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Effects of phosphorus addition on the properties of Sn-9Zn lead-free solder alloy 被引量:7
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作者 Hui-zhen Huang Xiu-qin Wei +1 位作者 Dun-qiang Tan Lang Zhou 《International Journal of Minerals,Metallurgy and Materials》 SCIE EI CAS CSCD 2013年第6期563-567,共5页
This article explores tile effects of phosphorus addition on the wettability between Sn-9Zn solder alloy and Cu substrates, the oxidation behavior and the corrosion behavior of Sn-9Zn solder alloy. Spreading test was ... This article explores tile effects of phosphorus addition on the wettability between Sn-9Zn solder alloy and Cu substrates, the oxidation behavior and the corrosion behavior of Sn-9Zn solder alloy. Spreading test was used to characterize the wettability of Sn-9Zn-xP solder alloys to Cu substrates. The oxidation and corrosion behaviors of Sn- 9Zn-xP solder alloys were determined by means of weight gaining, and secondary ion mass spectrometry was used to analyze the oxygen content. The role and mechanism of P in the solder alloys were also discussed. It is found that the addition of P can significantly improve the wettability of the solder alloys. Incorporating P into Sn-9Zn solder alloy obviously decreases the oxygen content and enhances the oxidation and corrosion resistance. Microstructure observations show that an appropriate amount of P can greatly refine coarse rod-like Zn-rich phases in Sn-gZn solder alloy. 展开更多
关键词 lead-free solder PHOSPHORUS WETTABILITY oxidntion CORROSION
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