In order to study the relationship between the main process parameters and the cell size, the mathematical model of cell growth of microcellular foaming injection process is built. Then numeric simulation is employed ...In order to study the relationship between the main process parameters and the cell size, the mathematical model of cell growth of microcellular foaming injection process is built. Then numeric simulation is employed as experimental method, and the Taguchi method is used to analyze significance of effect of process parameters on the cell size. At last the process parameters are focused on melt temperature, injection time, mold temperature and pretidied volume. The significance order from big to small of the effect of each process parameters on cell size is melt temperature, pre-filled volume, injection time, and mold temperature. On the basis of above research, the effect of each process parameter on cell size is further researched. Appropriate reduction of the melt temperature and increase of the pre-filled volume can optimize the cell size effectively, while the effects of injection time and mold temperature on cell size are less significant.展开更多
In order to utilize integrated passive technology in printed circuit boards （PCBs）, manufacturing processing for integrated resistors by lamination method was investigated. Integrated resistors fabricated from Ohmeg...In order to utilize integrated passive technology in printed circuit boards （PCBs）, manufacturing processing for integrated resistors by lamination method was investigated. Integrated resistors fabricated from Ohmega technologies in the experiment were 1 408 pieces per panel with four different patterns A, B, C and D and four resistance values of 25, 50, 75 and 100 fL Six panel per batch and four batches were performed totally. The testing was done for 960 pieces of integrated resistors randomly selected with the same size. The value distribution ranges and the relative standard deviation （RSD） show that the scatter degree of the resistance decreases with the resistor size increasing and/or with the resistance increasing. Patterns D with resistance of 75 and 100% for four patterns have the resistance value variances less than 10%. Patterns C and D with resistance of 100 Ω have the manufacturing tolerance less than 10%. The process capabilities are from about 0.6 to 1.6 for the designed testing patterns, which shows that the integrated resistors fabricated have the potential to be used in multilayer PCBs in the future.展开更多
The temperature of powder bed is very important for selective laser sintering system(SLS),because it directly affects the quality of part.Furthermore,the temperature of powder bed should alter according to the slicing...The temperature of powder bed is very important for selective laser sintering system(SLS),because it directly affects the quality of part.Furthermore,the temperature of powder bed should alter according to the slicing section contour of model in order to ensure that the integration is successful and intelligent.Namely,the temperature of powder bed should change with shape of CAD model at different height.The paper illuminates how to distinguish the slicing contour loops from adjacent region.In this way,the temperature can be adaptively adjusted with altering of the sectional contours.展开更多
New open manufacturing environments have been proposed aiming at realizing more flexible distributed manufacturing paradigms,which can deal with not only dynamic changes in volume and variety of products,but also chan...New open manufacturing environments have been proposed aiming at realizing more flexible distributed manufacturing paradigms,which can deal with not only dynamic changes in volume and variety of products,but also changes of machining equipments,dispersals of processing locations,and also with unscheduled disruptions.This research is to develop an integrated process planning and scheduling system,which is suited to this open,dynamic,distributed manufacturing environment.Multi-agent system(MAS)approaches are used for integration of manufacturing processing planning and scheduling in an open distributed manufacturing environment,in which process planning can be adjusted dynamically and manufacturing resources can increase/decrease according to the requirements.One kind of multi-level dynamic negotiated approaches to process planning and scheduling is presented for the integration of manufacturing process planning and scheduling.展开更多
文摘In order to study the relationship between the main process parameters and the cell size, the mathematical model of cell growth of microcellular foaming injection process is built. Then numeric simulation is employed as experimental method, and the Taguchi method is used to analyze significance of effect of process parameters on the cell size. At last the process parameters are focused on melt temperature, injection time, mold temperature and pretidied volume. The significance order from big to small of the effect of each process parameters on cell size is melt temperature, pre-filled volume, injection time, and mold temperature. On the basis of above research, the effect of each process parameter on cell size is further researched. Appropriate reduction of the melt temperature and increase of the pre-filled volume can optimize the cell size effectively, while the effects of injection time and mold temperature on cell size are less significant.
基金Project(041010) supported by Start-Up Foundation of Northwest University,ChinaProject(UIT/39) supported by University-Industry Collaboration Program from the Innovation and Technology Fund of Hong Kong,China
文摘In order to utilize integrated passive technology in printed circuit boards （PCBs）, manufacturing processing for integrated resistors by lamination method was investigated. Integrated resistors fabricated from Ohmega technologies in the experiment were 1 408 pieces per panel with four different patterns A, B, C and D and four resistance values of 25, 50, 75 and 100 fL Six panel per batch and four batches were performed totally. The testing was done for 960 pieces of integrated resistors randomly selected with the same size. The value distribution ranges and the relative standard deviation （RSD） show that the scatter degree of the resistance decreases with the resistor size increasing and/or with the resistance increasing. Patterns D with resistance of 75 and 100% for four patterns have the resistance value variances less than 10%. Patterns C and D with resistance of 100 Ω have the manufacturing tolerance less than 10%. The process capabilities are from about 0.6 to 1.6 for the designed testing patterns, which shows that the integrated resistors fabricated have the potential to be used in multilayer PCBs in the future.
基金Sponsored by the 863 Inportant Science and Technology Subject Foundation(Grant No.2002AA6Z3081).
文摘The temperature of powder bed is very important for selective laser sintering system(SLS),because it directly affects the quality of part.Furthermore,the temperature of powder bed should alter according to the slicing section contour of model in order to ensure that the integration is successful and intelligent.Namely,the temperature of powder bed should change with shape of CAD model at different height.The paper illuminates how to distinguish the slicing contour loops from adjacent region.In this way,the temperature can be adaptively adjusted with altering of the sectional contours.
基金International Cooperative Research Project of China(No.2006DFA73180)
文摘New open manufacturing environments have been proposed aiming at realizing more flexible distributed manufacturing paradigms,which can deal with not only dynamic changes in volume and variety of products,but also changes of machining equipments,dispersals of processing locations,and also with unscheduled disruptions.This research is to develop an integrated process planning and scheduling system,which is suited to this open,dynamic,distributed manufacturing environment.Multi-agent system(MAS)approaches are used for integration of manufacturing processing planning and scheduling in an open distributed manufacturing environment,in which process planning can be adjusted dynamically and manufacturing resources can increase/decrease according to the requirements.One kind of multi-level dynamic negotiated approaches to process planning and scheduling is presented for the integration of manufacturing process planning and scheduling.
