Construction of all-organic low dielectric polyimide hybrids via synergistic effect between covalent organic framework and cross-linking structure

Polyimide(PI)is a promising electronic packaging material,but it remains challenging to obtain an all-organic PI hybrid film with decreased dielectric constant and loss without modifying the monomer.Herein,a series of allorganic PI hybrid films were successfully prepared by introducing the covalent organic framework(COF),which could induce the formation of the cross-linking structure in the PI matrix.Due to the synergistic effects of the COF fillers and the cross-linking structure,the PI/COF hybrid film containing 2 wt%COF exhibited the lowest dielectric constant of 2.72 and the lowest dielectric loss(tanδ)of 0.0077 at 1 MHz.It is attributed to the intrinsic low dielectric constant of COF and a large number of mesopores within the PI.Besides,the cross-linking network of PI prevents the molecular chains from stacking and improves the fraction of free volume(FFV).The molecular dynamics simulation results are well consistent with the dielectric properties data.Furthermore,the PI/COF hybrid film with 5 wt%COF showed a significant enhancement in breakdown strength,which increased to 412.8 kV/mm as compared with pure PI.In addition,the PI/COF hybrid film achieve to reduce the dielectric constant and thermal expansion coefficient(CTE).It also exhibited excellent thermal,hydrophobicity,and mechanical performance.The all-organic PI/COF hybrid films have great commercial potential as next-generation electronic packaging materials.

Preparation of porous polyamide 6(PA6)membrane with copper oxide(CuO)nanoparticles selectively localized at the wall of the pores via reactive extrusion

In this study,CuO nanoparticles are pre-modified with styrene-maleic anhydride copolymers(SMAs)of different molecular weights and MAH contents.Then the pre-modified CuO nanoparticles(CuO-SMAs)are added to the PA6/SEBS(Styrene Ethylene Butylene Styrene copolymer)(40/60 wt/wt)polymer blends with a co-continuous morphology.When SMA3(MAH=8 wt%,M_(n)=250000 g/mol)is used to modify CuO nanoparticles,and the grafting degree of SMA3 on the surface of CuO reaches 2.74 wt%,90.71%of the added mCuO-SMA3 nanoparticles can be located at the interface of PA6 and SEBS.A porous PA6 membrane with CuO nanoparticles located at the pore walls can be obtained after the SEBS phase is etched with xylene.The catalytic reaction velocity constant(k)for the reduction of p-nitrophenol in NaBH_(4)solutions with the PA6/mCuO-SMA3 porous membrane can reach 1.0040 min^(-1).This work provides a feasible and straightforward method for the preparation of porous polymer membranes with functional nanoparticles located at the wall of the pores.