Three kinds of coplanar waveguides （CPWs） are designed and fabricated on different silicon substrates---common low-resistivity silicon substrate （LRS）, LRS with a 3μm-thick silicon oxide interlayer, and high-resi...Three kinds of coplanar waveguides （CPWs） are designed and fabricated on different silicon substrates---common low-resistivity silicon substrate （LRS）, LRS with a 3μm-thick silicon oxide interlayer, and high-resistivity silicon （HRS） substrate. The results show that the microwave loss of a CPW on LRS is too high to be used, but it can be greatly reduced by adding a thick interlayer of silicon oxide between the CPW transmission lines and the LRS.A CPW directly on HRS shows a loss lower than 2dB/cm in the range of 0-26GHz and the process is simple,so HRS is a more suitable CPW substrate.展开更多
Laser-weldable Sip-SiCp/Al hybrid composites with high volume fraction （60%-65%） of SiC reinforcement were fabricated by compression moulding and vacuum gas pressure infiltration technology. Microscopic observation ...Laser-weldable Sip-SiCp/Al hybrid composites with high volume fraction （60%-65%） of SiC reinforcement were fabricated by compression moulding and vacuum gas pressure infiltration technology. Microscopic observation displayed that the Sip-SiCp/Al hybrid composites with bilayer structure were compact without gas pores and the intergradation between Sip/Al layer and SiCp/Al layer was homogeneous and continuous. Further investigation revealed that the Sip-SiCp/Al hybrid composites possessed low density （2.96 g/cm^3）, high gas tightness （1.0 mPa·cm^3）/s）, excellent thermal management function as a result of high thermal conductivity （194 W/（m·K） and low coefficient of thermal expansion （7.0×10^-6 K-1）. Additionally, Sip-SiCp/Al hybrid composites had outstanding laser welding adaptability, which is significantly important for electronic packaging applications. The gas tightness of components after laser welding （48 mPa·cm^3）/s） can well match the requirement of advanced electronic packaging. Several kinds of these precision components passed tests and were put into production.展开更多
文摘Three kinds of coplanar waveguides （CPWs） are designed and fabricated on different silicon substrates---common low-resistivity silicon substrate （LRS）, LRS with a 3μm-thick silicon oxide interlayer, and high-resistivity silicon （HRS） substrate. The results show that the microwave loss of a CPW on LRS is too high to be used, but it can be greatly reduced by adding a thick interlayer of silicon oxide between the CPW transmission lines and the LRS.A CPW directly on HRS shows a loss lower than 2dB/cm in the range of 0-26GHz and the process is simple,so HRS is a more suitable CPW substrate.
文摘Laser-weldable Sip-SiCp/Al hybrid composites with high volume fraction （60%-65%） of SiC reinforcement were fabricated by compression moulding and vacuum gas pressure infiltration technology. Microscopic observation displayed that the Sip-SiCp/Al hybrid composites with bilayer structure were compact without gas pores and the intergradation between Sip/Al layer and SiCp/Al layer was homogeneous and continuous. Further investigation revealed that the Sip-SiCp/Al hybrid composites possessed low density （2.96 g/cm^3）, high gas tightness （1.0 mPa·cm^3）/s）, excellent thermal management function as a result of high thermal conductivity （194 W/（m·K） and low coefficient of thermal expansion （7.0×10^-6 K-1）. Additionally, Sip-SiCp/Al hybrid composites had outstanding laser welding adaptability, which is significantly important for electronic packaging applications. The gas tightness of components after laser welding （48 mPa·cm^3）/s） can well match the requirement of advanced electronic packaging. Several kinds of these precision components passed tests and were put into production.
