Deposition of Diamond Films on Copper Substrate

The direct deposition of diamond films on copper substrate has been suffered fromadhesion problems due to the mismatch of the thermal expansion coefficients of diamond andcopper. In this paper nuclei with valuable density were directly introduced thirough a submicrondiamond powder layer. The diamond grits partially were buried in the copper substrate leadingto better adhesion. Another method with nickel intermediate layer for enhancing the adhesionwas studied here in detail. It was suggested that Cu-Ni eutectic between the copper substrate andNi interlayer might contribute to the adhesion improvement. The quality of the diamond filmsdeposited wlth rnckel interlayer was investigated by scanning electron microscopy and Ramanspectroscopy.

OFHC copper substrates for niobium sputtering:comparison of chemical etching recipes

Purpose Niobium sputtered on copper has been a popular alternative approach for superconducting radio frequency(SRF)community in the last few decades.Comparing to bulk materials of a few millimeters,high-purity niobium of merely a few microns is sufficient to realize superconductivity on the coated surface.Being niobium thin film,it has been widely acknowledged that surface quality of the substrate plays a vital role in obtaining a superior niobium coating with excellent SRF performance.Therefore,proper chemical treatment of the substrate before coating is crucial and the ultimate goal is to create a smooth and defect-free surface.Prior to the design of a cavity etching system,the mechanism of SUBU as well as two industry-used solutions is studied in detail on samples.Methods Copper samples were first pre-treated by mechanical grinding to remove fabrication damages,obvious defects and visible impurities.Two chemical solutions widely used in industries were subsequently chosen to etch the samples.Finally,the established SUBU solution was used independently on these pre-treated samples for comparison.Surface morphology and etching rate were measured accordingly.Results and conclusions Mirror-like copper surface was created by using the SUBU solution thus qualified for subsequent niobium sputtering,while the other two solutions used in industries were less effective with nonideal surface morphology.The chemical reactions,the experimental requisites and the involved processes are extensively elucidated for all three solutions.Limitations for SUBU were examined,and the optimum ratio of the chemical bath volume to sample surface area was also determined.These investigations will serve as an important guidance for the development of a chemical etching system for elliptical copper cavities.

Surface preparation by mechanical polishing of the 1.3-GHzmono-cell copper cavity substrate prior chemical etching for niobium coating

Purpose Surface quality of the substrate is widely acknowledged to be essential for the niobium thin film deposition. Mucheffort has thus been spent to improve the surface roughness by using various chemical etching techniques. However, surfacepreparation before the chemical etching also plays a part in obtaining a satisfactory substrate, but has rarely been studiedbefore. This paper aims to define a specification for the pre-polished copper substrate prior chemical etching and searches forsuitable alternative non-chemical grinding methods for the copper cavity.Methods Copper samples were mechanically pre-polished at first by using flap sanding wheels of different grits and thenchemically etched by using the well-established SUBU solutions. Surface roughness, as a figure of merit, was measuredand compared before and after SUBU. Optimum practice for pre-polishing may therefore be determined. The mechanicalgrinding was subsequently applied on the 1.3-GHz mono-cell copper cavity. Meantime, the previously reported centrifugalbarrel polishing method was also applied with new abrasive materials and modified schemes. A comprehensive study ofetching rate, surface roughness and morphologies was conducted.Results and conclusions The specification for surface roughness prior SUBU was determined. Due to a complex geometryand curved surfaces possessed by the 1.3-GHz copper cavity, the traditional mechanical grinding was proved to be not ideal.Satisfactory surface quality was obtained by using the alternative centrifugal barrel polishing on the cavity. The proposed newscheme and new abrasive materials were demonstrated to be effective, and a mirror-like surface was achieved on the coppercavity. The traditional mechanical grinding can therefore be replaced. This constitutes a dedicated study on pre-polishing ofthe 1.3-GHz copper cavity substrate prior chemical etching for niobium sputtering.

Copper pollution decreases the resistance of soil microbial community to subsequent dry–rewetting disturbance

Dry–rewetting（DW） disturbance frequently occurs in soils due to rainfall and irrigation, and the frequency of DW cycles might exert significant influences on soil microbial communities and their mediated functions. However, how microorganisms respond to DW alternations in soils with a history of heavy metal pollution remains largely unknown.Here, soil laboratory microcosms were constructed to explore the impacts of ten DW cycles on the soil microbial communities in two contrasting soils（fluvo-aquic soil and red soil）under three copper concentrations（zero, medium and high）. Results showed that the fluctuations of substrate induced respiration（SIR） decreased with repeated cycles of DW alternation. Furthermore, the resistance values of substrate induced respiration（RS-SIR）were highest in non-copper-stressed（zero） soils. Structural equation model（SEM） analysis ascertained that the shifts of bacterial communities determined the changes of RS-SIR in both soils. The rate of bacterial community variance was significantly lower in noncopper-stressed soil compared to the other two copper-stressed（medium and high） soils,which might lead to the higher RS-SIR in the fluvo-aquic soil. As for the red soil, the substantial increase of the dominant group WPS-2 after DW disturbance might result in the low RS-SIR in the high copper-stressed soil. Moreover, in both soils, the bacterial diversity was highest in non-copper-stressed soils. Our results revealed that initial copper stress could decrease the resistance of soil microbial community structure and function to subsequent DW disturbance.