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Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film
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作者 Huayang DANG dongpei qi +2 位作者 Minghao ZHAO Cuiying FAN C.S.LU 《Applied Mathematics and Mechanics(English Edition)》 SCIE EI CSCD 2023年第5期841-856,共16页
In this paper,we investigate the interfacial behavior of a thin one-dimensional(1D)hexagonal quasicrystal(QC)film bonded on an elastic substrate subjected to a mismatch strain due to thermal variation.The contact inte... In this paper,we investigate the interfacial behavior of a thin one-dimensional(1D)hexagonal quasicrystal(QC)film bonded on an elastic substrate subjected to a mismatch strain due to thermal variation.The contact interface is assumed to be nonslipping,with both perfectly bonded and debonded boundary conditions.The Fourier transform technique is adopted to establish the integral equations in terms of interfacial shear stress,which are solved as a linear algebraic system by approximating the unknown phonon interfacial shear stress via the series expansion of the Chebyshev polynomials.The expressions are explicitly obtained for the phonon interfacial shear stress,internal normal stress,and stress intensity factors(SIFs).Finally,based on numerical calculations,we briefly discuss the effects of the material mismatch,the geometry of the QC film,and the debonded length and location on stresses and SIFs. 展开更多
关键词 one-dimensional(1D)hexagonal quasicrystal(QC)film stress intensity factor(SIF) thermal variation Chebyshev polynomial interfacial behavior
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