Forced convection cooling of fins on a high-temperature wall has been used to cool high-power electronic devices. We numerically calculated and experimentally measured the forced convection heat transfer coefficient a...Forced convection cooling of fins on a high-temperature wall has been used to cool high-power electronic devices. We numerically calculated and experimentally measured the forced convection heat transfer coefficient and pressure drop of a diamond-shaped fin-array with water flow in this study, which had been reported to have a self-induced flip-flop flow phenomenon. Although the flip-flop flow phenomenon occurred in calculations, it was not observed in experiments. The heat transfer and pressure drop of the diamond-shaped fin-array could be estimated with equations for turbulent flow in tubes.展开更多
文摘Forced convection cooling of fins on a high-temperature wall has been used to cool high-power electronic devices. We numerically calculated and experimentally measured the forced convection heat transfer coefficient and pressure drop of a diamond-shaped fin-array with water flow in this study, which had been reported to have a self-induced flip-flop flow phenomenon. Although the flip-flop flow phenomenon occurred in calculations, it was not observed in experiments. The heat transfer and pressure drop of the diamond-shaped fin-array could be estimated with equations for turbulent flow in tubes.
