The as-cast amorphous Ti_(48)Zr_(27)Cu_(6)Nb_(5)Be_(14)composites,comprising in situ formedβ-Ti ductile crystalline precipitates,were prepared by water cooled copper mold suction casting.Then,the semi-solid composite...The as-cast amorphous Ti_(48)Zr_(27)Cu_(6)Nb_(5)Be_(14)composites,comprising in situ formedβ-Ti ductile crystalline precipitates,were prepared by water cooled copper mold suction casting.Then,the semi-solid composites were obtained after the as-cast composites were treated by semi-solid isothermal treatment.The microstructure evolution and kinetics of the composites were examined.Results show that the microstructures of both the as-cast and semi-solid composites comprise ofβ-Ti crystal phases and amorphous matrix phases.Before and after treatment,the crystals evolve from fine granular or fine dendritic crystals to coarse crystals.As the treatment temperature increasing or the time prolonging,the average crystal size gradually increases and the surface morphology of the crystals gradually becomes regular.By studying the microstructural evolution and dynamics during the isothermal treatment process,it is found that the final morphology ofβ-Ti crystals is influenced by the isothermal treatment temperature and time(t),and theβ-Ti evolution rate increases with an increase in treatment temperature.In addition,a linear relationship was observed between the size of cubicβ-Ti crystals(D^(3))and t;the growth kinetics factor K is 3.8μm^(3)·s^(-1).As the K value closes to 4μm^(3)·s^(-1),it is inferred the morphology evolution ofβ-Ti crystals is a coarsening behavior controlled by the diffusion of solute elements.展开更多
The as-cast Ti_(48)Zr_(27)Cu_(6)Nb_(5)Be_(14)bulk metallic glass matrix composites(BMGMCs)were fabricated using a copper mold suction casting method.Then,the semi-solid BMGMC samples were obtained following an isother...The as-cast Ti_(48)Zr_(27)Cu_(6)Nb_(5)Be_(14)bulk metallic glass matrix composites(BMGMCs)were fabricated using a copper mold suction casting method.Then,the semi-solid BMGMC samples were obtained following an isothermal treatment(heating at 900°C for 10 min,then cooling with water).The microstructure and compression property were investigated by scanning electronic microscopy(SEM)and universal mechanical tester.As a result of the isothermal treatment,the crystal shapes change from fine,granular,and dendritic to spherical or vermicular,and the average crystal size of the as-cast and semi-solid samples is 2.2μm and 18.1μm,respectively.The plasticity increases from 5.31%in the as-cast to 10.23%in the semi-solid samples,with an increase of 92.66%.The shear bands from different areas of the side surfaces of as-cast and semisolid compression fracture samples were observed.The characteristic changes of multiplicity,bend,branch and intersection of shear bands in different areas indicate that the deformation of as-cast and semi-solid samples is non-uniform during compression.It is found that poor plasticity of the as-cast samples or good plasticity of the semi-solid samples are reflected by characteristics of the shear bands.The semi-solid isothermal treatment improves the plasticity by forming large crystals which can block the expansion of shear bands and promote the multiplicity of shear bands.展开更多
The diffusion process of Sn in the transformation of Nb_6Sn_5 to Nb_3Sn has been studied.The experimental results show that the growth of Nb_3Sn laver is controlled by two processes,i.e. the short range diffusion of S...The diffusion process of Sn in the transformation of Nb_6Sn_5 to Nb_3Sn has been studied.The experimental results show that the growth of Nb_3Sn laver is controlled by two processes,i.e. the short range diffusion of Sn which is responsihle for the inner layer with large grains,and the long,range diffusion of Sn which results in the outer layer with fine grains.It was found thai grain size depends on the reaction temperature.A model of Nb_3Sn growth based on the above processes was established and its solution was found to be in good agreement with ex- perimental results.展开更多
Segregation can seriously damage the mechanical properties of the aluminum alloys.6061 aluminum alloy wheel spokes were prepared by squeeze casting.To investigate the formation mechanism of segregation,the microstruct...Segregation can seriously damage the mechanical properties of the aluminum alloys.6061 aluminum alloy wheel spokes were prepared by squeeze casting.To investigate the formation mechanism of segregation,the microstructure of the alloy was observed using scanning electron microscopy,energy dispersive spectrometry,X-ray diffraction and electron microprobe analysis methods.The Gibbs energy of each phase during solidification was calculated by JMat Pro.Results show that the segregation phases in the R-joint of the wheel spokes are mainly composed of Mg_(2)Si,β-Al Fe Si and Al_(5)Cu_(2)Mg_(8)Si_(6)intermetallics.During the solidification of the 6061 aluminum alloy wheels,Mg_(2)Si andα-Al Fe Si phases precipitate in the mushy zone at first.With the decrease of temperature,α-Al Fe Si transforms intoβ-Al Fe Si,while Al_(5)Cu_(2)Mg_(8)Si_(6)precipitates from the solid-state aluminum alloy after solidification.Segregation at the R-joint of wheel spokes is mainly caused by insufficient cooling,so the cooling during alloy solidification should be enhanced to avoid segregation.展开更多
The effects of Ag on the microstructure and corrosion behavior of pre-soldering Sn-xAg lead-free solders,and on the formation of intermetallic layer of the solders with Cu substrate were investigated.The Ag contents(x...The effects of Ag on the microstructure and corrosion behavior of pre-soldering Sn-xAg lead-free solders,and on the formation of intermetallic layer of the solders with Cu substrate were investigated.The Ag contents(x)were 0,3.0,3.5,4.0,and5.0 wt.%.The Ag content played a role in the morphology of Ag3 Sn phase in the solders.The microstructure analysis showed that theβ-Sn phase was surrounded by eutectic networks in the 3.0 Ag and 3.5 Ag solders and large plate-like Ag3 Sn formed in the 4.0 Ag and5.0 Ag solders.Nonetheless,the Ag content slightly impacted the corrosion behavior of the as-cast solders as characterized using potentiodynamic polarization test.After soldering,only a single layer of a Cu6 Sn5 intermetallic compound formed at the Sn-xAg/Cu interface.By comparison,the Cu6 Sn5 intermetallic layer of the Ag-doped solders was thinner than that of the 0Ag solder.The fine Ag3 Sn particles in the eutectic networks precipitating in the 3.0 Ag and 3.5 Ag solders effectively hindered the growth of Cu6 Sn5 grains compared to large plate-like Ag3 Sn in the 4.0 and 5.0Ag solders.展开更多
Lithium metal batteries are emerging as a strong candidate in the future energy storage market due to its extremely high energy density.However,the uncontrollable lithium dendrites and volume change of lithium metal a...Lithium metal batteries are emerging as a strong candidate in the future energy storage market due to its extremely high energy density.However,the uncontrollable lithium dendrites and volume change of lithium metal anodes severely hinder its application.In this work,the porous Cu skeleton modified with Cu_(6)Sn_(5)layer is prepared via dealloying brass foil following a facile electroless process.The porous Cu skeleton with large specific surface area and high electronic conductivity effectively reduces the local current density.The Cu_(6)Sn_(5)can react with lithium during the discharge process to form lithiophilic Li_(7)Sn_(2)in situ to promote Li-ions transport and reduce the nucleation energy barrier of lithium to guide the uniform lithium deposition.Therefore,more than 300 cycles at 1 mA cm^(−2)are achieved in the half-cell with an average Coulombic efficiency of 97.5%.The symmetric cell shows a superior cycle life of more than 1000 h at 1 mA cm^(−2)with a small average hysteresis voltage of 16 mV.When coupled with LiFePO_(4)cathode,the full cell also maintains excellent cycling and rate performance.展开更多
The features of Cu_6Sn_5 growing slowly at lower temperature and growing rapidly up over 350℃,and or Cu_3Sn growing at higher temperatures,bave been detailedly observed under SEM.The increase of Pb content seems to i...The features of Cu_6Sn_5 growing slowly at lower temperature and growing rapidly up over 350℃,and or Cu_3Sn growing at higher temperatures,bave been detailedly observed under SEM.The increase of Pb content seems to inhibit sequentially the growth of Cu_6Sn_5 in Pb-Sn alloy.展开更多
Sn/ENIG has recently been used in flexible interconnects to form a more stable micron-sized metallurgical joint,due to high power capability which causes solder joints to heat up to 200℃.However,Cu_(6)Sn_(5)which is ...Sn/ENIG has recently been used in flexible interconnects to form a more stable micron-sized metallurgical joint,due to high power capability which causes solder joints to heat up to 200℃.However,Cu_(6)Sn_(5)which is critical for a microelectronic interconnection,will go through a phase transition at temperatures between 186 and 189℃.This research conducted an in-situ TEM study of a micro Cu/ENIG/Sn solder joint under isothermal aging test and proposed a model to illustrate the mechanism of the microstructural evolution.The results showed that part of the Sn solder reacted with Cu diffused from the electrode to formη´-Cu_(6)Sn_(5)during the ultrasonic bonding process,while the rest of Sn was left and enriched in a region in the solder joint.But the enriched Sn quickly diffused to both sides when the temperature reached 100℃,reacting with the ENIG coating and Cu to form(Ni_(x)Cu_(1-x))_(3)Sn_(4),AuSn_(4),and Cu_(6)Sn_(5)IMCs.After entering the heat preservation process,the diffusion of Cu from the electrode to the joint became more intense,resulting in the formation of Cu_(3)Sn.The scallop-type Cu_(6)Sn_(5)and the seahorse-type Cu_(3)Sn constituted a typical two-layered structure in the solder joint.Most importantly,the transition betweenηandη’was captured near the phase transition temperature for Cu_(6)Sn_(5)during both the heating and cooling process,which was accompanied by a volume shifting,and the transition process was further studied.This research is expected to serve as a reference for the service of micro Cu/ENIG/Sn solder joints in the electronic industry.展开更多
It is widely accepted that further development of Pb-free solder alloys for improved processing and in-service properties of next-generation electronics,can be accelerated through a fundamental understanding of phase ...It is widely accepted that further development of Pb-free solder alloys for improved processing and in-service properties of next-generation electronics,can be accelerated through a fundamental understanding of phase transformation and microstructure control in Pb-free solder joints.Advanced characterization techniques including synchrotron radiation provide a comprehensive toolset to measure the composition,crystallography,morphology,and properties of the major components of solder alloys.The research using such techniques is reviewed in detail including the characterization of the eff ects of microalloy additions on the microstructure and properties of Pb-free solder joints,especially those on the intermetallic phases.The discoveries outlined are of scientific and industrial relevance and have implications for new solder alloy composition design and the reliability of lead-free solder joints.展开更多
基金supported by the Natural Science Foundation of Hunan Province(No.2023JJ50453)the Science Research Excellent Youth Project of Hunan Educational Department(No.22B0777)+1 种基金the Key Scientific Research Project of Hunan Educational Department(No.22A0551)the Key Scientific Research Projects of Huaihua University(No.HHUY2022-13).
文摘The as-cast amorphous Ti_(48)Zr_(27)Cu_(6)Nb_(5)Be_(14)composites,comprising in situ formedβ-Ti ductile crystalline precipitates,were prepared by water cooled copper mold suction casting.Then,the semi-solid composites were obtained after the as-cast composites were treated by semi-solid isothermal treatment.The microstructure evolution and kinetics of the composites were examined.Results show that the microstructures of both the as-cast and semi-solid composites comprise ofβ-Ti crystal phases and amorphous matrix phases.Before and after treatment,the crystals evolve from fine granular or fine dendritic crystals to coarse crystals.As the treatment temperature increasing or the time prolonging,the average crystal size gradually increases and the surface morphology of the crystals gradually becomes regular.By studying the microstructural evolution and dynamics during the isothermal treatment process,it is found that the final morphology ofβ-Ti crystals is influenced by the isothermal treatment temperature and time(t),and theβ-Ti evolution rate increases with an increase in treatment temperature.In addition,a linear relationship was observed between the size of cubicβ-Ti crystals(D^(3))and t;the growth kinetics factor K is 3.8μm^(3)·s^(-1).As the K value closes to 4μm^(3)·s^(-1),it is inferred the morphology evolution ofβ-Ti crystals is a coarsening behavior controlled by the diffusion of solute elements.
基金supported by the National Natural Science Foundation of China(Nos.:51674144,11364031)the Luodi Research Plan of Jiangxi Educational Department(No.:KJLD14016)+1 种基金the Nature Science Foundation of Jiangxi Province(Nos.:20122BAB206021,20133ACB21003)the Jiangxi Province Young Scientists Cultivating Programs(No.:20122BCB23001)。
文摘The as-cast Ti_(48)Zr_(27)Cu_(6)Nb_(5)Be_(14)bulk metallic glass matrix composites(BMGMCs)were fabricated using a copper mold suction casting method.Then,the semi-solid BMGMC samples were obtained following an isothermal treatment(heating at 900°C for 10 min,then cooling with water).The microstructure and compression property were investigated by scanning electronic microscopy(SEM)and universal mechanical tester.As a result of the isothermal treatment,the crystal shapes change from fine,granular,and dendritic to spherical or vermicular,and the average crystal size of the as-cast and semi-solid samples is 2.2μm and 18.1μm,respectively.The plasticity increases from 5.31%in the as-cast to 10.23%in the semi-solid samples,with an increase of 92.66%.The shear bands from different areas of the side surfaces of as-cast and semisolid compression fracture samples were observed.The characteristic changes of multiplicity,bend,branch and intersection of shear bands in different areas indicate that the deformation of as-cast and semi-solid samples is non-uniform during compression.It is found that poor plasticity of the as-cast samples or good plasticity of the semi-solid samples are reflected by characteristics of the shear bands.The semi-solid isothermal treatment improves the plasticity by forming large crystals which can block the expansion of shear bands and promote the multiplicity of shear bands.
文摘The diffusion process of Sn in the transformation of Nb_6Sn_5 to Nb_3Sn has been studied.The experimental results show that the growth of Nb_3Sn laver is controlled by two processes,i.e. the short range diffusion of Sn which is responsihle for the inner layer with large grains,and the long,range diffusion of Sn which results in the outer layer with fine grains.It was found thai grain size depends on the reaction temperature.A model of Nb_3Sn growth based on the above processes was established and its solution was found to be in good agreement with ex- perimental results.
基金financially supported by the National Natural Science Foundation of China(Grant No.51875365)。
文摘Segregation can seriously damage the mechanical properties of the aluminum alloys.6061 aluminum alloy wheel spokes were prepared by squeeze casting.To investigate the formation mechanism of segregation,the microstructure of the alloy was observed using scanning electron microscopy,energy dispersive spectrometry,X-ray diffraction and electron microprobe analysis methods.The Gibbs energy of each phase during solidification was calculated by JMat Pro.Results show that the segregation phases in the R-joint of the wheel spokes are mainly composed of Mg_(2)Si,β-Al Fe Si and Al_(5)Cu_(2)Mg_(8)Si_(6)intermetallics.During the solidification of the 6061 aluminum alloy wheels,Mg_(2)Si andα-Al Fe Si phases precipitate in the mushy zone at first.With the decrease of temperature,α-Al Fe Si transforms intoβ-Al Fe Si,while Al_(5)Cu_(2)Mg_(8)Si_(6)precipitates from the solid-state aluminum alloy after solidification.Segregation at the R-joint of wheel spokes is mainly caused by insufficient cooling,so the cooling during alloy solidification should be enhanced to avoid segregation.
文摘The effects of Ag on the microstructure and corrosion behavior of pre-soldering Sn-xAg lead-free solders,and on the formation of intermetallic layer of the solders with Cu substrate were investigated.The Ag contents(x)were 0,3.0,3.5,4.0,and5.0 wt.%.The Ag content played a role in the morphology of Ag3 Sn phase in the solders.The microstructure analysis showed that theβ-Sn phase was surrounded by eutectic networks in the 3.0 Ag and 3.5 Ag solders and large plate-like Ag3 Sn formed in the 4.0 Ag and5.0 Ag solders.Nonetheless,the Ag content slightly impacted the corrosion behavior of the as-cast solders as characterized using potentiodynamic polarization test.After soldering,only a single layer of a Cu6 Sn5 intermetallic compound formed at the Sn-xAg/Cu interface.By comparison,the Cu6 Sn5 intermetallic layer of the Ag-doped solders was thinner than that of the 0Ag solder.The fine Ag3 Sn particles in the eutectic networks precipitating in the 3.0 Ag and 3.5 Ag solders effectively hindered the growth of Cu6 Sn5 grains compared to large plate-like Ag3 Sn in the 4.0 and 5.0Ag solders.
基金supported by the National Natural Science Foundation of China(52072173)the Jiangsu Province Outstanding Youth Fund(BK20200016)the International Cooperation of Jiangsu Province(SBZ2022000084)
文摘Lithium metal batteries are emerging as a strong candidate in the future energy storage market due to its extremely high energy density.However,the uncontrollable lithium dendrites and volume change of lithium metal anodes severely hinder its application.In this work,the porous Cu skeleton modified with Cu_(6)Sn_(5)layer is prepared via dealloying brass foil following a facile electroless process.The porous Cu skeleton with large specific surface area and high electronic conductivity effectively reduces the local current density.The Cu_(6)Sn_(5)can react with lithium during the discharge process to form lithiophilic Li_(7)Sn_(2)in situ to promote Li-ions transport and reduce the nucleation energy barrier of lithium to guide the uniform lithium deposition.Therefore,more than 300 cycles at 1 mA cm^(−2)are achieved in the half-cell with an average Coulombic efficiency of 97.5%.The symmetric cell shows a superior cycle life of more than 1000 h at 1 mA cm^(−2)with a small average hysteresis voltage of 16 mV.When coupled with LiFePO_(4)cathode,the full cell also maintains excellent cycling and rate performance.
文摘The features of Cu_6Sn_5 growing slowly at lower temperature and growing rapidly up over 350℃,and or Cu_3Sn growing at higher temperatures,bave been detailedly observed under SEM.The increase of Pb content seems to inhibit sequentially the growth of Cu_6Sn_5 in Pb-Sn alloy.
基金supported by the opening fund of National Key Research and Development Program of China(No.2020YFE0205300)Key Laboratory of Science and Technology on Silicon Devices,Chinese Academy of Sciences(No.KLSDTJJ2022-5)+1 种基金Chongqing Natural Science Foundation of China(No.cstc2021jcyj-msxmX1002)the Fundamental Research Funds for the Central Universities(No.AUGA5710051221).
文摘Sn/ENIG has recently been used in flexible interconnects to form a more stable micron-sized metallurgical joint,due to high power capability which causes solder joints to heat up to 200℃.However,Cu_(6)Sn_(5)which is critical for a microelectronic interconnection,will go through a phase transition at temperatures between 186 and 189℃.This research conducted an in-situ TEM study of a micro Cu/ENIG/Sn solder joint under isothermal aging test and proposed a model to illustrate the mechanism of the microstructural evolution.The results showed that part of the Sn solder reacted with Cu diffused from the electrode to formη´-Cu_(6)Sn_(5)during the ultrasonic bonding process,while the rest of Sn was left and enriched in a region in the solder joint.But the enriched Sn quickly diffused to both sides when the temperature reached 100℃,reacting with the ENIG coating and Cu to form(Ni_(x)Cu_(1-x))_(3)Sn_(4),AuSn_(4),and Cu_(6)Sn_(5)IMCs.After entering the heat preservation process,the diffusion of Cu from the electrode to the joint became more intense,resulting in the formation of Cu_(3)Sn.The scallop-type Cu_(6)Sn_(5)and the seahorse-type Cu_(3)Sn constituted a typical two-layered structure in the solder joint.Most importantly,the transition betweenηandη’was captured near the phase transition temperature for Cu_(6)Sn_(5)during both the heating and cooling process,which was accompanied by a volume shifting,and the transition process was further studied.This research is expected to serve as a reference for the service of micro Cu/ENIG/Sn solder joints in the electronic industry.
基金the funding from the National Natural Science Foundation of China(No.51904352)the Natural Science Foundation of Hunan Province(No.2020JJ5758)+3 种基金the State Key Laboratory of Solidification Processing in NPU(Grant No.SKLSP201904)funding from the University of Queensland-Nihon Superior Collaborative Research Programme(Grant No.2016001895)the Australian Research Council(ARC)Discovery(DP200101949)and Linkage(LP180100595)grantsthe financial support from JSPS KAKENHI(Grant No.JP17H06155)。
文摘It is widely accepted that further development of Pb-free solder alloys for improved processing and in-service properties of next-generation electronics,can be accelerated through a fundamental understanding of phase transformation and microstructure control in Pb-free solder joints.Advanced characterization techniques including synchrotron radiation provide a comprehensive toolset to measure the composition,crystallography,morphology,and properties of the major components of solder alloys.The research using such techniques is reviewed in detail including the characterization of the eff ects of microalloy additions on the microstructure and properties of Pb-free solder joints,especially those on the intermetallic phases.The discoveries outlined are of scientific and industrial relevance and have implications for new solder alloy composition design and the reliability of lead-free solder joints.
