High corrosion and wear resistant electroless Ni–P gradient coatings on aviation aluminum alloy parts

A Ni–P alloy gradient coating consisting of multiple electroless Ni–P layers with various phosphorus contents was prepared on the aviation aluminum alloy. Several characterization and electrochemical techniques were used to characterize the different Ni–P coatings’ morphologies, phase structures, elemental compositions, and corrosion protection. The gradient coating showed good adhesion and high corrosion and wear resistance, enabling the application of aluminum alloy in harsh environments. The results showed that the double zinc immersion was vital in obtaining excellent adhesion (81.2 N). The optimal coating was not peeled and shredded even after bending tests with angles higher than 90°and was not corroded visually after 500 h of neutral salt spray test at 35℃. The high corrosion resistance was attributed to the misaligning of these micro defects in the three different nickel alloy layers and the amorphous structure of the high P content in the outer layer. These findings guide the exploration of functional gradient coatings that meet the high application requirement of aluminum alloy parts in complicated and harsh aviation environments.

Tribological Behaviors of Electroless Nickel-Boron Coating on Titanium Alloy Surface

Titanium alloys are excellent structural materials in engineering fields,but their poor tribological properties limit their further applications.Electroless plating is an effective method to enhance the tribological performance of alloys,but it is difficult to efficiently apply to titanium alloys,due to titanium alloy’s strong chemical activity.In this work,the electroless Nickel-Boron(Ni-B)coating was successfully deposited on the surface of titanium alloy(Ti-6AL-4V)via a new pre-treatment process.Then,linearly reciprocating sliding wear tests were performed to evaluate the tribological behaviors of titanium alloy and its electroless Ni-B coatings.It was found that the Ni-B coatings can decrease the wear rate of the titanium alloy from 19.89×10^(−3)mm^(3)to 0.41×10^(−3)mm^(3),which attributes to the much higher hardness of Ni-B coatings.After heat treatment,the hardness of Ni-B coating further increases corresponding to coating crystallization and hard phase formation.However,heat treatment does not improve the tribological performance of Ni-B coating,due to the fact that higher brittleness and more severe oxidative wear exacerbate the damage of heat-treated coatings.Furthermore,the Ni-B coatings heat-treated both in air and nitrogen almost present the same tribological performance.The finding of this work on electroless coating would further extend the practical applications of titanium alloys in the engineering fields.

XPS Studies on Electroless As-Deposited and Annealed Ni-P Films

Electroless deposition has been used to deposit Ni-P films on glass slides using the reducing agent sodium hypophosphite. This has been done with a purpose to use Ni-P films as back contact for silicon carbide radiation detectors. By keeping deposition time, temperature, pH and concentration of the precursor solution constant, the film deposition has been done. XPS studies were done to analyze the composition and stoichiometry of Ni-P thin films.

XPS Study of Electroless Deposited Sb2Se3 Thin Films for Solar Cell Absorber Material

As a thin film solar cell absorber material, antimony selenide (Sb2Se3) has become a potential candidate recently because of its unique optical and electrical properties and easy fabrication method. X-ray photoelectron spectroscopy (XPS) was used to determine the stoichiometry and composition of electroless Sb2Se3 thin films using depth profile studies. The surface layers were analyzed nearly stoichiometric. But the abundant amount of antimony makes the inner layer electrically more conductive.

Depth Profile Study of Electroless Deposited Sb2S3 Thin Films Using XPS for Photovoltaic Applications

Sb2S3 has gained tremendous research recently for thin film solar cell absorber material because of their easy synthesis, unique electrical and optical properties. The stoichiometry and composition of electroless Sb2S3 thin films were analyzed using XPS depth profile studies. The surface layers were found nearly stoichiometric. On the other hand, the inner layer was rich in antimony composition making it more conductive electrically.

Electroless Ni-P plating on Mg-Li alloy by two-step method

Pretreated Mg-Li alloy sheets were pre-plated in a NiCO3？2Ni（OH）2？4H2O solution to form a thin Ni-P alloy film and then plating in a NiSO4？6H2O solution was carried out to obtain a protective coating.The surface morphology,structure and corrosion resistance of the coating were studied.The results showed that a flat,bright and compact plating layer,which was integrated into the matrix metal,was obtained.The P content of the Ni-P coating reached 13.56%（mass fraction）.The hardness value of the Ni-P coating was about HV 549.The polarization curve showed that the corrosion potential of the Ni-P coating reached ？0.249 V（vs SCE）.A long passivation region was found on the polarization curve,and this phenomenon indicated that the coating has an excellent anti-corrosion property.

An in situ measure method to study deposition mechanism of electroless Ni-P plating on AZ31 magnesium alloy

An in situ method was designed to measure a continuous open circuit potential （OCP） curve of AZ31 magnesium alloy and to observe the morphology variation of Ni-P coating during the process of the electroless plating. The deposition mechanism of the electroless Ni-P plating on AZ31 Mg alloy was studied by OCP curve, scanning electron microscopy （SEM）, and energy dispersion spectroscopy （EDS）. The process of electroless Ni-P plating contains the coating formation stage and the coating growth stage. The formation stage includes three procedures, i.e., the nucleation and growth of Ni crystallites, the extension of the coating in two-dimensional （2D） direction and the coalescence of the coating along three-dimensional （3D） direction. SEM investigations demonstrate that the spherical nodules of the Ni-P coating are not only formed during the coating growth stage, but also generated in the initial deposition stage of electroless Ni-P plating. The variation of the coating rates at different deposition stages corresponds to the deposition mechanism of their respective deposition stage.

Structure and effects of electroless Ni-Sn-P transition layer during acid electroless plating on magnesium alloys

An electroless ternary Ni-Sn-P transition layer with high corrosion resistance was applied for acid electroless nickel plating on magnesium alloys. The surface morphologies and microstructure of the traditional alkaline electroless Ni-P and novel Ni-Sn-P transition layers were compared by SEM and XRD, and the bonding strengths between the transition layers and AZ31 magnesium alloys were tested. The corrosion resistance of the samples was analyzed by porosity test, potentiodynamic polarization, electrochemical impedance spectroscopy（EIS） in acid electroless solution at p H 4.5 and immersion test in 10% HCl. The results indicate that the transition layer is essential for acid electroless plating Ni-P coatings on magnesium alloys. Under the same thin thickness（-6 μm）, the electroless Ni-Sn-P transition layer possesses superior properties to the traditional Ni-P transition layer, including high amorphization, smooth and dense surface without pores, enhanced bonding strength and corrosion resistance. Most importantly, acid electroless Ni-P coatings can be successfully deposited on magnesium alloys by using Ni-Sn-P transition layer.

Effect of wear conditions on tribological properties of electrolessly-deposited Ni-P-Gr-SiC hybrid composite coating

The friction and wear properties of the electrolessly-deposited Ni-P-Gr-SiC composites were investigated. The effects of graphite content, load and rotation speed on the friction coefficient and wear resistance of the composite coatings were mainly investigated. The worn surface and cross section of the coatings were characterized by scanning electron microscopy and energy-dispersive X-ray analysis. The results show that the composite coatings reveal good antifriction and wear resistance due to the synergic effect of graphite and SiC particles. The formation of graphite-rich mechanically mixed layer （GRMML） on the surface of Ni-P-Gr-SiC coating contributes to the good tribological behavior of the wear counterparts and SiC particles play a load bearing role in protecting GRMML from shearing easily.

Effect of novel ternary ligand system on acidic electroless Ni-P plating on AZ91D magnesium alloy

The electroless Ni-P coatings on AZ91 D magnesium alloy substrate were prepared using the acidic hypophosphite-reduced electroless nickel bath containing the novel ternary ligand system. The results indicate that the deposition rate varies with the ternary ligand concentration in plating solution. The structural and morphological characteristics of the coatings were analyzed by XRD and SEM. The anticorrosion properties of the Ni-P coatings were evaluated in 3.5% NaCl solution by electrochemical impedance and potentiodynamic polarization methods. The amount of ternary ligands in electroless plating bath has an significant effect on the surface morphology and structure of Ni-P coatings. The decrease of crystallization temperature and increase of crystallization heat of all the deposits with an increase in ternary ligand concentration are found by DSC measurements. The coating obtained with 0.035 mol/L ternary ligand additive in plating bath can offer a better surface homogeneity and improve corrosion resistance.

Characteristics of microstructure and performance of laser-treated electroless Ni-P/Ni-W-P duplex coatings

Characteristics of microstructures of electroless Ni-P/Ni-W-P duplex coatings were investigated using SEM/EDX and XRD analysis techniques. Microhardness and wear behaviour of the coatings before and after laser crystallization were evaluated by measurements of hardnesses of coating surface and cross-section, and by unlubricated friction and wear experiments. The results indicate that it is possible to prepare electroless Ni-P/Ni-W-P duplex coatings by sequential immersion in two different plating baths. After laser crystallization, the microstructures of electroless Ni-P/Ni-W-P duplex coatings present the characteristics of higher degree of crystallization and larger grain size for outer layer Ni-W-P than inner Ni-P, but outer layer has a higher hardness. The wear resistance of laser-treated duplex coatings in a given process parameter conditions is superior to the as-plated ones. Laser treatment was performed directly in air without argon protection, which provides the possibility for application of industrialized production.

Progress of electroplating and electroless plating on magnesium alloy

The current research processes of electroplating and electroless Ni-P alloy plating on magnesium alloys were reviewed. Theoretically,the reason for difficulties in electroplating and electroless plating on magnesium alloys was given.The zinc immersion, copper immersion,direct electroless Ni-P alloy plating and electroplating and electroless plating on magnesium alloys prepared by chemical conversion coating were presented in detail.Especially,the research development of magnesium alloy AZ91 and AZ31 was discussed briefly.Based on the analysis,the existing problems and future research directions were then given.

Growing process and reaction mechanism of electroless Ni-Mo-P film on SiO_2 substrate

The diffusion barrier Ni-Mo-P film for Cu interconnects was prepared on SiO2/Si substrate using electroless method. The surface morphology and composition during the formation process of electroless Ni-Mo-P film were investigated through analyzing samples of different deposition time. Induced nucleation, induced co-deposition, and self-induced growth mechanisms involved in electroless process were confirmed by field-emission scanning electron microscopy （FE-SEM）, energy dispersive spectrometry and atomic force microscopy （AFM）. Firstly, the preceding palladium particles as catalysts induce the nucleation of nickel. Secondly, the nickel particles induce the deposition of molybdenum and phosphorus, which attributes to induced co-deposition. Thirdly, former deposited Ni-Mo-P induces deposition of the latter Ni-Mo-P particles. Moreover, the reaction mechanism was proposed with the oxydate of 3-4PO .

Electroless copper-phosphorus coatings with the addition of silicon carbide (SiC) particles

Cu-P-silicon carbide （SiC） composite coatings were deposited by means of electroless plating.The effects of pH values,temperature,and different concentrations of sodium hypophosphite （NaH2PO2·H2O）,nickel sulfate （NiSO4·6H2O）,sodium citrate （C6H5Na3O7·2H2O） and SiC on the deposition rate and coating compositions were evaluated,and the bath formulation for Cu-P-SiC composite coatings was optimised.The coating compositions were determined using energy-dispersive X-ray analysis （EDX）.The corresponding optimal operating parameters for depositing Cu-P-SiC are as follows：pH 9;temperature,90oC;NaH2PO2·H2O concentration,125 g/L;NiSO4·6H2O concentration,3.125 g/L;SiC concentration,5 g/L;and C6H5Na3O7·2H2O concentration,50 g/L.The surface morphology of the coatings analysed by scanning electron microscopy （SEM） shows that Cu particles are uniformly distributed.The hardness and wear resistance of Cu-P composite coatings are improved with the addition of SiC particles and increase with the increase of SiC content.

High corrosion resistance of electroless Ni-P with chromium-free conversion pre-treatments on AZ91D magnesium alloy

Phosphate-manganese, tannic acid and vanadium conversion coatings were proposed as an effective pre-treatment layer between electroless Ni-P coating and AZ91D magnesium alloy substrate to replace the traditional chromate plus HF pre-treatment. The electrochemical results show that the chrome-free coatings plus electroless Ni-P coating on the magnesium alloy has the lowest corrosion current density and most positive corrosion potential compared with chromate plus electroless Ni-P coating on the magnesium alloy. These proposed pre-treatment layers on the substrate reduce the corrosion of magnesium during plating process, and reduce the potential difference between the matrix and the second phase. Thus, an electroless Ni-P coating with fine crystalline and dense structure was obtained, with preferential phosphorus content, low porosity, good corrosion-resistance and strengthened adhesion than the chromate plus electroless Ni-P.

Electroless plating and growth kinetics of Ni-P alloy film on SiC_p/Al composite with high SiC volume fraction

After Sn/Pd activating, the SiCp/Al composite with 65% SiC (volume fraction) was coated by electroless Ni?P alloy plating. Surface morphology of the composite and its effect on the Ni?P alloy depositing process and bonding action of Ni and P atoms in the Ni?P alloy were studied. The results show that inhomogeneous distribution of the Sn/Pd activating points results in preferential deposition of the Ni?P alloy particles on the Al alloy and rough SiC particle surfaces and in the etched caves. The Ni?P alloy film has an amorphous structure where chemical bonding between Ni and P atoms exists. After a continuous Ni?P alloy film formed, electroless Ni?P alloy plating is not affected by surface morphology and characteristics of the SiCp/Al composite any longer, but by the electroless plating process itself. The Ni?P alloy film follows linear growth kinetics with an activation energy of 68.44 kJ/mol.

Parameters optimization of electroless deposition of Cu on Cr-coated diamond

Electroless copper plating on diamond particles precoated with 1%Cr was carried out to evaluate the effects of various experimental parameters on coating quality and deposition rate to obtain the optimized reaction parameters. The formulated samples under optimized parameters were characterized by X-ray diffraction, scanning electron microscopy, energy dispersive spectroscopy, X-ray photoelectron spectra and optical microscopy. The best parameters, where uniform and maximum coating thickness was achieved, are etching with 20%NaOH for 30 min, sensitization and activation with SnCl2 and PdCl2 for 5 and 20 min, respectively. The composition of the copper solution bath was 16 g/L CuSO4＆#183;5H2O, 35 mL/L formaldehyde （HCHO）, 23 g/L KNaC4H4O6 at 60 ℃, pH=13 and stirring at （350±15） r/min under ultrasonication.

Homogenization pretreatment and electroless Ni-P plating on AZ91D magnesium alloy

Electroless nickel plating on AZ91D substrate with a new and eco-friendly pretreatment process based on tuning an electrochemical homogeneous surface was investigated. The morphology, deposition process, chemical composition and microstructure of Ni-P coating were studied. It is indicated that β phases are selectively removed, producing a microstructural homogeneous surface and the subsequent uniform and compact Zn immersion layer. A defect-free and well adhesive Ni-P coating can be successfully obtained due to its uniform nucleation and growth based on such pretreatment. Potentiodynamic polarization and electrochemical impedance spectroscopy （EIS） tests reveal that Ni-P coating could significantly improve the corrosion resistance of AZ91D substrate.

Preparation of electromagnetic shielding wood-metal composite by electroless nickel plating

Electrical and electromagnetic shielding wood metal composite was prepared by using electroless nickel plating. The effects of solution amount, plating time and plating temperature on surface resistivity and electromagnetic shielding effectiveness were investigated. And P content, microstructure and surface feature of layers obtained at different temperatures were analyzed by energy dispersion spectrometer （EDS）, X-ray diffraction （XRI）） and scanning electron microscopy （SEM）. The results showed that layers with higher electro-conductivity and electromagnetic shielding effectiveness were obtained under the optimum conditions that plating solution was 500 mL, plating time was 30 min and plating temperature was 62℃. The results showed by EDS analysis; that P content increased gradually in a small extent with plating temperature increased. It was showed by XRD and SEM analysis that layers plated at different temperatures were all microcrystalline structure and uniform and successive, which had noticeable metal luster. Those indicated that plating temperature had little influence on microstructure and surface feature under pH value invariable.

Copper-Ti_3SiC_2 composite powder prepared by electroless plating under ultrasonic environment

In this article, a new type of Cu-Ti3SiC2 composite powder prepared using the electroless plating technique was introduced. The initial Ti3SiC2 particles are 11 μm in diameter on an average. The Cu plating was carried out at middle temperature （62-65℃） with the application of ultrasonic agitation. The copper deposition rate was determined by measuring the weight gain of the powder after plating. It has been found that the pretreatment of Ti3SiC2 powder is very important to obtain copper nanoparticles on the surface of Ti3SiC2 The optimum procedure before plating aimed to add activated sites and the adjustment of the traditional composition of the electroless copper plating bath could decelerate the copper deposition rate to 0.8 gm/h. X-ray diffraction （XRD） indicates that the chemical composition of the plating layer is copper. SEM images show that the surface of the Ti3SiC2 particles is successfully coated with continuous copper layer. The wetting property between the copper matrix and Ti3SiC2 can be improved so as to increase the interfacial strength.