In this paper, we explore the electrical characteristics of high-electron-mobility transistors(HEMTs) using a TaN/AlGaN/GaN metal insulating semiconductor(MIS) structure. The high-resistance tantalum nitride(TaN) film...In this paper, we explore the electrical characteristics of high-electron-mobility transistors(HEMTs) using a TaN/AlGaN/GaN metal insulating semiconductor(MIS) structure. The high-resistance tantalum nitride(TaN) film prepared by magnetron sputtering as the gate dielectric layer of the device achieved an effective reduction of electronic states at the TaN/AlGaN interface, and reducing the gate leakage current of the MIS HEMT, its performance was enhanced. The HEMT exhibited a low gate leakage current of 2.15 × 10^(-7) mA/mm and a breakdown voltage of 1180 V. Furthermore, the MIS HEMT displayed exceptional operational stability during dynamic tests, with dynamic resistance remaining only 1.39 times even under 400 V stress.展开更多
A power amplifier MIC with power combining based on AlGaN/GaN HEMTs was fabricated and measured. The amplifier consists of four 10 × 120μm transistors. A Wilkinson splitters and combining were used to divide and...A power amplifier MIC with power combining based on AlGaN/GaN HEMTs was fabricated and measured. The amplifier consists of four 10 × 120μm transistors. A Wilkinson splitters and combining were used to divide and combine the power. By biasing the amplifier at VDS = 40V, IDS = 0.9A, a maximum CW output power of 41.4dBm with a maximum power added efficiency （PAE） of 32.54% and a power combine efficiency of 69% was achieved at 5.4GHz.展开更多
Although outstanding microwave power performance of AlGaN/GaN HEMTs has been reported,drain current collapse is still a problem. In this paper,an experiment was carried out to demonstrate one factor causing the collap...Although outstanding microwave power performance of AlGaN/GaN HEMTs has been reported,drain current collapse is still a problem. In this paper,an experiment was carried out to demonstrate one factor causing the collapse. Two AlGaN/GaN samples were annealed under N2-atmosphere with and without carbon incorporation, and the XPS measurement technique was used to determine that the concentration of carbon impurity in the latter sample was far higher than in the former. From the comparison of two Id- Vds characteristics,we conclude that carbon impurity incorporation is responsible for the severe current collapse. The carbon impurity-induced deep traps under negative gate bias stress can capture the channel carriers, which release slowly from these traps under positive bias stress,thus causing the current collapse.展开更多
基金supported by the National Natural Science Foundation of China(Grant No.1237310)The Youth Innovation Promotion Association of the Chinese Academy of Sciences(Grant No.2020321)+1 种基金the National Natural Science Foundation of China(Grant No.92163204)The Key Research and Development Program of Jiangsu Province(Grant No.BE2022057-1)。
文摘In this paper, we explore the electrical characteristics of high-electron-mobility transistors(HEMTs) using a TaN/AlGaN/GaN metal insulating semiconductor(MIS) structure. The high-resistance tantalum nitride(TaN) film prepared by magnetron sputtering as the gate dielectric layer of the device achieved an effective reduction of electronic states at the TaN/AlGaN interface, and reducing the gate leakage current of the MIS HEMT, its performance was enhanced. The HEMT exhibited a low gate leakage current of 2.15 × 10^(-7) mA/mm and a breakdown voltage of 1180 V. Furthermore, the MIS HEMT displayed exceptional operational stability during dynamic tests, with dynamic resistance remaining only 1.39 times even under 400 V stress.
文摘A power amplifier MIC with power combining based on AlGaN/GaN HEMTs was fabricated and measured. The amplifier consists of four 10 × 120μm transistors. A Wilkinson splitters and combining were used to divide and combine the power. By biasing the amplifier at VDS = 40V, IDS = 0.9A, a maximum CW output power of 41.4dBm with a maximum power added efficiency （PAE） of 32.54% and a power combine efficiency of 69% was achieved at 5.4GHz.
文摘Although outstanding microwave power performance of AlGaN/GaN HEMTs has been reported,drain current collapse is still a problem. In this paper,an experiment was carried out to demonstrate one factor causing the collapse. Two AlGaN/GaN samples were annealed under N2-atmosphere with and without carbon incorporation, and the XPS measurement technique was used to determine that the concentration of carbon impurity in the latter sample was far higher than in the former. From the comparison of two Id- Vds characteristics,we conclude that carbon impurity incorporation is responsible for the severe current collapse. The carbon impurity-induced deep traps under negative gate bias stress can capture the channel carriers, which release slowly from these traps under positive bias stress,thus causing the current collapse.
