The 13.56 MHz analog front-end circuit for ISO/IEC 15693-compatible radio frequency identification (RFID) trans- ponder IC presented in this paper converts RF power to DC and extracts clock and data from the interroga...The 13.56 MHz analog front-end circuit for ISO/IEC 15693-compatible radio frequency identification (RFID) trans- ponder IC presented in this paper converts RF power to DC and extracts clock and data from the interrogator by 10% or 100% ASK modulation. The transponder sends data back to the interrogator by load modulation technology. The electrostatic discharge (ESD) protection circuits function to limit RF voltage to a safe level. An inductive coupling simulation modelling for 13.56 MHz RFID system is presented, with simulation results showing that the transponder operates over a wide range of electromagnetic field strength from Hmin (150 mA/m) to Hmax (5 A/m). The transponder IC is implemented in SMIC 0.35-μm three-metal two-poly mixed signal CMOS technology with embedded EEPROM.展开更多
Using composite field arithmetic in Galois field can result in the compact Rijndael S-Box. However, the power con- sumption of this solution is too large to be used in resource-limited embedded systems. A full-custom ...Using composite field arithmetic in Galois field can result in the compact Rijndael S-Box. However, the power con- sumption of this solution is too large to be used in resource-limited embedded systems. A full-custom hardware implementation of composite field S-Box is proposed for these targeted domains in this paper. The minimization of power consumption is implemented by optimizing the architecture of the composite field S-Box and using the pass transmission gate (PTG) to realize the logic functions of S-Box. Power simulations were performed using the netlist extracted from the layout. HSPICE simulation results indicated that the proposed S-Box achieves low power consumption of about 130 μW at 10 MHz using 0.25 μm/2.5 V technology, while the consumptions of the positive polarity reed-muller (PPRM) based S-Box and composite field S-Box based on the conventional CMOS logic style are about 240 μW and 420 μW, respectively. The simulations also showed that the presented S-Box obtains better low-voltage operating property, which is clearly relevant for applications like sensor nodes, smart cards and radio frequency identification (RFID) tags.展开更多
An integrated laser diode driver(LDD) driving an edge-emitting laser diode was designed and fabricated by 0.35 μm BiCMOS technology. This paper proposes a scheme which combines the automatic power control loop and te...An integrated laser diode driver(LDD) driving an edge-emitting laser diode was designed and fabricated by 0.35 μm BiCMOS technology. This paper proposes a scheme which combines the automatic power control loop and temperature com-pensation for modulation current in order to maintain constant extinction ratio and average optical power. To implement tem-perature compensation for modulation current,a novel circuit which generates a PTAT current by using the injecting base current of a bipolar transistor in saturation region,and alternates the amplifier feedback loop(closed or not) to control the state of the current path is presented. Simulation results showed that programmed by choice of external resistors,the IC can provide modu-lation current from 5 mA to 85 mA with temperature compensation adjustments and independent bias current from 4 mA to 100 mA. Optical test results showed that clear eye-diagrams can be obtained at 155 Mbps,with the output optical power being nearly constant,and the variation of extinction ratio being lower than 0.7 dB.展开更多
This paper presents a super performance bandgap voltage reference for DC-DC converter with adjustable output. it generates a wide range of voltage reference ranging from sub- 1V to 1,221 7 V and has a low temperature ...This paper presents a super performance bandgap voltage reference for DC-DC converter with adjustable output. it generates a wide range of voltage reference ranging from sub- 1V to 1,221 7 V and has a low temperature coefficient of 2.3 × 10 ^5/K over the temperature variation using the current feedback and resistive subdivision. In addition, the power supply rejection ration of the proposed bandgap voltage reference is 78 dB. When supply voltage varies from 2.5 V to 6 V, output VREF is 1,221 685±0.055 mV.展开更多
The current network-on-chip (NoC) topology cannot predict subsequent switch node status promptly. Switch nodes have to perform various functions such as routing decision, data forwarding, packet buffering, congestio...The current network-on-chip (NoC) topology cannot predict subsequent switch node status promptly. Switch nodes have to perform various functions such as routing decision, data forwarding, packet buffering, congestion control and properties of an NoC system. Therefore, these make switch architecture far more complex. This article puts forward a separating on-chip network architecture based on Mesh (S-Mesh), S-Mesh is an on-chip network that separates routing decision flow from the switches. It consists of two types of networks: datapath network (DN) and control network (CN). The CN establishes data paths for data transferring in DN. Meanwhile, the CN also transfers instructions between different resources. This property makes switch architecture simple, and eliminates conflicts in network interface units between the resource and switch. Compared with 2D-Mesh, Toms Mesh, Fat-tree and Butterfly, the average packet latency in S-Mesh is the shortest when the packet length is more than 53 B. Compared with 2D-Mesh, the areas savings of S-Mesh is about 3%-7/% and the power dissipation is decreased by approximate 2%.展开更多
In this article, a parallel hardware processor is presented to compute elliptic curve scalar multiplication in polynomial basis representation. The processor is applicable to the operations of scalar multiplication by...In this article, a parallel hardware processor is presented to compute elliptic curve scalar multiplication in polynomial basis representation. The processor is applicable to the operations of scalar multiplication by using a modular arithmetic logic unit (MALU). The MALU consists of two multiplications, one addition, and one squaring. The two multiplications and the addition or squaring can be computed in parallel. The whole computations of scalar multiplication over GF(2^163) can be performed in 3 064 cycles. The simulation results based on Xilinx Virtex2 XC2V6000 FPGAs show that the proposed design can compute random GF(2^163) elliptic curve scalar multiplication operations in 31.17 μs, and the resource occupies 3 994 registers and 15 527 LUTs, which indicates that the crypto-processor is suitable for high-performance application.展开更多
A new gate dielectric material HfTiON is deposited by reactive co-sputtering of Hf and Ti targets in N2/O2 ambient, followed by annealing in N2 at 600 ℃ and 800 ℃ respectively for 2 min. Capacitance-voltage and gate...A new gate dielectric material HfTiON is deposited by reactive co-sputtering of Hf and Ti targets in N2/O2 ambient, followed by annealing in N2 at 600 ℃ and 800 ℃ respectively for 2 min. Capacitance-voltage and gate-leakage properties are characterized and compared for different anneal conditions. The results indicate that the sample annealed at 800 ℃ exhibits lower interface-state and oxide-charge densities, and better device reliability. This is attributed to the fact that the rapid thermal annealing at the higher temperature of 800 ℃ can effectively remove the damage-induced precipitation, forming a hardened dielectric/Si interface with high reliability.展开更多
文摘The 13.56 MHz analog front-end circuit for ISO/IEC 15693-compatible radio frequency identification (RFID) trans- ponder IC presented in this paper converts RF power to DC and extracts clock and data from the interrogator by 10% or 100% ASK modulation. The transponder sends data back to the interrogator by load modulation technology. The electrostatic discharge (ESD) protection circuits function to limit RF voltage to a safe level. An inductive coupling simulation modelling for 13.56 MHz RFID system is presented, with simulation results showing that the transponder operates over a wide range of electromagnetic field strength from Hmin (150 mA/m) to Hmax (5 A/m). The transponder IC is implemented in SMIC 0.35-μm three-metal two-poly mixed signal CMOS technology with embedded EEPROM.
基金Project supported by the Hi-Tech Research and Development Program (863) of China (No. 2006AA01Z226)the Scientific Research Foundation of Huazhong University of Science and Technol-ogy (No. 2006Z001B), China
文摘Using composite field arithmetic in Galois field can result in the compact Rijndael S-Box. However, the power con- sumption of this solution is too large to be used in resource-limited embedded systems. A full-custom hardware implementation of composite field S-Box is proposed for these targeted domains in this paper. The minimization of power consumption is implemented by optimizing the architecture of the composite field S-Box and using the pass transmission gate (PTG) to realize the logic functions of S-Box. Power simulations were performed using the netlist extracted from the layout. HSPICE simulation results indicated that the proposed S-Box achieves low power consumption of about 130 μW at 10 MHz using 0.25 μm/2.5 V technology, while the consumptions of the positive polarity reed-muller (PPRM) based S-Box and composite field S-Box based on the conventional CMOS logic style are about 240 μW and 420 μW, respectively. The simulations also showed that the presented S-Box obtains better low-voltage operating property, which is clearly relevant for applications like sensor nodes, smart cards and radio frequency identification (RFID) tags.
基金Project (No. 2006AA01Z226) supported by the Hi-Tech Researchand Development Program (863) of China
文摘An integrated laser diode driver(LDD) driving an edge-emitting laser diode was designed and fabricated by 0.35 μm BiCMOS technology. This paper proposes a scheme which combines the automatic power control loop and temperature com-pensation for modulation current in order to maintain constant extinction ratio and average optical power. To implement tem-perature compensation for modulation current,a novel circuit which generates a PTAT current by using the injecting base current of a bipolar transistor in saturation region,and alternates the amplifier feedback loop(closed or not) to control the state of the current path is presented. Simulation results showed that programmed by choice of external resistors,the IC can provide modu-lation current from 5 mA to 85 mA with temperature compensation adjustments and independent bias current from 4 mA to 100 mA. Optical test results showed that clear eye-diagrams can be obtained at 155 Mbps,with the output optical power being nearly constant,and the variation of extinction ratio being lower than 0.7 dB.
文摘This paper presents a super performance bandgap voltage reference for DC-DC converter with adjustable output. it generates a wide range of voltage reference ranging from sub- 1V to 1,221 7 V and has a low temperature coefficient of 2.3 × 10 ^5/K over the temperature variation using the current feedback and resistive subdivision. In addition, the power supply rejection ration of the proposed bandgap voltage reference is 78 dB. When supply voltage varies from 2.5 V to 6 V, output VREF is 1,221 685±0.055 mV.
基金sponsored by the Hi-Tech Research and Development Program of China (2009AA01Z105)the Research Foundation of the Ministry of Education of China, and the Intel Information Technique (MOE-INTEL-08-05)
文摘The current network-on-chip (NoC) topology cannot predict subsequent switch node status promptly. Switch nodes have to perform various functions such as routing decision, data forwarding, packet buffering, congestion control and properties of an NoC system. Therefore, these make switch architecture far more complex. This article puts forward a separating on-chip network architecture based on Mesh (S-Mesh), S-Mesh is an on-chip network that separates routing decision flow from the switches. It consists of two types of networks: datapath network (DN) and control network (CN). The CN establishes data paths for data transferring in DN. Meanwhile, the CN also transfers instructions between different resources. This property makes switch architecture simple, and eliminates conflicts in network interface units between the resource and switch. Compared with 2D-Mesh, Toms Mesh, Fat-tree and Butterfly, the average packet latency in S-Mesh is the shortest when the packet length is more than 53 B. Compared with 2D-Mesh, the areas savings of S-Mesh is about 3%-7/% and the power dissipation is decreased by approximate 2%.
基金supported by the Hi-Tech Research and Development Program of China(2006AA01Z226)the Research Foundation of Huazhong University of Science and Technology(2006Z001B)
文摘In this article, a parallel hardware processor is presented to compute elliptic curve scalar multiplication in polynomial basis representation. The processor is applicable to the operations of scalar multiplication by using a modular arithmetic logic unit (MALU). The MALU consists of two multiplications, one addition, and one squaring. The two multiplications and the addition or squaring can be computed in parallel. The whole computations of scalar multiplication over GF(2^163) can be performed in 3 064 cycles. The simulation results based on Xilinx Virtex2 XC2V6000 FPGAs show that the proposed design can compute random GF(2^163) elliptic curve scalar multiplication operations in 31.17 μs, and the resource occupies 3 994 registers and 15 527 LUTs, which indicates that the crypto-processor is suitable for high-performance application.
文摘A new gate dielectric material HfTiON is deposited by reactive co-sputtering of Hf and Ti targets in N2/O2 ambient, followed by annealing in N2 at 600 ℃ and 800 ℃ respectively for 2 min. Capacitance-voltage and gate-leakage properties are characterized and compared for different anneal conditions. The results indicate that the sample annealed at 800 ℃ exhibits lower interface-state and oxide-charge densities, and better device reliability. This is attributed to the fact that the rapid thermal annealing at the higher temperature of 800 ℃ can effectively remove the damage-induced precipitation, forming a hardened dielectric/Si interface with high reliability.