In order to present a new method for analyzing the reliability of a two-link flexible robot manipulator,Lagrange dynamics differential equations of the two-link flexible robot manipulator were established by using the...In order to present a new method for analyzing the reliability of a two-link flexible robot manipulator,Lagrange dynamics differential equations of the two-link flexible robot manipulator were established by using the integrated modal method and the multi-body system dynamics method.By using the Monte Carlo method,the random sample values of the dynamic parameters were obtained and Lagrange dynamics differential equations were solved for each random sample value which revealed their displacement,speed and acceleration.On this basis,dynamic stresses and deformations were obtained.By taking the maximum values of the stresses and the deformations as output responses and the random sample values of dynamic parameters as input quantities,extremum response surface functions were established.A number of random samples were then obtained by using the Monte Carlo method and then the reliability was analyzed by using the extremum response surface method.The results show that the extremum response surface method is an efficient and fast reliability analysis method with high-accuracy for the two-link flexible robot manipulator.展开更多
Polymer insulating through-silicon-vias (TSVs) is an attractive approach for high-performance 3D integration systems. To further demonstrate the polymer insulating TSVs, this paper investigates the thermal stability...Polymer insulating through-silicon-vias (TSVs) is an attractive approach for high-performance 3D integration systems. To further demonstrate the polymer insulating TSVs, this paper investigates the thermal stability by measuring the leakage current under bias-temperature condition, studies the thermal stress characteristics with Finite Element Analysis (FEA), and tries to improve the thermal mechanical reliability of high-density TSVs array by optimizing the geometry parameters of pitch, liner and redistribution layer (RDL). The electrical measurements show the polymer insulating TSVs can maintain good insulation capability (less than 2x 10TM A) under challenging bias-temperature conditions of 20 V and 200~C, despite the leakage degra- dation observation. The FEA results show that the thermal stress is significantly reduced at the sidewall, but highly concen- trates at the surface, which is the potential location of mechanical failure. And, the analysis results indicate that the polymer insulating TSVs (diameter of 10 μm, depth of 50 μm) array with a pitch of 20 μm, liner thickness of 1 μm and RDL radius of 9 μm has an optimized thermal-mechanical reliability for application.展开更多
基金Project(2006AA04Z405) supported by the National High Technology Research and Development Program of ChinaProject(3102019) supported by Beijing Municipal Natural Science Foundation,China
文摘In order to present a new method for analyzing the reliability of a two-link flexible robot manipulator,Lagrange dynamics differential equations of the two-link flexible robot manipulator were established by using the integrated modal method and the multi-body system dynamics method.By using the Monte Carlo method,the random sample values of the dynamic parameters were obtained and Lagrange dynamics differential equations were solved for each random sample value which revealed their displacement,speed and acceleration.On this basis,dynamic stresses and deformations were obtained.By taking the maximum values of the stresses and the deformations as output responses and the random sample values of dynamic parameters as input quantities,extremum response surface functions were established.A number of random samples were then obtained by using the Monte Carlo method and then the reliability was analyzed by using the extremum response surface method.The results show that the extremum response surface method is an efficient and fast reliability analysis method with high-accuracy for the two-link flexible robot manipulator.
文摘Polymer insulating through-silicon-vias (TSVs) is an attractive approach for high-performance 3D integration systems. To further demonstrate the polymer insulating TSVs, this paper investigates the thermal stability by measuring the leakage current under bias-temperature condition, studies the thermal stress characteristics with Finite Element Analysis (FEA), and tries to improve the thermal mechanical reliability of high-density TSVs array by optimizing the geometry parameters of pitch, liner and redistribution layer (RDL). The electrical measurements show the polymer insulating TSVs can maintain good insulation capability (less than 2x 10TM A) under challenging bias-temperature conditions of 20 V and 200~C, despite the leakage degra- dation observation. The FEA results show that the thermal stress is significantly reduced at the sidewall, but highly concen- trates at the surface, which is the potential location of mechanical failure. And, the analysis results indicate that the polymer insulating TSVs (diameter of 10 μm, depth of 50 μm) array with a pitch of 20 μm, liner thickness of 1 μm and RDL radius of 9 μm has an optimized thermal-mechanical reliability for application.