Electrospinning-hot pressing technique for the fabrication of thermal and electrical storage membranes and its applications

The combination of electrospinning and hot pressing,namely the electrospinning-hot pressing technique(EHPT),is an efficient and convenient method for preparing nanofibrous composite materials with good energy storage performance.The emerging composite membrane prepared by EHPT,which exhibits the advantages of large surface area,controllable morphology,and compact structure,has attracted immense attention.In this paper,the conduction mechanism of composite membranes in thermal and electrical energy storage and the performance enhancement method based on the fabrication process of EHPT are systematically discussed.Moreover,the state-of-the-art applications of composite membranes in these two fields are introduced.In particular,in the field of thermal energy storage,EHPT-prepared membranes have longitudinal and transverse nanofibers,which generate unique thermal conductivity pathways;also,these nanofibers offer enough space for the filling of functional materials.Moreover,EHPT-prepared membranes are beneficial in thermal management systems,building energy conservation,and electrical energy storage,e.g.,improving the electrochemical properties of the separators as well as their mechanical and thermal stability.The application of electrospinning-hot pressing membranes on capacitors,lithium-ion batteries(LIBs),fuel cells,sodium-ion batteries(SIBs),and hydrogen bromine flow batteries(HBFBs)still requires examination.In the future,EHPT is expected to make the field more exciting through its own technological breakthroughs or be combined with other technologies to produce intelligent materials.

A terahertz on-chip InP-based power combiner designed using coupled-grounded coplanar waveguide lines

This article presents the design and performance of a terahertz on-chip coupled-grounded coplanar waveguide(GCPW)power combiner using a 50μm-thick InP process.The proposed topology uses two coupled-GCPW lines at the end of the input port to substitute two quarter-wavelength GCPW lines,which is different from the conventional Wilkinson power combiner and can availably minimize the coverage area.According to the results obtained,for the frequency range of 210-250 GHz,the insertion losses for each two-way combiner and four-way combiner were lower than 1.05 dB and1.35 dB,respectively,and the in-band return losses were better than 11 dB.Moreover,the proposed on-chip GCPW-based combiners achieved a compromise in low-loss,broadband,and small-size,which can find wide applications in terahertz bands,such as power amplifiers and signal distribution networks.

A 16-QAM 45-Gbps 7-m Wireless Link Using InP HEMT LNA and GaAs SBD Mixers at 220-GHz-Band

This paper presents a 220-GHz-band 7-m wireless link with a 45-Gbps transmission data rate by using 16 quadrature amplitude modulation(16-QAM).Super-heterodyne transceiver modules are developed for transmission and reception of the modulated signals,which consist of a Schottky barrier diodes(SBD)based sub-harmonic mixer(SHM),an InP HEMT low noise amplifier(LNA),a waveguide band-pass filter(BPF),and a 108-GHz local oscillator(LO)multiplier chain.The transmitter features a peak transmit power of 1.41 dBm,and the IF frequency varies from 5 GHz to 20 GHz.Besides,the receiver features a conversion gain of 9.3 dB in average and a noise temperature of 3052.8 K.The measured results indicate that the transceiver modules enable data transmission of a 45-Gbps 16-QAM signal with Signal-Noise-Ratio(SNR)from 11.59 dB to 15.36 dB in a 7-m line-of-sight channel.