新方向。This paper reviews the current status and challenges of LED thermal management, particularly focusing on the research progress of high thermal conductivity graphite/aluminum composite thermal management substrates. As the power density of LEDs increases, thermal management becomes a critical factor limiting their performance. High thermal conductivity pyrolytic graphite (PG) is considered an ideal thermal management material due to its excellent thermal conductivity, but its low strength and difficulty in welding limit its widespread application. This paper analyzes the preparation methods of PG-metal composite materials and their potential application in LED thermal management, and discusses the new idea of using high emissivity radiation heat dissipation coating to solve the heat dissipation problem in enclosed environments. In addition, it introduces the prospect of microarc oxidation technology in building multifunctional thermal/radiation heat dissipation coatings, providing a new direction for solving the heat dissipation problem of high-power devices.
