In this paper melamine pyrophosphate was synthesized by a new method. Its performances were showed and measured by the ways of elemental analysis, XRD, TG, DSC and IR. Its fireretardant mechanism and characteristic ...In this paper melamine pyrophosphate was synthesized by a new method. Its performances were showed and measured by the ways of elemental analysis, XRD, TG, DSC and IR. Its fireretardant mechanism and characteristic were discussed. Under burning, the fireretardant time of fivelayer wood panel coated the fireretardant paint is 24 min. The intumescent folds of the paint are 60~80.展开更多
Copper pyrophosphate plating is the most important electroplating process which can instead of copper cyanide electroplating, but the biggest shortcoming is poor adhesion. In this paper, the influence of additives on ...Copper pyrophosphate plating is the most important electroplating process which can instead of copper cyanide electroplating, but the biggest shortcoming is poor adhesion. In this paper, the influence of additives on the properties (especially bonding) of copper coating has been studied using electrochemical methods. The results show that the optimal additives of pyrophosphate copper electroplating are C4H4O6KNa(25g/L)+ H2C2O4(25g/L)and C4H4O6KNa(25g/L),respectively.展开更多
文摘In this paper melamine pyrophosphate was synthesized by a new method. Its performances were showed and measured by the ways of elemental analysis, XRD, TG, DSC and IR. Its fireretardant mechanism and characteristic were discussed. Under burning, the fireretardant time of fivelayer wood panel coated the fireretardant paint is 24 min. The intumescent folds of the paint are 60~80.
文摘Copper pyrophosphate plating is the most important electroplating process which can instead of copper cyanide electroplating, but the biggest shortcoming is poor adhesion. In this paper, the influence of additives on the properties (especially bonding) of copper coating has been studied using electrochemical methods. The results show that the optimal additives of pyrophosphate copper electroplating are C4H4O6KNa(25g/L)+ H2C2O4(25g/L)and C4H4O6KNa(25g/L),respectively.