Polyimide Humidity Integrated Sensor Fabricated Using the MEMS Process

This paper reports on the fabrication and sensing characteristics of Polyimide-based humidity sensor,based on that,a new integrated circuit of humidity measurement has been designed.It is a novel capacitive-type systems on a chip structure using the MEMS process.The results show that the new sensor presents sensing characteristics over a humidity range from 10%～70% RH at 20℃,and the sensor is able to fabricated together with ICs technology.The result shows that integration of humidity sensor with integrated circuit of humidity measurement is considerably easier when they are built in sensing groove.The appeal of a new structure like this brings the possibility of applications that would require the flexibility of simple screen printing.

Temperature characteristics research of SOI pressure sensor based on asymmetric base region transistor

Based on the asymmetric base region transistor, a pressure sensor with temperature compensation circuit is proposed in this paper. The pressure sensitive structure of the proposed sensor is constructed by a C-type silicon cup and a Wheatstone bridge with four piezoresistors（R_1, R_2, R_3 and R_4/locating on the edge of a square silicon membrane. The chip was designed and fabricated on a silicon on insulator（SOI） wafer by micro electromechanical system（MEMS） technology and bipolar transistor process. When the supply voltage is 5.0 V, the corresponding temperature coefficient of the sensitivity（TCS） for the sensor before and after temperature compensation are -1862 and -1067 ppm/℃, respectively. Through varying the ratio of the base region resistances r_1 and r_2, the TCS for the sensor with the compensation circuit is -127 ppm/℃. It is possible to use this compensation circuit to improve the temperature characteristics of the pressure sensor.