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Active quenching circuit for a InGaAs single-photon avalanche diode 被引量:3
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作者 郑丽霞 吴金 +3 位作者 时龙兴 奚水清 刘斯扬 孙伟锋 《Journal of Semiconductors》 EI CAS CSCD 2014年第4期151-156,共6页
We present a novel gated operation active quenching circuit (AQC). In order to simulate the quenching circuit a complete SPICE model of a InGaAs SPAD is set up according to the I-V characteristic measurement resuits... We present a novel gated operation active quenching circuit (AQC). In order to simulate the quenching circuit a complete SPICE model of a InGaAs SPAD is set up according to the I-V characteristic measurement resuits of the detector. The circuit integrated with a ROIC (readout integrated circuit) is fabricated in an CSMC 0.5 μm CMOS process and then hybrid packed with the detector. Chip measurement results show that the functionality of the circuit is correct and the performance is suitable for practical system applications. 展开更多
关键词 single-photon avalanche diode (SPAD) active quenching circuit gated operation
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Design and implementation of GM- APD array readout circuit for infrared imaging
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作者 吴金 袁德军 +3 位作者 王灿 陈浩 郑丽霞 孙伟锋 《Journal of Southeast University(English Edition)》 EI CAS 2016年第1期11-15,共5页
Based on an avalanche photodiode( APD) detecting array working in Geiger mode( GM-APD), a high-performance infrared sensor readout integrated circuit( ROIC) used for infrared 3D( three-dimensional) imaging is ... Based on an avalanche photodiode( APD) detecting array working in Geiger mode( GM-APD), a high-performance infrared sensor readout integrated circuit( ROIC) used for infrared 3D( three-dimensional) imaging is proposed. The system mainly consists of three functional modules, including active quenching circuit( AQC), time-to-digital converter( TDC) circuit and other timing controller circuit. Each AQC and TDC circuit together constitutes the pixel circuit. Under the cooperation with other modules, the current signal generated by the GM-APD sensor is detected by the AQC, and the photon time-of-flight( TOF) is measured and converted to a digital signal output to achieve a better noise suppression and a higher detection sensitivity by the TDC. The ROIC circuit is fabricated by the CSMC 0. 5 μm standard CMOS technology. The array size is 8 × 8, and the center distance of two adjacent cells is 100μm. The measurement results of the chip showthat the performance of the circuit is good, and the chip can achieve 1 ns time resolution with a 250 MHz reference clock, and the circuit can be used in the array structure of the infrared detection system or focal plane array( FPA). 展开更多
关键词 infrared 3D(three-dimensional) imaging readout integrated circuit(ROIC) Geiger mode avalanche photodiode active quenching circuit(AQC) time-to-digital converter(TDC)
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