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Fin Field Effect Transistor with Active 4-Bit Arithmetic Operations in 22 nm Technology
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作者 S.Senthilmurugan K.Gunaseelan 《Intelligent Automation & Soft Computing》 SCIE 2023年第2期1323-1336,共14页
A design of a high-speed multi-core processor with compact size is a trending approach in the Integrated Circuits(ICs)fabrication industries.Because whenever device size comes down into narrow,designers facing many po... A design of a high-speed multi-core processor with compact size is a trending approach in the Integrated Circuits(ICs)fabrication industries.Because whenever device size comes down into narrow,designers facing many power den-sity issues should be reduced by scaling threshold voltage and supply voltage.Initially,Complementary Metal Oxide Semiconductor(CMOS)technology sup-ports power saving up to 32 nm gate length,but further scaling causes short severe channel effects such as threshold voltage swing,mobility degradation,and more leakage power(less than 32)at gate length.Hence,it directly affects the arithmetic logic unit(ALU),which suffers a significant power density of the scaled multi-core architecture.Therefore,it losses reliability features to get overheating and increased temperature.This paper presents a novel power mini-mization technique for active 4-bit ALU operations using Fin Field Effect Tran-sistor(FinFET)at 22 nm technology.Based on this,a diode is directly connected to the load transistor,and it is active only at the saturation region as a function.Thereby,the access transistor can cutoff of the leakage current,and sleep transis-tors control theflow of leakage current corresponding to each instant ALU opera-tion.The combination of transistors(access and sleep)reduces the leakage current from micro to nano-ampere.Further,the power minimization is achieved by con-necting the number of transistors(6T and 10T)of the FinFET structure to ALU with 22 nm technology.For simulation concerns,a Tanner(T-Spice)with 22 nm technology implements the proposed design,which reduces threshold vol-tage swing,supply power,leakage current,gate length delay,etc.As a result,it is quite suitable for the ALU architecture of a high-speed multi-core processor. 展开更多
关键词 finfet(22 nm)technology diode connection arithmetic logic unit reduce threshold voltage swing gate length delay leakage power
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先进集成电路技术发展现状分析 被引量:1
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作者 张卫 《集成电路应用》 2017年第9期22-27,共6页
集成电路技术到22/20 nm节点,世界技术先进厂商和技术研究机构出现了分歧,如Intel率先采用Fin FET技术,而TSMC继续沿用平面体硅技术。未来,在摩尔定律的主旋律下,国际主要集成电路企业技术发展路线在各个节点不尽相同,各显神通。在半导... 集成电路技术到22/20 nm节点,世界技术先进厂商和技术研究机构出现了分歧,如Intel率先采用Fin FET技术,而TSMC继续沿用平面体硅技术。未来,在摩尔定律的主旋律下,国际主要集成电路企业技术发展路线在各个节点不尽相同,各显神通。在半导体存储器产品领域,先进集成电路技术面临的重大问题及挑战。针对我国当前电子信息技术良好的发展形势,进一步分析集成电路先进节点技术和存储器技术。 展开更多
关键词 集成电路技术 22/20 NM finfet 平面体硅 存储器技术 3D NAND
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