The effect of Sb content on the properties of Sn-Bi solders was studied. The nonequilibrium melting behaviors of a series of Sn-Bi-Sb solders were examined by differential scanning calorimetry （DSC）. The spreading t...The effect of Sb content on the properties of Sn-Bi solders was studied. The nonequilibrium melting behaviors of a series of Sn-Bi-Sb solders were examined by differential scanning calorimetry （DSC）. The spreading test was carried out to characterize the wettability of Sn-Bi-Sb solders on Cu substrate. The mechanical properties of the solders/Cu joints were evaluated. The results show that the ternary alloy solders contain eutectic structure resulting from quasi-peritetic reaction. With the increase of Sb content, the amount of the eutectic structure increases. At a heating rate of 5 ℃/min, Sn-Bi-Sb alloys exhibit a higher melting point and a wider melting range. A small amount of Sb has an impact on the wettability of Sn-Bi solders. The reaction layers form during spreading process. Sb is detected in the reaction layer while Bi is not detected. The total thickness of reaction layer between solder and Cu increases with the increase of the Sb content. The shear strength of the Sn-Bi-Sb solders increases as the Sb content increases.展开更多
Horizontal directional solidification experiments were carried out with a monophasic Sn-2%Sb（mass fraction） alloy to analyze the influence of solidification thermal parameters on the morphology and length scale of t...Horizontal directional solidification experiments were carried out with a monophasic Sn-2%Sb（mass fraction） alloy to analyze the influence of solidification thermal parameters on the morphology and length scale of the microstructure. Continuous temperature measurements were made during solidification at different positions along the length of the casting and these temperature data were used to determine solidification thermal parameters, including the growth rate（VL） and the cooling rate（TR）. High cooling rate cells and dendrites are shown to characterize the microstructure in different regions of the casting, with a reverse dendrite-to-cell transition occurring for TR5.0 K/s. Cellular（λc） and primary dendrite arm spacings（λ1） are determined along the length of the directionally-solidified casting. Experimental growth laws relating λc and λ1 to VL and TR are proposed, and a comparative analysis with results from a vertical upward directional solidification experiment is carried out. The influence of morphology and length scale of the microstructure on microhardness is also analyzed.展开更多
基金Project(51004039)supported by the National Natural Science Foundation of ChinaProject(2012713)supported by the Cooperation Promoting Foundation in Science and Technology of Shaoxing City,China
文摘The effect of Sb content on the properties of Sn-Bi solders was studied. The nonequilibrium melting behaviors of a series of Sn-Bi-Sb solders were examined by differential scanning calorimetry （DSC）. The spreading test was carried out to characterize the wettability of Sn-Bi-Sb solders on Cu substrate. The mechanical properties of the solders/Cu joints were evaluated. The results show that the ternary alloy solders contain eutectic structure resulting from quasi-peritetic reaction. With the increase of Sb content, the amount of the eutectic structure increases. At a heating rate of 5 ℃/min, Sn-Bi-Sb alloys exhibit a higher melting point and a wider melting range. A small amount of Sb has an impact on the wettability of Sn-Bi solders. The reaction layers form during spreading process. Sb is detected in the reaction layer while Bi is not detected. The total thickness of reaction layer between solder and Cu increases with the increase of the Sb content. The shear strength of the Sn-Bi-Sb solders increases as the Sb content increases.
基金the financial support provided by IFPA, Federal Institute of Education, Science and Technology of Para, FAPESP-Sao Paulo Research Foundation,Brazil (grants 2016/18186-1 and 2017/15158-0)CNPq,The Brazilian Research Council (grants 301600/2015-5 472745/2013-1 and 308784/2014-6)
文摘Horizontal directional solidification experiments were carried out with a monophasic Sn-2%Sb（mass fraction） alloy to analyze the influence of solidification thermal parameters on the morphology and length scale of the microstructure. Continuous temperature measurements were made during solidification at different positions along the length of the casting and these temperature data were used to determine solidification thermal parameters, including the growth rate（VL） and the cooling rate（TR）. High cooling rate cells and dendrites are shown to characterize the microstructure in different regions of the casting, with a reverse dendrite-to-cell transition occurring for TR5.0 K/s. Cellular（λc） and primary dendrite arm spacings（λ1） are determined along the length of the directionally-solidified casting. Experimental growth laws relating λc and λ1 to VL and TR are proposed, and a comparative analysis with results from a vertical upward directional solidification experiment is carried out. The influence of morphology and length scale of the microstructure on microhardness is also analyzed.
