金属导热理论的研究进展与前沿问题

金属是人类使用最广泛的材料之一.相对于对金属力学性能的研究,金属导热性能的相关研究较为匮乏.对金属导热机制的理解往往还依赖于一百多年前建立的威德曼-弗朗兹定律.金属导热和电子输运有密切联系,同时又与晶格振动有关.深入理解金属导热机制,不但对材料应用意义重大,而且有利于提高对导热基本理论的认知.本文回顾了金属导热研究的历史,并对最近十几年来金属导热的研究进行了总结,特别是对基于第一原理电子-声子耦合模式分析的金属导热机理的研究进行了综述.此外,本文也对金属导热理论的未来发展方向进行了探讨.

导热绝缘高分子材料研究与制备

随着科技的日新月异,高频微电子元器件越来越受到广大人民的认知和使用。同时其性能如散热,精度、寿命等亦受到更多的关注。但是该类元件与绝缘导热高分子材料息息相关,提升这种材料的性能也成为现在的热点话题之一。在本文中对原有导热材料以及高分子聚合材料进行了详细的对比,提出了新颖的制备方案。且导热绝缘高分子材料相比于传统导热材料(金属、陶瓷),聚合物基导热复合材料具有质量轻和易于加工设计的优点。相信该类材料会在解决电器中相应的问题大放异彩。

Machine Learning Approach Accelerates Search for Solid State Electrolytes

In the current aera of rapid development in the field of electric vehicles and electrochemical energy storage,solid-state battery technology is attracting much research and attention.Solid-state electrolytes,as the key component of next-generation battery technology,are favored for their high safety,high energy density,and long life.However,finding high-performance solid-state electrolytes is the primary challenge for solid-state battery applications.Focusing on inorganic solid-state electrolytes,this work highlights the need for ideal solid-state electrolytes to have low electronic conductivity,good thermal stability,and structural and phase stability.Traditional experimental and theoretical computational methods suffer from inefficiency,thus machine learning methods become a novel path to intelligently predict material properties by analyzing a large number of inorganic structural properties and characteristics.Through the gradient descent-based XGBoost algorithm,we successfully predicted the energy band structure and stability of the materials,and screened out only 194 ideal solid-state electrolyte structures from more than 6000 structures that satisfy the requirements of low electronic conductivity and stability simultaneously,which greatly accelerated the development of solid-state batteries.

Microstructure and properties of SiC_p/Al electronic packaging shell produced by liquid-solid separation

The electronic packaging shell of high silicon carbide （54%SiC, volume fraction） aluminum-based composites was produced by liquid-solid separation technique. The characteristics of distribution and morphology of SiC as well as the shell’s fracture surface were examined by optical microscopy and scanning electron microscopy, and the thermo-physical and mechanical properties of the shell were also tested. The results show that Al matrix has a net-like structure while SiC is uniformly distributed in the Al matrix. The SiCp/Al composites have a low density of 2.93 g/cm^3, and its relative density is 98.7%. Thermal conductivity of the composites is 175 W/（·K）, coefficient of thermal expansion （CTE） is 10.3×10^-6 K-1 （25-400 ℃）, compressive strength is 496 MPa, bending strength is 404.5 MPa, and the main fracture mode is brittle fracture of SiC particles accompanied by ductile fracture of Al matrix.Its thermal conductivity is higher than that of Si/Al alloy, and its CTE matches with that of the chip material.

Properties and microstructure of Cu/diamond composites prepared by spark plasma sintering method

Cu/diamond composites have been considered as the next generation of thermal management material for electronic packages and heat sinks applications. Cu/diamond composites with different volume fractions of diamond were successfully prepared by spark plasma sintering（SPS） method. The sintering temperatures and volume fractions（50%, 60% and 70%） of diamond were changed to investigate their effects on the relative density, homogeneity of the microstructure and thermal conductivity of the composites. The results show that the relative density, homogeneity of the microstructure and thermal conductivity of the composites increase with decreasing the diamond volume fraction; the relative density and thermal conductivity of the composites increase with increasing the sintering temperature. The thermal conductivity of the composites is a result of the combined effect of the volume fraction of diamond, the homogeneity and relative density of the composites.

Microstructure and properties of electronic packaging box with high silicon aluminum-base alloy by semi-solid thixoforming

The electronic packaging box with high silicon aluminum-base alloy was prepared by semi-solid thixoforming technique.The flow characteristic of the Si phase was analyzed.The microstructures of different parts of the box were observed by optical microscopy and scanning electron microscopy,and the thermophysical and mechanical properties of the box were tested.The results show that there exists the segregation phenomenon between the primary Si phase and the liquid phase during thixoforming,the liquid phase flows from the box,and the primary Si phase accumulates at the bottom of the box.The volume fraction of primary Si phase decreases gradually from the bottom to the walls.Accordingly,the thermal conductivities of bottom center and walls are 107.6 and 131.5 W/（m·K）,the coefficients of thermal expansion（CTE） are 7.9×10-6 and 10.6×10-6 K-1,respectively.The flexural strength increases slightly from 167 to 180 MPa.The microstructures and properties of the box show gradient distribution overall.

On-Resistance Degradations Under Different Stress Conditions in High Voltage pLEDMOS Transistors and an Improved Method

The on-resistance degradations of the p-type lateral extended drain MOS transistor （pLEDMOS） with thick gate oxide under different hot carrier stress conditions are different, which has been experimentally investigated. This difference results from the interface trap generation and the hot electron injection, and trapping into the thick gate oxide and field oxide of the pLEDMOS transistor. An improved method to reduce the on-resistance degradations is also presented, which uses the field oxide as the gate oxide instead of the thick gate oxide. The effects are analyzed with a MEDICI simulator.

Improving tribological and thermal properties of Al alloy using CNTs and Nb nanopowder via SPS for power transmission conductor

This study aimed at improving the tribological and thermal properties of Al alloy using CNTs and Nb nanopowder as reinforcements and spark plasma sintering(SPS)as the fabrication method.The SPS was conducted at 630℃,30 MPa,10 min,and 200℃/min.The tribology test was run with ball-on-disc tribometer using steel ball as the counter body.And the thermal test was processed with thermogravimetric analyzer(TGA)and laser flash apparatus(LFA).Results showed that the addition of 8 wt.%CNTs and 8 wt.%Nb reinforcements respectively decreased the coefficient of friction(COF)of the composite by 79%.The wear volume of the composite was decreased by 23%,and so was the wear rate.However,the thermal conductivity of the composite was equally improved by 44%.The tribology improvement was stimulated by a C film generated by CNTs and a protective Nb2O5 formed by Nb nanopowder.The thermal conductivity was improved by the grain refining property of Nb and the high thermal conductivity of CNTs.Therefore,these results indicated that Al-CNTs-Nb composite is a robust material for high transmission conductor capable of reducing sag and ensuring the durability of the composite.

Optically Powered Temperature Measuring Instrument for Big Rotor

Abstract: A micro - power consumption non - contact temperature measuring instrument for big rotor is introduced. As it solves very well the signal coupling under high speed rotation and power supply problem for probe, the instrument can realize persistent on - line temperature measurement for big rotor drived by the ordinary light transmitted by optical fiber under the room light.

The First Principle Formula of the Relativistic Heat Conductivity of Coulomb Electronic Plasmas

Making use of the relativistic BBGKY technique,the relativistic generalization of Landau collision integral is obtained.Furthermore,we calculate the relativistic hydrodynamic modes up to the second order in the hydrodynamic wave number.Combining Résibois' method,we present the first principle formula of the relativistic heat conductivity of Coulomb electronic plasmas for low-order corrections.

SEM and Positron Annihilation Technology Investigation on the Defect Change with Thermal Treatment Temperature in GaP

Defects in S doped GaP single crystal which is prepared by LEC method were observed using SEM and positron lifetime,and its change with thermal treatment temperature was measured using positron annihilation spectrometer.The relationship between positron lifetime and the combination state of defects was discussed.

Fundamental Research on Convective Heat Transfer in Electronic Cooling Technology

During the past six years comprehensive research programs have been conducted at the Beijing Polytechnic University to provide a better understanding of heat transfer characteristics of existing and condidate cool- ing techniques for electronic and microelectronic devices.This paper provides a review and summary of the programs with emphasis on direct liquid cooling.Included in this review are the heat transfer investigations related to the following cooling modes:liquid free,mixed and forced convection,liquid jet impingement,flowing liquid film cooling,pool boiling,spray cooling,foreign gas jet impingement in liquid pool,and forced convection air-cooling.

Low-power memristors based on layered 2D SnSe/graphene materials

The emerging two-terminal memristor with a conductance-adjustable function under external stimulation is considered a strong candidate for use in artificial memory and electronic synapses. However, the stability, uniformity, and power consumption of memristors are still challenging in neuromorphic computing. Here an Au/SnSe/graphene/SiO_(2)/Si memristor was fabricated, incorporating two-dimensional graphene with high thermal conductivity. The device not only exhibits excellent electrical characteristics(e.g., high stability,good uniformity and a high ROFF/RON ratio), but also can implement biological synaptic functions such as paired-pulse facilitation, short-term plasticity and long-term plasticity. Its set and reset power values can be as low as 16.7 and 2.3 nW,respectively. Meanwhile, the resistance switching mechanism for the device, which might be associated with the formation and rupture of a filamentary conducting path consisting of Sn vacancies, was confirmed by high-resolution transmission electron microscopy observations. The proposed device is an excellent candidate for use in high-density storage and lowpower neuromorphic computing applications.

Ultralight conducting PEDOT:PSS/carbon nanotube aerogels doped with silver for thermoelectric materials

A significant enhancement in the thermoelectric performance was observed for three-dimensional conducting aerogels,which were obtained from poly（3,4-ethylenedioxythiophene）：poly（4-styrenesulfonic）（PEDOTrPSS） and multiwalled carbon nanotubes（MWCNTs） suspensions by adding different concentrations of metallic silver（Ag）.It was found that the electrical conductivity and Seebeck coefficient could be simultaneously increased with the unique structure.Moreover,the conducting aerogels have an ultralow thermal conductivity（0.06 W m^（-1） K^（-1） and a large Brunauer-Emmett-Teller surface area（228 m^2 g^（-1）.The highest figure of merit（zT） value in this study was 7.56×10^（-3） at room temperature upon the addition of 33.32 wt.%Ag.Although the zT value was too low,our work may provide new insights into the design and development of the thermoelectric material for applications.Further investigation with PEDOTrPSS aerogels will be continued to get an economical,lightweight,and efficient polymer thermoelectric material.

Enhanced thermoelectric performance of Cu_(12)Sb_4S_(13-δ) tetrahedrite via nickel doping

Cu12Sb4S13 tetrahedrite has received great attention as an earth-abundant and environmental-friendly thermoelectric material. This work aims to uncover the thermoelectric performance-enhancing effect and the mechanism of nickel doping on tetrahedrite. A series of Cu12-xNixSb4S13-δ（x = 0.5, 0.7, 1.0, 1.5 and 2.0） compounds were synthesized by mechanical alloying combined with spark plasma sintering. It is found that the thermal conductivity sharply reduces with increasing Ni content over the entire temperature range,0.9 W m^-1K^-1, accompanied with an enhanced thermoelectric power factor. The model predicted that the reduced lattice thermal conductivity is attributed to mid-frequency phonon scattering, caused by precipitates and dislocations resulting from Ni doping. Consequently, a high ZT value up to 0.95 at 723 K was achieved for Cu11NiSb4S13-δ, corresponding to a ~46% increase over non-doped Cu12Sb4S13-δ. Furthermore,the cyclic measurement showed that the Ni-doped tetrahedrites displayed high chemical stability.

Analysis of Heat Transfer Behaviour of the Conduction Cold Plate System

The heat-transfer behaviour of the conduction cold plate system used for avionics is investigated in this paper. The steady-state temperature profile for the cold plate is derived and the relationship between the coolant mass flowrate, the heat load and the hashest cold plate temperature is established.A model is proposed to describe the transient thermal rosponse of the cold plate under thermal shock condition. The analytic solution of the transient heat transfer within the cold plate is provided. The results of this paper agree with those of the finite element method and can be used for the structural design and performance evaluation of cold plate system.

Measuring the thermal conductivity and interfacial thermal resistance of suspended MoS2 using electron beam self-heating technique

Establishment of a new technique or extension of an existing technique for thermal and thermoelectric measurements to a more challenging system is an important task to explore the thermal and thermoelectric properties of various materials and systems. The bottleneck lies in the challenges in measuring the thermal contact resistance. In this work, we applied electron beam self-heating technique to derive the intrinsic thermal conductivity of suspended Molybdenum Disulfide （MoS2） ribbons and the thermal contact resistance, with which the interracial thermal resistance between few-layer MoS2 and Pt electrodes was calculated. The measured room temperature thermal conductivity of MoS2 is around -30 W/（m K）, while the estimated interracial thermal resistance is around -2 × 10 -6 m-2 K/W. Our experiments extend a useful branch in application of this technique for studying thermal properties of suspended layered ribbons and have potential application in investigating the interracial thermal resistance of different twodimensional （2D） heterojunctions.

Forced Convective Air Cooling from Electronic Component Arrays in a Parallel Plate Channel

This paper discusses air forced convection heat transfer from inline protruding elements arranged in eight rows. The streamwise and spanwise spacings between elements were varied using a splitter plate that can be positioned at three different modular configurations. A set of empirical formulas waspresented to correlate the experimental data for the design of air cooling systems. Arrays of components with one odd-size module have been tested also. Experimental results show that blocks near the entrance and behind the odd-size module have improved performance compared with uniform arrangements. Accordingly, temperature sensitive components are suggested to be arranged in these locations.

Existence of Classical Solutions to a Stationary Simplified Quantum Energy-Transport Model in 1-Dimensional Space

The existence of classical solutions to a stationary simplified quantum energytransport model for semiconductor devices in 1-dimensional space is proved.The model consists of a nonlinear elliptic third-order equation for the electron density,including a temperature derivative,an elliptic nonlinear heat equation for the electron temperature,and the Poisson equation for the electric potential.The proof is based on an exponential variable transformation and the Leray-Schauder fixed-point theorem.

Molecular Dynamics Simulation on Thermodynamic Properties and Transport Coefficients

Molecular dynamics simulation (MDS) is used to study the thermodynamic properties and transport coefficients of an argon system with Lennend-Jones potential. The results on the velocity distribution,mean free path, mean collision time, specific heat and self-diffusion coefficient agree well with the existing theoretical/ experimental data. It shows that molecular dynamics method is another bridge to connect microworld and macroworld.