A differential equation that is generally effective for squeeze film air damping of perforated plate and non perforated plate as well as in MEMS devices is developed.For perforated plate,the thickness and the dimens...A differential equation that is generally effective for squeeze film air damping of perforated plate and non perforated plate as well as in MEMS devices is developed.For perforated plate,the thickness and the dimensions of the plate are not limited.With boundary conditions,pressure distribution and the damping force on the plate can be found by solving the differential equation.Analytical expressions for damping pressure and damping force of a long strip holeplate are presented with a finite thickness and a finite width.To the extreme conditions of very thin plate and very thin hole,the results are reduced to the corresponding results of the conventional Reynolds' equation.Thus, the effectiveness of the generalized differential equation is justified.Therefore,the generalized Reynolds' equation will be a useful tool of design for damping structures in MEMS.展开更多
Micro heat pipe(MHP) is applied to implement the efficient heat transfer of light emitting diode(LED) device.The fabrication of MHP is based on micro-electro-mechanical-system(MEMS) technique,15 micro grooves were etc...Micro heat pipe(MHP) is applied to implement the efficient heat transfer of light emitting diode(LED) device.The fabrication of MHP is based on micro-electro-mechanical-system(MEMS) technique,15 micro grooves were etched on one side of silicon(Si) substrate,which was then packaged with aluminum heat sink to form an MHP.On the other side of Si substrate,three LED chips were fixed by die bonding.Then experiments were performed to study the thermal performance of this LED device.The results show that the LED device with higher filling ratio is better when the input power is 1.0 W; with the increase of input power,the optimum filling ratio changes from 30% to 48%,and the time reaching stable state is reduced; when the input power is equal to 2.5 W,only the LED device with filling ratio of 48% can work normally.So integrating MHP into high-power LED device can implement the effective control of junction temperature.展开更多
文摘A differential equation that is generally effective for squeeze film air damping of perforated plate and non perforated plate as well as in MEMS devices is developed.For perforated plate,the thickness and the dimensions of the plate are not limited.With boundary conditions,pressure distribution and the damping force on the plate can be found by solving the differential equation.Analytical expressions for damping pressure and damping force of a long strip holeplate are presented with a finite thickness and a finite width.To the extreme conditions of very thin plate and very thin hole,the results are reduced to the corresponding results of the conventional Reynolds' equation.Thus, the effectiveness of the generalized differential equation is justified.Therefore,the generalized Reynolds' equation will be a useful tool of design for damping structures in MEMS.
基金supported by the State Key Development Program for Basic Research of China(No.2011CB013105)
文摘Micro heat pipe(MHP) is applied to implement the efficient heat transfer of light emitting diode(LED) device.The fabrication of MHP is based on micro-electro-mechanical-system(MEMS) technique,15 micro grooves were etched on one side of silicon(Si) substrate,which was then packaged with aluminum heat sink to form an MHP.On the other side of Si substrate,three LED chips were fixed by die bonding.Then experiments were performed to study the thermal performance of this LED device.The results show that the LED device with higher filling ratio is better when the input power is 1.0 W; with the increase of input power,the optimum filling ratio changes from 30% to 48%,and the time reaching stable state is reduced; when the input power is equal to 2.5 W,only the LED device with filling ratio of 48% can work normally.So integrating MHP into high-power LED device can implement the effective control of junction temperature.
