A Novel Multiple DBC-staked units Package to Parallel More Chips for SiC Power Module

Silicon carbide(SiC) power modules play an essential role in the electric vehicle drive system. To improve their performance, reduce their size, and increase production efficiency, this paper proposes a multiple staked direct bonded copper(DBC) unit based power module packaging method to parallel more chips. This method utilizes mutual inductance cancellation effect to reduce parasitic inductance. Because the conduction area in the new package is doubled, the overall area of power module can be reduced. Entire power module is divided into smaller units to enhance manufacture yield, and improve design freedom. This paper provides a detailed design, analysis and fabrication procedure for the proposed package structure. Additionally, this paper offers several feasible solutions for the connection between power terminals and DBC untis. With the structure, 18dies were paralleled for each phase-leg in a econodual size power module. Both simulation and double pulse test results demonstrate that, compared to conventional layouts, the proposed package method has 74.8% smaller parasitic inductance and 34.9% lower footprint.

Review of Thermal Design of SiC Power Module for Motor Drive in Electrical Vehicle Application

In the current vehicle electric propulsion systems,the thermal design of power modules heavily relies on empirical knowledge,making it challenging to effectively optimize irregularly arranged Pinfin structures,thereby limiting their performance.This paper aims to review the underlying mechanisms of how irregularly arranged Pinfins influence the thermal characteristics of power modules and introduce collaborative thermal design with DC bus capacitor and motor.Literature considers chip size,placement,coolant flow direction with the goal of reducing thermal resistance of power modules,minimizing chip junction temperature differentials,and optimizing Pinfin layouts.In the first step,algorithms should efficiently generating numerous unique irregular Pinfin layouts to enhance optimization quality.The second step is to efficiently evaluate Pinfin layouts.Simulation accuracy and speed should be ensured to improve computational efficiency.Finally,to improve overall heat dissipation effectiveness,papers establish models for capacitors,motors,to aid collaborative Pinfin optimization.These research outcomes will provide essential support for future developments in high power density motor drive for vehicles.

Review of Hybrid Packaging Methods for Power Modules

The hybrid structure of a power-module package is summarized and classified.Basic and extended planar wire-bond designs are analyzed and compared with regular wire-bond modules and planar modules,respectively.The automatic layout method can improve the electrical and thermal performance of hybrid structures.A state-of-the-art hybrid structure is introduced,and suggestions for alleviating the current and temperature imbalances for future designs are provided.

Review of Si IGBT and SiC MOSFET Based on Hybrid Switch

SiC Hybrid switch(HyS)combines low conduction loss of Si IGBT and low switching loss of SiC MOSFET,and the cost is closer to that of Si IGBT.The promising high performances of HyS will bring considerable achievement in terms of enhancing power density of a converter system.By reviewing the gate drive pattern,gate drive hardware,current sharing,module design,converter design,and cost,this paper introduces state-of-the-art SiC HyS.

Review of Power Module Automatic Layout Optimization Methods in Electric Vehicle Applications

The layout of power modules is a crucial design consideration,especially for silicon carbide devices.For electrical layout,optimizing the parasitic parameters can improving switching loss and dynamic behavior.For thermal layout,reducing the thermal resistance and controlling thermal capacitance can reduce the local hot point.Conventional layout design iterations are based on human knowledge and experience.But the major drawback of manual design methods is a limited choice of candidates,large time consumption and also the lack of consistency.With the introduce of automatic layout design,these challenges can be overcome which in the meanwhile alleviates current and temperature imbalance.By reviewing element representation,placement,routing,fitness evaluation,and the optimization algorithm approaches,a state-of-the-art power module layout design method for electric vehicle applications is introduced.

Monitoring of SiC MOSFET Junction Temperature with On-state Voltage at High Currents

A junction temperature monitoring method has been presented based on the on-state voltage at high currents.With a simplified physical model,this method mapped the relationship between junction temperature and on-state voltage.The tough calibration and signal sensing issues are solved.Verified by body-diode voltage detecting method,the presented method shows a good performance and high accuracy,in the meantime,it would not change the modulation strategy and topology of the converter.

Accurate Evaluation of Cooling System Capability of Three-phase IGBT-based Inverter

In this paper,an offline evaluation method for the cooling capability of three-phase insulated-gate bipolar transistor(IGBT)inverters is presented,which can better emulate real working conditions.With a properly designed sudden-stop control sequence,the conventional junction temperature monitoring method at a low current is used to calculate the junction temperature before the sudden stop of an inverter.This can solve the challenging switching loss calculation issue in conventional methods.Finally,the feasibility,control sequence,and electrical behaviors of the proposed method are validated through experimental tests.

Online Junction Temperature Measurement of Double-sided Cooling IGBT Power Module through On-state Voltage with High Current

The aim of this study is to achieve online monitoring of the junction temperature of double-sided-cooling insulated gate bipolar transistor(IGBT)power modules by using the on-state voltage under a high current to maximize the utilization of IGBT power chips.Online junction temperature measurement plays an important role in improving the reliability of the inverter with IGBT,increasing the power density of the motor controller of electric vehicles,and reducing the cost of electric vehicles.