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Enhanced interface properties of diamond MOSFETs with Al2O3 gate dielectric deposited via ALD at a high temperature 被引量:1
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作者 Yu Fu Rui-Min Xu +7 位作者 Xin-Xin Yu Jian-Jun Zhou yue-chan kong Tang-Sheng Chen Bo Yan Yan-Rong Li Zheng-Qiang Ma Yue-Hang Xu 《Chinese Physics B》 SCIE EI CAS CSCD 2021年第5期661-666,共6页
The interface state of hydrogen-terminated(C-H)diamond metal-oxide-semiconductor field-effect transistor(MOSFET)is critical for device performance.In this paper,we investigate the fixed charges and interface trap stat... The interface state of hydrogen-terminated(C-H)diamond metal-oxide-semiconductor field-effect transistor(MOSFET)is critical for device performance.In this paper,we investigate the fixed charges and interface trap states in C-H diamond MOSFETs by using different gate dielectric processes.The devices use Al_(2)O_(3) as gate dielectrics that are deposited via atomic layer deposition(ALD)at 80℃and 300℃,respectively,and their C-V and I-V characteristics are comparatively investigated.Mott-Schottky plots(1/C2-VG)suggest that positive and negative fixed charges with low density of about 10^(11)cm^(-2) are located in the 80-℃-and 300-℃deposition Al2O3 films,respectively.The analyses of direct current(DC)/pulsed I-V and frequency-dependent conductance show that the shallow interface traps(0.46 eV-0.52 eV and 0.53 eV-0.56 eV above the valence band of diamond for the 80-℃and 300-℃deposition conditions,respectively)with distinct density(7.8×10^(13)eV^(-1)·cm^(-2)-8.5×10^(13)eV^(-1)·cm^(-2) and 2.2×10^(13)eV^(-1)·cm^(-2)-5.1×10^(13)eV^(-1)·cm^(-2) for the 80-℃-and 300-℃-deposition conditions,respectively)are present at the Al2O3/C-H diamond interface.Dynamic pulsed I-V and capacitance dispersion results indicate that the ALD Al_(2)O_(3) technique with 300-℃deposition temperature has higher stability for C-H diamond MOSFETs. 展开更多
关键词 diamond MOSFET ALD temperature pulsed I-V interface trap conductance method
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Influence of fin architectures on linearity characteristics of AlGaN/GaNFinFETs
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作者 Ting-Ting Liu Kai Zhang +4 位作者 Guang-Run Zhu Jian-Jun Zhou yue-chan kong Xin-Xin Yu Tang-Sheng Chen 《Chinese Physics B》 SCIE EI CAS CSCD 2018年第4期432-436,共5页
We investigate the influence of fin architecture on linearity characteristics of AlGaN/GaNFinFET.It is found that the Fin FET with scaled fin dimensions exhibits much flatter Gm characteristics than the one with long ... We investigate the influence of fin architecture on linearity characteristics of AlGaN/GaNFinFET.It is found that the Fin FET with scaled fin dimensions exhibits much flatter Gm characteristics than the one with long fins as well as planar HEMT.According to the comparative study,we provide direct proof that source resistance rather than tri-gate structure itself dominates the Gm behavior.Furthermore,power measurements show that the optimized FinFET is capable of delivering a much higher output power density along with significant improvement in linearity characteristics than conventional planar HEMT.This study also highlights the importance of fin design in GaN-based FinFET for microwave power application,especially high-linearity applications. 展开更多
关键词 AlGaN/GaNFinFETs output power density linearity characteristics
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