Surface Metallization of Glass Fiber(GF)/Polyetheretherketone(PEEK) Composite with Cu Coatings Deposited by Magnetron Sputtering and Electroplating

Surface metallization of glass fiber(GF)/polyetheretherketone(PEEK)[GF/PEEK] is conducted by coating copper using electroplating and magnetron sputtering and the properties are determined by X-ray diffraction(XRD), scanning electron microscopy(SEM), and electron backscatter diffraction(EBSD).The coating bonding strength is assessed by pull-out tests and scribing in accordance with GB/T 9286-1998.The results show that the Cu coating with a thickness of 30 μm deposited on GF/PEEK by magnetron sputtering has lower roughness, finer grain size, higher crystallinity, as well as better macroscopic compressive stress,bonding strength, and electrical conductivity than the Cu coating deposited by electroplating.

Arbitrary skin metallization by pencil-writing inspired solid-ink rubbing for advanced energy storage and harvesting

The development of a durable metallic coating on diverse substrates is both intriguing and challenging,particularly in the research of metal-conductive materials for applications such as batteries,soft electronics,and beyond.Herein,by learning from the pencil-writing process,a facile solid-ink rubbing technology(SIR-tech)is invented to address the above challenge.The solid-ink is exampled by rational combination of liquid metal and graphite particles.By harnessing the synergistic effects between rubbing and adhesion,controllable metallic skin is successfully formed onto metals,woods,ceramics,and plastics without limitation in size and shape.Moreover,outperforming pure liquid-metal coating,the composite metallic skin by SIR-tech is very robust due to the self-lamination of graphite nanoplate exfoliated by liquid-metal rubbing.The critical factors controlling the structures-properties of the composite metallic skin have been systematically investigated as well.For applications,the SIR-tech is demonstrated to fabricate high-performance composite current collectors for next-generation batteries without traditional metal foils.Meanwhile,advanced skin-electrodes are further demonstrated for stable triboelectricity generation even under temperature fluctuation from-196 to 120℃.This facile and highly-flexible SIR-tech may work as a powerful platform for the studies on functional coatings by liquid metals and beyond.

Electric-field control of perpendicular magnetic anisotropy by resistive switching via electrochemical metallization

Electric-field control of perpendicular magnetic anisotropy(PMA) is a feasible way to manipulate perpendicular magnetization,which is of great importance for realizing energy-efficient spintronics.Here,we propose a novel approach to accomplish this task at room temperature by resistive switching(RS) via electrochemical metallization(ECM) in a device with the stack of Si/SiO_(2)/Ta/Pt/Ag/Mn-doped ZnO(MZO)/Pt/Co/Pt/ITO.By applying certain voltages,the device could be set at high-resistance-state(HRS) and low-resistance-state(LRS),accompanied with a larger and a smaller coercivity(H_(C)),respectively,which demonstrates a nonvolatile E-field control of PMA.Based on our previous studies and the present control experiments,the electric modulation of PMA can be briefly explained as follows.At LRS,the Ag conductive filaments form and pass through the entire MZO layer and finally reach the Pt/Co/Pt sandwich,leading to weakening of PMA and reduction of H_(C).In contrast,at HRS,most of the Ag filaments dissolve and leave away from the Pt/Co/Pt sandwich,causing partial recovery of PMA and an increase of H_(C).This work provides a new clue to designing low-power spintronic devices based on PMA films.

Characteristics of highly differentiated granite and metallization of tungsten-tin, rare and rare earth metal in the eastern Nanling region, China

1 Introduction Massive tungsten-tin,rare and rare earth metals ore deposits were formed with the widespread granite magmatic activity in early Yanshanian period in the eastern Nanling region.Recent studies indicate that the Yanshanian highly differentiated-granite formation is closely related to the deposits of tungsten and tin,rare and rare earth metals mineralization in the region(Xiao

Efficient metallization of magnetite concentrate by reduction with agave bagasse as a source of reducing agents

The reduction behavior and metallization degree of magnetite concentrate with agave bagasse were investigated in an inert atmosphere.The effects of temperature,biomass content,and residence time on reduction experiments and metallization degree were investigated by X-ray diffraction and scanning electron microscopy.Compared with other types of biomass,agave bagasse had lower contents of nitrogen,sulfur,and ash.X-ray diffraction analysis showed that the metallization degree improved with increasing temperature and biomass content.Complete metallization was achieved at 1100℃ for 30 min with 65:35 and 50:50 ratios of the magnetite concentrate to the agave bagasse.These results demonstrate that agave bagasse promotes the efficient metallization of magnetite concentrate without the external addition of a reducing agent.Therefore,this biomass is a technical suitable alternative to replace fossil fuels in steelmaking.

Surface metallization of PTFE and PTFE composites by ion implantation for low-background electronic substrates in rare-event detection experiments

Polytetrafluoroethylene(PTFE)is a low-background polymer that is applied to several applications in rare-event detection and underground low-background experiments.PTFE-based electronic substrates are important for reducing the detection limit of high-purity germanium detectors and scintillator calorimeters,which are widely applied in dark matter and 0υββdetection experiments.The traditional adhesive bonding method between PTFE and copper is not conducive to working in liquid nitrogen and extremely low-temperature environments.To avoid adhesive bonding,PTFE must be processed for surface metallization owing to the mismatch between the PTFE and copper conductive layer.Low-background PTFE matrix composites(m-PTFE)were selected to improve the electrical and mechanical properties of PTFE by introducing SiO_(2)/TiO_(2) particles.The microstructures,surface elements,and electrical properties of PTFE and m-PTFE were characterized and analyzed following ion implantation.PTFE and m-PTFE surfaces were found to be broken,degraded,and cross-linked by ion implantation,resulting in C=C conjugated double bonds,increased surface energy,and increased surface roughness.Comparably,the surface roughness,bond strength,and conjugated double bonds of m-PTFE were significantly more intense than those of PTFE.Moreover,the interface bonding theory between PTFE and the metal copper foil was analyzed using the direct metallization principle.Therefore,the peel strength of the optimized electronic substrates was higher than that of the industrial standard at extremely low temperatures,while maintaining excellent electrical properties.

Biota and Organic Matter in the Late Sinian and EarlyCambrian Black Rock Series of West Hunan andIts Significance for Metallization

Abstract: A great amount of black rock series has been found in the Upper Sinian Members 2 and 4 of the Jinjiadong Formation, middle-upper Liuchapo Formation and the Lower Cambrian Xiaoyanxi Formation in West Hunan, which is associated with periodic sea-level changes. By the studies of relationships between the distribution and development of the biota and the abundance of Au, Ag, U, V, Ni, Mo and Cu in the Upper Sinian and Early Cambrian black rock series in Cili, Dayong, Yuanling, Xupu and Qianyang of West Hunan, central China, it has been revealed that the enrichment of Ag, V, and Mo is related with the development of multi-cell plants and vendotaenides, and that of Cu and Ni is related to flourishing of bacteria and shelly fossils. The black rock series in the study area contains abundant organic matter, among which the siliceous shale contains the highest TOC, amounting to 4.51–13.4%. All the values of the equivalent vitrinite reflectance (medium values) determinated with the IR-spectroscopic method in the area are over 2.65%, indicating that the organic evolution was at an overmature stage. Due to the effect of enhancement of organic maturation by hydrothermal fluids, the Upper Sinian and Lower Cambrian had a reverse organic maturity profile in most areas of West Hunan. The enrichment of Ag, V, Ni, Mo and U is a result of organic absorption, and that of Au might be attributed to the migration by hydrothermal fluids.

High-pressure investigations on the isostructural phase transition and metallization in realgar with diamond anvil cells

The high-pressure structural,vibrational and electrical properties for realgar were investigated by in-situ Raman scattering and electrical conductivity experiments combined with first-principle calculations up to~30.8 GPa.It was verified that realgar underwent an isostructural phase transition at~6.3 GPa and a metallization at a higher pressure of~23.5 GPa.The isostructural phase transition was well evidenced by the obvious variations of Raman peaks,electrical conductivity,crystal parameters and the As–S bond length.The phase transition of metallization was in closely associated with the closure of bandgap rather than caused by the structural phase transition.And furthermore,the metallic realgar exhibited a relatively low compressibility with the unit cell volume V_(0)=718.1.4Å^(3)and bulk modulus B_(0)=36.1 GPa.

Review on Metallization Approaches for High-Efficiency Silicon Heterojunction Solar Cells

Crystalline silicon(c-Si)heterojunction(HJT)solar cells are one of the promising technologies for next-generation industrial high-efficiency silicon solar cells,and many efforts in transferring this technology to high-volume manufacturing in the photovoltaic(PV)industry are currently ongoing.Metallization is of vital importance to the PV performance and long-term reliability of HJT solar cells.In this review,we summarize the development status of metallization approaches for highefficiency HJT solar cells.For conventional screen printing technology,to avoid the degradation of the passivation properties of the amorphous silicon layer,a low-temperature-cured(<250℃)paste and process are needed.This process,in turn,leads to high line/contact resistances and high paste costs.To improve the conductivity of electrodes and reduce the metallization cost,multi-busbar,fine-line printing,and low-temperature-cured silver-coated copper pastes have been developed.In addition,several potential metallization technologies for HJT solar cells,such as the Smart Wire Contacting Technology,pattern transfer printing,inkjet/FlexTrailprinting,and copper electroplating,are discussed in detail.B ased on the summary,the potential and challenges of these metallization technologies for HJT solar cells are analyzed.

Tectonic Dynamic Metallization of Silver-GoldHydrothermal Fluids in Proterozoic GneissTerrene Shear Zones, Suichang, Zhejiang, China

The Suichang mine is the largest silicified vein-type silver-gold mineralization system in Southeast China, whose ore bodies are controlled by shear zones developing in Lower Proterozoic gneiss terrene with initial migmatization, which is covered by Upper Jurassic and Lower Cretaceous volcanic rock system and cut by acidic igneous veins of Jurassic and Cretaceous. The conclusions are as follows: (1) The ore-forming fluid is defined as superhigh tectonic-metamorphic fluid on the base of : 1 (D)-(18O) values 2 fluid inclusions;3 trace elements of pyrite from ores. (2) The shear zone silicified orebod-ies occurred in proterozoic, Jurassic and Cretaceous, which have been transforms in part by ore-bearing comb quartz vein of volcanism.

Effect of surface finish metallization on interfacial bonding behavior of sintered Ag joints

In this work,the sandwich joints were joined by low temperature pressureless sintering Ag paste.The morphology and thermal behavior of Ag nanoparticle paste was characterized and analyzed.The sintered Ag joints with different metallization were prepared and tested.The joints with Ag metallization exhibited superior shear strength and interface bonding ratio.However,the joints with Cu metallization showed lowest shear strength and interface delamination.The interfacial microstructures were observed and the diffusion kinetics between Ag and Au atoms were both calculated.The excessive diffusion of Ag atoms towards the Au layer deteriorated the interface bonding ratio and shear strength.This work will help understand the bonding mechanism between sintered Ag and other metallization.

CHEMICAL VAPOR DEPOSITION OF DIFFUSION BARRIERS FOR ADVANCED METALLIZATION

Metalization is widely used in integrated circuit devices to connect millions of devices together. The success of metallization depends strongly on diffusion barrier technology, due to the interactions of metals with surrounding materials. As device dimension further shrinks, diffusion barrier technology is facing more challenges and opening up new opportunities, particularly for chemical vapor deposition (CVD) process technology. CVD is attracting increased attention in advanced metallization mainly due to its capability in producing conformal thin films. In this review, we will focus our discussion on CVD processes for three most important classes of diffusion barriers: Ti, W and Ta-based diffusion banters. Examples from current literature will be examined.

Research Progress of Ceramic Metallization Technology

Due to the wide application of ceramics in electronic device packaging,the performance of ceramic metallization layer directly determines the performance of the whole package device.This paper introduces the main preparation methods of ceramic metallization,discusses the influence of Mo powder size,metallization formula,sintering temperature and other factors on the performance of ceramic metallization layer prepared by activated Mo-Mn method,and introduces several kinds of methods that can be tested to test the performance of ceramic metallized sealing samples.A new research direction of Ceramic Metallization Technology in the advanced field is put forward.

EVIDENCE OF LATE PALAEOZOIC THERMALWATERMETALLIZATION IN SOUTH YONGMEI DEPRESSION

This paper discusses the seafloor thermalwater spout sedimentary activity in South Yongmei Depression according to the following evidences: the Yongmei region was in an extended tectonic environment of metaplateform and locally developed intracontinental rift aulacogen in company with the activity of rich alkali, high potassium volcanics of doublepeak type. Several kinds of hydrothermal sedimentary rocks and the orebearing sedimentary formations of copperpolymetals, iron and manganese exist in this region with a zoning feature of the seafloor thermalwater spout sedimentation.

Pressure-Induced Metallization and Electrical Phase Diagram for Polycrystalline CaB_6 under High Pressure and Low Temperature

The electrical properties of polycrystaltine CaB6 are revealed by in-situ resistance measurements under high pressure and low temperature. Due to the existence of grain boundaries, polycrystalline CaB6 behaves with semiconducting transport properties, which is different from the semimetallic CaB6 single crystals. The temperaturedependent resistance measurement results show that before the structural phase transition at 12.3 GPa the high pressure first induces the metallization at 6.5 GPa for CAB6. Moreover, the phase diagram for CaB6 is drawn based on the investigated electric conducting properties and at least three different conducting phases are found even at moderate high pressure and low temperature, indicating that the electric nature of CaB6 is very sensitive to the environment.

Cu Diffusion in Co/Cu/TiN Films for Cu Metallization

Some information on how to use in-situ determined diffusion coefficient of Cu to make barrier layer of Cu metallization in ultra large scale integrations （ULSIs） was provided. Diffusion coefficients of Cu in Co at low temperature were determined to analyze Cu migration to Co surface layer. The diffusion depths were analyzed using X-ray photoelectron spectroscopy （XPS） depth profile to investigate the diffusion effect of Cu in Co at different temperatures. The possible pretreatment temperature and time of barrier layer can be predicted according to the diffusion coefficients of Cu in Co.

Thermal performance of sputtered Cu films containing insoluble Zr and Cr for advanced barrierless Cu metallization

Pure Cu films and Cu alloy films containing insoluble substances(Zr and Cr)were deposited on Si(100)substrates,in the presence of interfacial native suboxide(SiOx),by magnetron sputtering.Samples were vacuum annealed between 300℃and 500 ℃to investigate effects of Zr and Cr additions on the thermal performance of Cu films.After annealing,copper silicides were found in the Cu(Zr)films,while no detectable silicides were observed in Cu and Cu(Cr)films.Upon annealing,Zr accelerated the diffusion and reaction between the film and the substrate,and lowered the thermal stability of Cu(Zr)alloy films on Si substrates,which was ascribed to the‘purifying effect’of Zr on the Si substrates.Whereas,Cr prohibited the agglomeration of Cu films at 500℃and decreased the surface roughness.As a result,the diffusion of Cu in Si substrates for Cu(Cr)films was effectively inhibited.In contrast to the high resistivity of Cu(Zr)films,the final resistivity of about 2.76μΩ·cm was achieved for the Cu(Cr)film.These results indicate that Cu(Cr)films have higher thermal stability than Cu(Zr)films on Si substrates and are preferable in the advanced barrierless Cu metallization.

THE MECHANISM OF SURFACE METALLIZATION OF POLYVINYL ALCOHOL COMPLEX METAL CHELATE FILMS

A novel method for preparing metalllzed film has been studied.The reduction process and properties of the poly(vinyl alcohol)(PVA)were probed by several analytic means.According to the etudies,a mechanism for the polymer surface reduction metallization was proposed and proved.

Geochemical Conditions of Metallization of the Lijiagou Pb-Zn Deposit, Gansu Province

The Lijiagou Pb-Zn deposit in Gansu Province is a syngenetic hydrothermal-depositonal and meta-morphosed hydrothermal weakly-reworked stratabound ore deposit. The metallogenic physicochemical condi-tions of the deposit are thoroughly dealt with in this paper according to its different mineralization stages.Based on the systematic study of metallogenic material sources, it is considered that the ore-forming metals, oresulphur and water of mineralizing fluids are mainly derived from the basement, reduction sulphur of marinesulfate and infiltrating heated meteoric water and partially recharged sea water, respectively. Finally, themetallogenic model of this deposit is established.

Surface Modification with Carbon Fiber for the Metallization of Polyether-ether-ketone

The poly-ether-ether-ketone(PEEK)polymer is a semi-crystalline aromatic thermoplastic with outstanding features,such as superior mechanical properties,thermal stability,radiation resistance and excellent chemical and hydrolysis resistance.However,PEEK exhibits a high volume resistivity(1014Ω·m)and surface resistance(1015Ω).This limits its use in the electronics and electromagnetic field.To decrease the resistivity and reduce the thermal expansion of composite materials,this paper modified the PEEK with carbon fiber(CF)and metalized the composites with the electroless Ni-P alloy plating through self-catalyzed deposition,which brings about high conductivity,thermal conductivity,high-temperature weldability resistance and high-low temperature resistance property.The composites and metal coatings were characterized by metallurgical microscope,SEM,and resistance tester.The metal coatings have a uniform surface and low surface resistance less than 10 mΩ~20 mΩ.The thermal shock test at 250°C and the-70°C^100°C high-low temperature environment test were measured.Compared with the electroless plating on unmodified peek,there is no bump and crack,etc.after testing,which shows a good adhesion between the metal coatings and PEEK-CF,high-low temperature resistance as well as high temperature weldability.The researches on the modification of PEEK by carbon fiber and its surface metallization provide technical support for the application of PEEK Composites in radar antenna and other electronic fields.