The first domestic 1×10^6rad（Si） total dose hardened 1.2μm partially depleted silicon-on-insulator （PDSOI） 64k SRAM fabricated in SIMOX is demonstrated.The address access time is independent of temperature f...The first domestic 1×10^6rad（Si） total dose hardened 1.2μm partially depleted silicon-on-insulator （PDSOI） 64k SRAM fabricated in SIMOX is demonstrated.The address access time is independent of temperature from -55 to 125℃ and independent of radiation up to 1×10^6rad（Si） for the supply voltage VDD.The standby current is 0.65μA before the total dose of radiation and is only 0.80mA after radiation exposure,which is much better than the specified 10mA.The operating power supply current is 33.0mA before and only 38.1mA afterward,which is much better than the specified 100mA.展开更多
The first domestic total dose hardened 2μm partially depleted silicon-on-insulator （PDSOI） CMOS 3-line to 8- line decoder fabricated in SIMOX is demonstrated. The radiation performance is characterized by transisto...The first domestic total dose hardened 2μm partially depleted silicon-on-insulator （PDSOI） CMOS 3-line to 8- line decoder fabricated in SIMOX is demonstrated. The radiation performance is characterized by transistor threshold voltage shifts,circuit static leakage currents,and I-V curves as a function of total dose up to 3× 10^5rad（Si）. The worst case threshold voltage shifts of the front channels are less than 20mV for nMOS transistors at 3 × 10^5rad（Si） and follow-up irradiation and less than 70mV for the pMOS transistors. Furthermore, no significant radiation induced leakage currents and functional degeneration are observed.展开更多
Partially-depleted silicon-on-insulator（PDSOI）floating-body（FB）nMOSFETs and H-gate type body-contacted（BC）nMOSFETs are fabricated with different back channel implantation dosages. The off-state breakdown charact...Partially-depleted silicon-on-insulator（PDSOI）floating-body（FB）nMOSFETs and H-gate type body-contacted（BC）nMOSFETs are fabricated with different back channel implantation dosages. The off-state breakdown characteristics of these devices are presented. The off-state breakdown voltages of the FB nMOSFETs increase from 5.2 to 6. 7V, and those of the H-gate type BC nMOSFETs decrease from 11.9 to 9V as the back channel implantation dosages increase from 1.0 ×10^13 to 1.3×10^13 cm^-2. By measuring the parasitic bipolar transistor static gain and the breakdown characteristics of the pn junction between the drain and the body, the differences between the breakdown mechanisms of the FB and H-gate type BC nMOSFETs are analyzed and explained qualitatively.展开更多
The body current lowering effect of 130 nm partially depleted silicon-on-insulator (PDSOI) input/output (I/O) n-type metal-oxide-semiconductor field-effect transistors (NMOSFETs) induced by total-ionizing dose is obse...The body current lowering effect of 130 nm partially depleted silicon-on-insulator (PDSOI) input/output (I/O) n-type metal-oxide-semiconductor field-effect transistors (NMOSFETs) induced by total-ionizing dose is observed and analyzed. The decay tendency of current ratio of body current and drain current I-b/I-d is also investigated. Theoretical analysis and TCAD simulation results indicate that the physical mechanism of body current lowering effect is the reduction of maximum lateral electric field of the pinch-off region induced by the trapped charges in the buried oxide layer (BOX). The positive charges in the BOX layer can counteract the maximum lateral electric field to some extent.展开更多
Total ionizing dose induced single transistor latchup effects for 130 nm partially depleted silicon-on-insulator （PDSOI） NMOSFETs with the bodies floating were studied in this work. The latchup phenomenon strongly c...Total ionizing dose induced single transistor latchup effects for 130 nm partially depleted silicon-on-insulator （PDSOI） NMOSFETs with the bodies floating were studied in this work. The latchup phenomenon strongly correlates with the bias configuration during irradiation. It is found that the high body doping concentration can make the devices less sensitive to the single transistor latchup effect, and the onset drain voltage at which latchup occurs can degrade as the total dose level rises. The mechanism of band-to-band tunneling （BBT） has been discussed. Two-dimensional simulations were conducted to evaluate the BBT effect. It is demonstrated that BBT combined with the positive trapped charge in the buried oxide （BOX） contributes a lot to the latchup effect.展开更多
The total dose effect of ^(60)Co γ-rays on 0.8μm H-gate partially depleted-silicon-on-insulator NMOS devices was investigated at different irradiation doses. The results show that the shift in saturation current at ...The total dose effect of ^(60)Co γ-rays on 0.8μm H-gate partially depleted-silicon-on-insulator NMOS devices was investigated at different irradiation doses. The results show that the shift in saturation current at high dose rate is greater than that at low dose rate, due to increase in interface-state density with decreasing dose rate; the scattering effect of interface state on electrons in the channel causes degradation in carrier mobility; and the body current and transconductance of the back gate enhance low-doserate sensitivity when the irradiation is under OFF-bias. A double transconductance peak is observed at 3 kGy(Si)under high dose rates.展开更多
The effects of total ionizing dose radiation on direct current （DC） and small-signal radio frequency （RF） performance of multi-finger RF partial deplete silicon-on-insulator lateral double diffused MOS （PDSOI LD...The effects of total ionizing dose radiation on direct current （DC） and small-signal radio frequency （RF） performance of multi-finger RF partial deplete silicon-on-insulator lateral double diffused MOS （PDSOI LDMOS） transistors are investigated. The radiation response of the LDMOS transistors with different device structures is characterized for an equivalent gamma dose up to 1Mrad（Si） at room temperature. The front and back gate threshold voltages, off-state leak- age, transconductance, and output characteristics are measured before and after radiation, and the results show a significant degradation of DC performance. Moreover, high frequency measurements for the irradiated transistors indicate remarkable declines of S-parameters, cutoff frequency, and maximum oscillation frequency to 1Mrad（Si） exposure levels. Compared to the transistors with the BTS contact structure,the transistors with the LBBC contact do not show its excellent DC radiation hardness when the transistors operate at alternating current （AC） mode.展开更多
In most of the total dose radiation models, the drift of the threshold voltage and the degradation of the carrier mobility were only studied when the bulk potential is zero. However, the measured data indicate that th...In most of the total dose radiation models, the drift of the threshold voltage and the degradation of the carrier mobility were only studied when the bulk potential is zero. However, the measured data indicate that the total dose effect is closely related to the bulk potential. In order to model the influence of the bulk potential on the total dose effect, we proposed a macro model. The change of the threshold voltage, carrier mobility and leakage current with different bulk potentials were all modeled in this model, and the model is well verified by the measured data based on the 0.35μm PDSOI process developed by the Institute of Microelectronics of the Chinese Academy of Sciences, especially the part of the leakage current.展开更多
Deep submicron partially depleted silicon on insulator （PDSOI） nMOSFETs were fabricated based on the 0.35μm SOI process developed by the Institute of Microelectronics of the Chinese Academy of Sciences （IMECAS）. ...Deep submicron partially depleted silicon on insulator （PDSOI） nMOSFETs were fabricated based on the 0.35μm SOI process developed by the Institute of Microelectronics of the Chinese Academy of Sciences （IMECAS）. Mechanisms determining short-channel effects （SCE） in PDSOI nMOSFETs are clarified based on experimental results of threshold voltage dependence upon gate length. The effects of body bias, drain bias, temperature and body contact on the SCE have been investigated. The SCE in SOI devices is found to be dependent on body bias, drain bias and body contact. Floating body devices show a more severe reverse short channel effect （RSCE） than devices with body contact structure. Devices with low body bias and high drain bias show a more obvious SCE.展开更多
Deep submicron partially depleted silicon on insulator（PDSOI） MOSFETs with H-gate were fabricated based on the 0.35μm SOI process developed by the Institute of Microelectronics of the Chinese Academy of Sciences. B...Deep submicron partially depleted silicon on insulator（PDSOI） MOSFETs with H-gate were fabricated based on the 0.35μm SOI process developed by the Institute of Microelectronics of the Chinese Academy of Sciences. Because the self-heating effect（SHE） has a great influence on SOI,extractions of thermal resistance were done for accurate circuit simulation by using the body-source diode as a thermometer.The results show that the thermal resistance in an SOI NMOSFET is lower than that in an SOI PMOSFET;and the thermal resistance in an SOI NMOSFET with a long channel is lower than that with a short channel.This offers a great help to SHE modeling and parameter extraction.展开更多
文摘The first domestic 1×10^6rad（Si） total dose hardened 1.2μm partially depleted silicon-on-insulator （PDSOI） 64k SRAM fabricated in SIMOX is demonstrated.The address access time is independent of temperature from -55 to 125℃ and independent of radiation up to 1×10^6rad（Si） for the supply voltage VDD.The standby current is 0.65μA before the total dose of radiation and is only 0.80mA after radiation exposure,which is much better than the specified 10mA.The operating power supply current is 33.0mA before and only 38.1mA afterward,which is much better than the specified 100mA.
文摘The first domestic total dose hardened 2μm partially depleted silicon-on-insulator （PDSOI） CMOS 3-line to 8- line decoder fabricated in SIMOX is demonstrated. The radiation performance is characterized by transistor threshold voltage shifts,circuit static leakage currents,and I-V curves as a function of total dose up to 3× 10^5rad（Si）. The worst case threshold voltage shifts of the front channels are less than 20mV for nMOS transistors at 3 × 10^5rad（Si） and follow-up irradiation and less than 70mV for the pMOS transistors. Furthermore, no significant radiation induced leakage currents and functional degeneration are observed.
文摘Partially-depleted silicon-on-insulator（PDSOI）floating-body（FB）nMOSFETs and H-gate type body-contacted（BC）nMOSFETs are fabricated with different back channel implantation dosages. The off-state breakdown characteristics of these devices are presented. The off-state breakdown voltages of the FB nMOSFETs increase from 5.2 to 6. 7V, and those of the H-gate type BC nMOSFETs decrease from 11.9 to 9V as the back channel implantation dosages increase from 1.0 ×10^13 to 1.3×10^13 cm^-2. By measuring the parasitic bipolar transistor static gain and the breakdown characteristics of the pn junction between the drain and the body, the differences between the breakdown mechanisms of the FB and H-gate type BC nMOSFETs are analyzed and explained qualitatively.
文摘The body current lowering effect of 130 nm partially depleted silicon-on-insulator (PDSOI) input/output (I/O) n-type metal-oxide-semiconductor field-effect transistors (NMOSFETs) induced by total-ionizing dose is observed and analyzed. The decay tendency of current ratio of body current and drain current I-b/I-d is also investigated. Theoretical analysis and TCAD simulation results indicate that the physical mechanism of body current lowering effect is the reduction of maximum lateral electric field of the pinch-off region induced by the trapped charges in the buried oxide layer (BOX). The positive charges in the BOX layer can counteract the maximum lateral electric field to some extent.
基金Project supported by Shanghai Municipal Natural Science Foundation,China(Grant No.15ZR1447100)
文摘Total ionizing dose induced single transistor latchup effects for 130 nm partially depleted silicon-on-insulator （PDSOI） NMOSFETs with the bodies floating were studied in this work. The latchup phenomenon strongly correlates with the bias configuration during irradiation. It is found that the high body doping concentration can make the devices less sensitive to the single transistor latchup effect, and the onset drain voltage at which latchup occurs can degrade as the total dose level rises. The mechanism of band-to-band tunneling （BBT） has been discussed. Two-dimensional simulations were conducted to evaluate the BBT effect. It is demonstrated that BBT combined with the positive trapped charge in the buried oxide （BOX） contributes a lot to the latchup effect.
基金supported by the National Natural Science Foundation of China(No.61376099)the Foundation for Fundamental Research of China(No.JSZL2016110B003)the Major Fundamental Research Program of Shaanxi(No.2017ZDJC-26)
文摘The total dose effect of ^(60)Co γ-rays on 0.8μm H-gate partially depleted-silicon-on-insulator NMOS devices was investigated at different irradiation doses. The results show that the shift in saturation current at high dose rate is greater than that at low dose rate, due to increase in interface-state density with decreasing dose rate; the scattering effect of interface state on electrons in the channel causes degradation in carrier mobility; and the body current and transconductance of the back gate enhance low-doserate sensitivity when the irradiation is under OFF-bias. A double transconductance peak is observed at 3 kGy(Si)under high dose rates.
基金National Nature Science Foundation of China(No.60576051)~~
文摘The effects of total ionizing dose radiation on direct current （DC） and small-signal radio frequency （RF） performance of multi-finger RF partial deplete silicon-on-insulator lateral double diffused MOS （PDSOI LDMOS） transistors are investigated. The radiation response of the LDMOS transistors with different device structures is characterized for an equivalent gamma dose up to 1Mrad（Si） at room temperature. The front and back gate threshold voltages, off-state leak- age, transconductance, and output characteristics are measured before and after radiation, and the results show a significant degradation of DC performance. Moreover, high frequency measurements for the irradiated transistors indicate remarkable declines of S-parameters, cutoff frequency, and maximum oscillation frequency to 1Mrad（Si） exposure levels. Compared to the transistors with the BTS contact structure,the transistors with the LBBC contact do not show its excellent DC radiation hardness when the transistors operate at alternating current （AC） mode.
基金Project supported by the State Key Development Program for Basic Research of China(No.2006CB3027-01)
文摘In most of the total dose radiation models, the drift of the threshold voltage and the degradation of the carrier mobility were only studied when the bulk potential is zero. However, the measured data indicate that the total dose effect is closely related to the bulk potential. In order to model the influence of the bulk potential on the total dose effect, we proposed a macro model. The change of the threshold voltage, carrier mobility and leakage current with different bulk potentials were all modeled in this model, and the model is well verified by the measured data based on the 0.35μm PDSOI process developed by the Institute of Microelectronics of the Chinese Academy of Sciences, especially the part of the leakage current.
文摘Deep submicron partially depleted silicon on insulator （PDSOI） nMOSFETs were fabricated based on the 0.35μm SOI process developed by the Institute of Microelectronics of the Chinese Academy of Sciences （IMECAS）. Mechanisms determining short-channel effects （SCE） in PDSOI nMOSFETs are clarified based on experimental results of threshold voltage dependence upon gate length. The effects of body bias, drain bias, temperature and body contact on the SCE have been investigated. The SCE in SOI devices is found to be dependent on body bias, drain bias and body contact. Floating body devices show a more severe reverse short channel effect （RSCE） than devices with body contact structure. Devices with low body bias and high drain bias show a more obvious SCE.
基金supported by the State Key Development Program for Basic Research of China(No.2006CB3027-01)
文摘Deep submicron partially depleted silicon on insulator（PDSOI） MOSFETs with H-gate were fabricated based on the 0.35μm SOI process developed by the Institute of Microelectronics of the Chinese Academy of Sciences. Because the self-heating effect（SHE） has a great influence on SOI,extractions of thermal resistance were done for accurate circuit simulation by using the body-source diode as a thermometer.The results show that the thermal resistance in an SOI NMOSFET is lower than that in an SOI PMOSFET;and the thermal resistance in an SOI NMOSFET with a long channel is lower than that with a short channel.This offers a great help to SHE modeling and parameter extraction.
