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High Thermoelectric Figure of Merit of Ag8SnS6 Component Prepared by Electrodeposition Technique
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作者 TAHER Ghrib AMAL Lafy Al-Otaibi +2 位作者 MUNIRAH Abdullah Almessiere IBTISSEM Ben Assaker RADHOUANE Chtourou 《Chinese Physics Letters》 SCIE CAS CSCD 2015年第12期126-130,共5页
A new thermoelectric material Ag8SnS6, with ultra-low thermal conductivity in thin film shape, is prepared on indium tin oxide coated g/ass (ITO) substrates using a chemical process via the electrodeposition techniq... A new thermoelectric material Ag8SnS6, with ultra-low thermal conductivity in thin film shape, is prepared on indium tin oxide coated g/ass (ITO) substrates using a chemical process via the electrodeposition technique. The structural, thermal and electrical properties are studied and presented in detail, which demonstrate that the material is of semiconductor type, orthorhombic structure, with a band gap in the order of 1.56eV and a free carrier concentration of 1.46 × 10^17 cm-3. The thermal conductivity, thermal diffusivity, thermal conduction mode, Seebeck coefficient and electrical conductivity are determined using the photo-thermal deflection technique combined with the Boltzmann transport theory and Cahill's model, showing that the AgsSnS6 material has a low thermal conductivity of 3.8 Wm - 1K- 1, high electrical conductivity of 2.4 × 10^5 Sm- 1, Seebeck coefficient of -180μVK-1 and a power factor of 6.9mWK-2m-1, implying that it is more efficient than those obtained in recently experimental investigations for thermoelectric devices. 展开更多
关键词 Figure High Thermoelectric Figure of Merit of Ag8SnS6 component Prepared by Electrodeposition Technique Ag SnS
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