Representation Theory of Three-Dimensional Elliptical Crack Under Dynamic Loading

The relation between the normal displacement on the surface of a dynamical elliptical crack and the normal stress over the crack surface was studied. The three dimensional elastodynamic equations and Fourier Laplace transforms are used. Based on the influence function and the inversion of integral transforms, one can find that if the distribution of normal displacement on the surface of a dynamic elliptical crack is a polynomial of degree n in x 1 and x 2 , then the normal pressure acting over the ellipse is also a polynomial P n(x 1,x 2) of the same degree in x 1 and x 2 .

Three dimensional K-Tz stress fields around the embedded center elliptical crack front in elastic plates

Through detailed three-dimensional （3D） finite element （FE） calculations, the out-of-plane constraints Tz along embedded center-elliptical cracks in mode I elastic plates are studied. The distributions of Tz are obtained near the crack front with aspect ratios （a/c） of 0.2, 0.4, 0.5, 0.6, 0.8 and 1.0. Tz decreases from an approximate value of Poisson ratio v at the crack tip to zero with increasing normalized radial distances （r/a） in the normal plane of the crack front line, and increases gradually when the elliptical parameter angle φ changes from 0° to 90°at the same r/a. With a/c rising to 1.0, Tz is getting nearly independent of φ and is only related to r/a. Based on the present FE calculations for Tz, empirical formulas for Tz are obtained to describe the 3D distribution of Tz for embedded center-elliptical cracks using the least squares method in the range of 0.2 ≤ a/c ≤ 1.0. These Tz results together with the corresponding stress intensity factor K are well suitable for the analysis of the 3D embedded centerelliptical crack from field, and a two-parameter K-Tz principle is proposed.

A NOVEL METHOD FOR EXACT SOLUTIONS OF ELLIPTICAL CRACKS IN PIEZOELECTRICS

According to the constitutive relationship in linear piezoceramics, elliptical crack problems in the impermeable case are reconsidered with the hypersingular integral equation method. Unknown displacement and electric potential jumps in the integral equations are approximated with a product of the fundamental density function and polynomials, in which the fundamental density function reflects the singular behavior of electroelastic fields near the crack front and the polynomials can be reduced to a real constant under uniform loading. Ellipsoidal coordinates are cleverly introduced to solve the unknown displacement and electric potential jumps in the integral equations under uniform loading. With the help of these solutions and definitions of electroelastic field intensity factors, exact expressions for mode Ⅰ, mode Ⅱ and mode Ⅲ stress intensity factors as well as the mode Ⅳ electric displacement intensity factor are obtained. The present results under uniform normal loading are the same as the available exact solutions, but those under uniform shear loading have not been found in the literature as yet.

THREE-DIMENSIONAL ELLIPTIC CRACK UNDER IMPACT LOADING

The dynamic stress intensity factor of a three-dimensionalelliptic crack under impact loading is determined with the finiteelement method. The computation results can take into account theinfluence of time and the ratio of the wave speeds on the stressintensity factor. The present method is suitable not only forthree-dimensional dynamic crack, but also for three-dimensionaldynamic contact.

Exact analytic solutions for an elliptic hole with asymmetric collinear cracks in a one-dimensional hexagonal quasi-crystal

Using the complex variable function method and the technique of conformal mapping, the anti-plane shear problem of an elliptic hole with asymmetric colfinear cracks in a one-dimensional hexagonal quasi-crystal is solved, and the exact analytic solutions of the stress intensity factors （SIFs） for mode Ⅲ problem are obtained. Under the limiting conditions, the present results reduce to the Griffith crack and many new results obtained as well, such as the circular hole with asymmetric collinear cracks, the elliptic hole with a straight crack, the mode T crack, the cross crack and so on. As far as the phonon field is concerned, these results, which play an important role in many practical and theoretical applications, are shown to be in good agreement with the classical results.

CONVOLUTION OF THE IMPACT THREE-DIMENSIONAL ELASTO-DYNAMICS AND DYNAMIC STRESS INTENSITY FACTOR FOR AN ELLIPTIC CRACK

This paper presents a formulation for three-dimensional elasto-dynamics with an elliptic crack based on the Laplace and Fourier transforms and the convolution theorem. The dynamic stress intensity factor for the crack is determined by solving a Fredholm integral equation of the first kind. The results of this paper are very close to those given by the two-dimensional dual integral equation method.

Analytic solutions to problem of elliptic hole with two straight cracks in one-dimensional hexagonal quasicrystals

By means of the complex variable function method and the technique of conformal mapping, the anti-plane shear problem of an elliptic hole with two straight cracks in one-dimensional hexagonal quasicrystals is investigated. The solution of the stress intensity factor （SIF） for mode III problem has been found. Under the condition of limitation, both the known results and the SIF solution at the crack tip of a circular hole with two straight cracks and cross crack in one-dimensional hexagonal quasicrystals can be obtained.

Analytical solution for the stress field of hierarchical defects:multiscale framework and applications

Hierarchical defects are defined as adjacent defects at different length scales.Involved are the two scales where the stress field distribution is interrelated.Based on the complex variable method and conformal mapping,a multiscale framework for solving the problems of hierarchical defects is formulated.The separated representations of mapping function,the governing equations of potentials,and the stress field are subsequently obtained.The proposed multiscale framework can be used to solve a variety of simplified engineering problems.The case in point is the analytical solution of a macroscopic elliptic hole with a microscopic circular edge defect.The results indicate that the microscopic defect aggregates the stress concentration on the macroscopic defect and likely leads to global propagation and rupture.Multiple micro-defects have interactive effects on the distribution of the stress field.The level of stress concentration may be reduced by the coalescence of micro-defects.This work provides a unified method to analytically investigate the influence of edge micro-defects within the scope of multiscale hierarchy.The formulated multiscale approach can also be potentially applied to materials with hierarchical defects,such as additive manufacturing and bio-inspired materials.

Damage evolution and crack propagation in rocks with dual elliptic flaws in compression

To give an insight into the understanding of damage evolution and crack propagation in rocks,a series of uniaxial and biaxial compression numerical tests are carried out.The investigations show that damage evolution occurs firstly in the weak rock,the area around the flaw and the area between the flaw and the neighboring rock layer.Cracks mostly generate as tensile cracks under uniaxial compression and shear cracks under biaxial compression.Crack patterns are classified and divided.The relationship between the accumulated lateral displacement and the short radius（b）is fitted,and the equation of crack path is also established.