EFFECTS OF LEAD WIDTHS AND PITCHES ON RELIABILITY OF QUAD FLAT PACKAGE(QFP)SOLDERED JOINTS

The finite element method（FEM） is used to analyze the effects of lead widths and pitches on reliability of soldered joints. The optimum simulation for QFP devices is also researched. The results indicate that when the lead pitches are the same, the maximum equivalent stress of the soldered joints increases with the increasing of lead widths, while the reliability of the soldered joints reduces. When the lead widths are the same, the maximum equivalent stress of the soldered joints doesn＇t decrease completely with the increasing of lead pitches, a minimum value of the maximum equivalent stress values exists in all the curves. Under this condition the maximum equivalent stress of the soldewed joints is relatively the least, the reliability of soldered joints is high and the assembly is excellent. The simulating results indicate the best parameter： The lead width is 0.2 mm and lead pitch is 0.3 mm （the distance between two leads is 0.1 mm）, which are benefited for the micromation of QFP devices now. The minimum value of the maximum equivalent stress of soldered joints exists while lead width is 0.25 mm and lead pitch is 0.35 mm （the distance between two leads is 0.1 mm）, the devices can serve for a long time and the reliability is the highest, the assembly is excellent. The simulating results also indicate the fact that the lead width is 0.15 mm and lead pitch is 0.2 mm maybe the limit of QFP, which is significant for the high lead count and micromation of assembly.

Influence of electroless Sn/Bi on Sn/Pb soldered joint strength

The solder joint strength of Pb/Sn soldering aluminum with electroless layer Sn/Bi and Cu was studied. The results show that the joint shear strength of electroless Sn/Bi on aluminum surface is lower than that of Cu. A Pb-riched region with porosity is formed in region of soldering fillet with electroless Sn/Bi. Both the electroless Sn/Bi layer and Pb-riched layer become thicker, which are the reasons why the shear strength of the solder joint with electroless Sn/Bi on aluminum surface is lower than that of electroless Cu, and the higher the thickness of the electroless Sn/Bi layer is, the lower the shear strength of solder joint is.

The influence of temperature on creep behavior of Cu particle enhanced SnPb based composite soldered joints

Creep property of solder alloys is one of the important factors to affect the reliabdity of soldered joints in SMT （surface mount technology）. Particle-enhancement is a way to improve the properties of solder alloys and has caused much more attention than before. Temperatures applied to soldered joints are one of the primary factors of affecting creep properties of particle enhancement composite soldered joints. In this paper single shear lap creep specimens with a 1 mm^2 cross-sectional area were fabricated using Cu particle enhancement 63Sn37 Pb based composite soldered joints and 63Sn37 Pb eutectic soldered joints to examine the influence of temperature on creep behavior of soldered joints. Results indicated that the creep resistance of soldered joints of Cu particle enhancement 63Sn37Pb based composite soldered joint was generally superior to that of the conventional 63Sn37Pb soldered joint. At the same time, creep rupture life of the composite soldered joint was declined with increasing temperature and drop faster than that of the conventional 63Sn37 Pb eutectic soldered joint.

Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad

Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow soldering methods respectively.The influence of different heating methods as well as output power of diode-laser on shear force of micro-joints was studied and the relationship between the shear force and microstructures of micro-joints was analyzed.The results indicate that the formation of intermetallic compound Ag3Sn is the key factor to affect the shear force and the fine eutectic network structures of micro-joints as well as the dispersion morphology of fine compound Ag3Sn,in which eutectic network band is responsible for the improvement of the shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder.With the increases of output power of diode-laser,the shear force and the microstructures change obviously.The eutectic network structures of micro-joints soldered with diode-laser soldering method are more homogeneous and the grains of Ag3Sn compounds are finer in the range of near optimal output power than those soldered with IR reflow soldering method,so the shear force is also higher than that using IR reflow soldering method.When the output power value of diode-laser is about 41.0 W,the shear force exhibits the highest value that is 70% higher than that using IR reflow soldering method.

Effect of indium addition on the microstructural formation and soldered interfaces of Sn-2.5Bi-1Zn-0.3Ag lead-free solder

The microstructural formation and properties of Sn-2.5Bi-xln-lZn-0.3Ag （in wt%） alloys and the evolution of soldered interfaces on a Cu substrate were investigated. Apart from the relatively low melting point （about 195C）, which is close to that of conventional eutectic Sn-Pb solder, the investigated solder presents superior wettability, solderability, and ductility. The refined equiaxial grains enhance the me- chanical properties, and the embedded bulk intermetallic compounds （IMCs） （Cu6Sn5 and CusZns） and granular Bi particles improve the joint reliability. The addition of In reduces the solubility of Zn in the 13-Sn matrix and strongly influences the separation and growth behaviors of the IMCs. The soldered interface of Sn-2.5Bi-xln-lZn-0.3Ag/Cu consists of Cu-Zn and Cu-Sn IMC layers.

Reliability Evaluation of QFN Devices Soldered Joints with Creep Model

The solder joint reliability of quad flat non-lead （QFN） package,which has become very popular over the past few years,has received intense interest.The finite element method （FEM） is essential to evaluate the reliability of QFN device.In this paper,Garofalo-Arrheninus model was implemented to simulate the deformation of QFN soldered joints.Equivalent creep strain of the soldered joints was calculated by means of finite element analyses,and was used to evaluate the reliability of QFN packages.It is found that the critical soldered joint of QFN is located the package corner while the maximum creep strain is obtained at the top interface of peripheral soldered joint.The creep strain is provided with periodicity and additivity as the thermal cycling.Nonlinear analysis of QFN package with different lead counts was presented as well,in which the phenomenon that the value of induced creep strain arise as the package size decreasing is noted.Moreover,SnPb and two lead-free solders,namely,Sn3.5Ag/Sn3.8Ag0.7Cu,were both taken into consideration.Simulated results indicate that the creep strain value of lead-free soldered joints is lower than that of SnPb soldered joints,which can be attributed to the difference of stiffness and coefficient of thermal expansion among three solders.Garofalo-Arrheninus model is used to calculate the creep strain of the QFN device for the first time in this study.The results provide an important basis for evaluating the reliability of QFN package.

Interfacial reaction behavior and mechanical properties of 5A06 Al alloy soldered with Sn-1Ti-xGa solders at a low temperature

Active soldering of 5A06 Al alloy was performed at 300 ℃ by using Sn-1Ti and Sn-1Ti-0.3Ga active solders, respectively. Theeffects of soldering time on the microstructure and mechanical properties of the joints were investigated. The results showed that the Sn-1Tisolder broke the oxide film on the surface of the Al substrate and induced intergranular diffusion in the Al substrate. When Ga was added tothe solder, severe dissolution pits appeared in the Al substrate due to the action of Sn-1Ti-0.3Ga solder, and many Al particles were flakedfrom the matrix into the solder seam. Under thermal stress and the Ti adsorption effect, the oxide film cracked. With increasing solderingtime, the shear strength of 5A06 Al alloy joints soldered with Sn-1Ti and Sn-1Ti-0.3Ga active solders increased. When soldered for 90 min,the joint soldered with Sn-1Ti-0.3Ga solder had a higher shear strength of 22.12 MPa when compared to Sn-1Ti solder.

Preliminary Investigation of Copper Joints Soldered with Sn58Bi

In recent years,intensive studies have been carried out to find an alternative for Tin(Sn)⁃Lead(Pb)solder alloys with increasing demand over lower temperature solder alloys in current electronic packaging industry.High temperature operational solder alloys seem to produce drawback to other components on the printed circuit board(PCB).Low melting temperature Sn58Bi substrate as a potential replacement was investigated in this paper based on the melting properties,wettability,and shear strength.The Sn58Bi was soldered at a temperature below 200℃on the Cu substrate,and the shear strength and contact angle were calculated.A peak temperature(melting temperature,T_(M))of 144.83℃was identified.Single lap joint method was performed at a strain rate of 0.1 mm/min and an average shear strength of 23.4 MPa was found from three samples.The contact angle(wettability)was calculated to study the solder joint behaviour at reflow temperature of 170℃.The contact angle of the Sn58Bi was found to be 32.4°and considered to be desired value since the angle is less than 50°.The low temperature soldering provides a preliminary result to allow further application on the real PCB.

A comprehensive review of radiation effects on solder alloys and solder joints

In the realm of military and defence applications, exposure to radiation significantly challenges the performance and reliability of solder alloys and joints in electronic systems. This comprehensive review examines radiation-induced effects on solder alloys and solder joints in terms of microstructure and mechanical properties. In this paper, we evaluate the existing literature, including experimental studies and fundamental theory, to provide a comprehensive overview of the behavior of solder materials under radiation. A review of the literature highlights key mechanisms that contribute to radiation-induced changes in the microstructure, such as the formation of intermetallic compounds, grain growth,micro-voids and micro-cracks. Radiation is explored as a factor influencing solder alloy hardness,strength, fatigue and ductility. Moreover, the review addresses the challenges and limitations inherent in studying the effects of radiation on solder materials and offers recommendations for future research. It is crucial to understand radiation-induced effects on solder performance to design robust and radiationresistant electronic systems. A review of radiation effects on solder materials and their applications in electronics serves as a valuable resource for researchers, engineers, and practitioners in that field.

A review of extreme condition effects on solder joint reliability:Understanding failure mechanisms

Solder joint,crucial component in electronic systems,face significant challenges when exposed to extreme conditions during applications.The solder joint reliability involving microstructure and mechanical properties will be affected by extreme conditions.Understanding the behaviour of solder joints under extreme conditions is vital to determine the durability and reliability of solder joint.This review paper aims to comprehensively explore the underlying failure mechanism affecting solder joint reliability under extreme conditions.This study covers an in-depth analysis of effect extreme temperature,mechanical stress,and radiation conditions towards solder joint.Impact of each condition to the microstructure including solder matrix and intermetallic compound layer,and mechanical properties such as fatigue,shear strength,creep,and hardness was thoroughly discussed.The failure mechanisms were illustrated in graphical diagrams to ensure clarity and understanding.Furthermore,the paper highlighted mitigation strategies that enhancing solder joint reliability under challenging operating conditions.The findings offer valuable guidance for researchers,engineers,and practitioners involved in electronics,engineering,and related fields,fostering advancements in solder joint reliability and performance.

Effect of Mo and ZrO_(2)nanoparticles addition on interfacial properties and shear strength of Sn58Bi/Cu solder joint

The influence of Mo and ZrO_(2)nanoparticles addition on the interfacial properties and shear strength of Sn58Bi solder joint was investigated.The interfacial microstructures of Sn58Bi/Cu,Sn58Bi+Mo/Cu and Sn58Bi+ZrO_(2)/Cu solder joints were analysed using a scanning electron microscope(SEM)coupled with energy dispersive X-ray(EDX)and the X-ray diffraction(XRD).Intermetallic compounds(IMCs)of MoSn_(2)are detected in the Sn58Bi+Mo/Cu solder joint,while SnZr,Zr_(5)Sn_(3),ZrCu and ZrSn_(2)are detected in Sn58Bi+ZrO_(2)/Cu solder joint.IMC layers for both composite solders comprise of Cu_(6)Sn_(5) and Cu_(3)Sn.The SEM images of these layers were used to measure the IMC layer’s thickness.The average IMC layer’s thickness is 1.4431μm for Sn58Bi+Mo/Cu and 0.9112μm for Sn58Bi+ZrO_(2)/Cu solder joints.Shear strength of the solder joints was investigated via the single shear lap test method.The average maximum load and shear stress of the Sn58Bi+Mo/Cu and Sn58Bi+ZrO_(2)/Cu solder joints are increased by 33%and 69%,respectively,as compared to those of the Sn58Bi/Cu solder joint.By comparing both composite solder joints,the latter prevails better as adding smaller sized ZrO_(2)nanoparticles improves the interfacial properties granting a stronger solder joint.

Preventing formation of intermetallic compounds in ultrasonic-assisted Sn soldering of Mg/Al alloys through pre-plating a Ni coating layer on the Mg substrate

Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joint performance of Mg/Al.In this study,AZ31 Mg alloy with/without a nickel(Ni)coating layer and 6061 Al alloy were joined by ultrasonic-assisted soldering with Sn-3.0Ag-0.5Cu(SAC)filler.The effects of the Ni coating layer on the microstructure and mechanical properties of Mg/Al joints were systematically investigated.The Ni coating layer had a significant effect on formation of the Mg_(2)Sn IMC and the mechanical properties of Mg/Al joints.The blocky Mg_(2)Sn IMC formed in the Mg/SAC/Al joints without a Ni coating layer.The content of the Mg_(2)Sn IMC increased with increasing soldering temperature,but the joint strength decreased.The joint without a Ni coating layer fractured at the blocky Mg_(2)Sn IMC in the solder,and the maximum shear strength was 32.2 MPa.By pre-plating Ni on the Mg substrate,formation of the blocky Mg_(2)Sn IMC was inhibited in the soldering temperature range 240–280℃and the joint strength increased.However,when the soldering temperature increased to 310℃,the blocky Mg_(2)Sn IMC precipitated again in the solder.Transmission electron microscopy showed that some nano-sized Mg_(2)Sn IMC and the(Cu,Ni)_(6)Sn_(5)phase formed in the Mg(Ni)/SAC/Al joint soldered at 280℃,indicating that the Ni coating layer could no longer prevent diffusion of Mg into the solder when the soldering temperature was higher than 280℃.The maximum shear strength of the Mg(Ni)/SAC/Al joint was 58.2 MPa for a soldering temperature of 280℃,which was 80.7%higher than that of the Mg/SAC/Al joint,and the joint was broken at the Mg(Ni)/SAC interface.Pre-plating Ni is a feasible way to inhibit formation of IMCs when joining dissimilar metals.

Preparation and Characterization of ZnO-CuO-Bi_(2)O_(3)-B_(2)O_(3)-SiO_(2)System Low Melting Sealing Glasses

Lead-free low melting glasses,ZnO-CuO-Bi_(2)O_(3)-B_(2)O_(3)-SiO_(2)system,with fixed contents of 15 mol%CuO and 20 mol%Bi_(2)O_(3),were prepared by using melt cooling method.Structure and thermal properties of the glasses were studied by using X-ray diffractometer(XRD),infrared spectrometer(FIT-IR),thermal dilatometer and differential thermal analyzer(DTA).Chemical durability of the glasses was studied by using dissolution rate method.Wettability of glasses on substrate was tested by using button sintering experiment.It is found that alkaline resistance of the glass solders is lower than that of plate glass and the water resistance is comparable with that of plate glass.The sealing temperatures are Ts=445-490℃,while the average thermal expansion coefficient from room temperature to 300℃is in the range of(65-82)×10^(−7)℃^(−1).At sealing temperature,the glass solders have good wettability on plate glass or alumina substrate.They are not crystallized even sintered at the sealing temperature for 30 min.The solder glasses are suitable for sealing plate glass,alumina and other inorganic non-metallic materials.

Mechanical and Electrical Properties of Some Sn-Zn Based Lead-Free Quinary Alloys

Although there are many lead-free soldering alloys on the market, none of them have ideal qualities. The researchers are combining binary alloys with a variety of additional materials to create the soldering alloys’ features. The eutectic Sn-9Zn alloy is among them. This paper investigated the mechanical and electrical properties of Sn-9Zn-x (Ag, Cu, Sb);{x = 0.2, 0.4, and 0.6} lead-free solder alloys. The mechanical properties such as elastic modulus, ultimate tensile strength (UTS), yield strength (YS), and ductility were examined at the strain rates in a range from 4.17 10−3 s−1 to 208.5 10−3 s−1 at room temperature. It is found that increasing the content of the alloying elements and strain rate increases the elastic modulus, ultimate tensile strength, and yield strength while the ductility decreases. The electrical conductivity of the alloys is found to be a little smaller than that of the Sn-9Zn eutectic alloy.

Effect of Sb content on properties of Sn-Bi solders

The effect of Sb content on the properties of Sn-Bi solders was studied. The nonequilibrium melting behaviors of a series of Sn-Bi-Sb solders were examined by differential scanning calorimetry （DSC）. The spreading test was carried out to characterize the wettability of Sn-Bi-Sb solders on Cu substrate. The mechanical properties of the solders/Cu joints were evaluated. The results show that the ternary alloy solders contain eutectic structure resulting from quasi-peritetic reaction. With the increase of Sb content, the amount of the eutectic structure increases. At a heating rate of 5 ℃/min, Sn-Bi-Sb alloys exhibit a higher melting point and a wider melting range. A small amount of Sb has an impact on the wettability of Sn-Bi solders. The reaction layers form during spreading process. Sb is detected in the reaction layer while Bi is not detected. The total thickness of reaction layer between solder and Cu increases with the increase of the Sb content. The shear strength of the Sn-Bi-Sb solders increases as the Sb content increases.

EFFECTS OF RARE EARTH ELEMENT LANTHANUM ON MICROSTRUCTURE AND PROPERTIES OF Ag-Cu-Ti SOLDER ALLOY

The effects of rare earth Lanthanum on the microstructure, the physical property and the microhardness of Ag-Cu-Ti solder alloy are studied. Experimental results indicate that the addition of Lanthanum can evidently improve the wettability and the microhardness of Ag-Cu-Ti solder alloy. Analysis results show that the increase in microhardness is related to the refining and uniform distribution of the intermetallic compounds. Proper content of Lanthanum added in Ag-Cu-Ti alloy solder can be controlled below 0.5% in mass percent.

Drop failure modes of Sn-3.0Ag-0.5Cu solder joints in wafer level chip scale package

To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were identified, i.e., short FR-4 cracks and complete FR-4 cracks at the printing circuit board （PCB） side, split between redistribution layer （RDL） and Cu under bump metallization （UBM）, RDL fracture, bulk cracks and partial bulk and intermetallic compound （IMC） cracks at the chip side. For the outmost solder joints, complete FR-4 cracks tended to occur, due to large deformation of PCB and low strength of FR-4 dielectric layer. The formation of complete FR-4 cracks largely absorbed the impact energy, resulting in the absence of other failure modes. For the inner solder joints, the absorption of impact energy by the short FR-4 cracks was limited, resulting in other failure modes at the chip side.

Interfacial characteristics and microstructural evolution of Sn-6.5Zn solder/Cu substrate joints during aging

The influence of isothermal aging at 150 °C on the microstructural characteristics and microhardness of the Sn-6.5Zn solder/Cu joint was studied. The mechanisms for the formation and evolution of intermetallic compound （IMC） at the interface of the Sn-6.5Zn/Cu joint were also analyzed. The results indicate that a continuous layer consisting of CuZn and Cu5Zn8 IMCs is formed in the interface zone. As the aging time prolongs, the thickness of the IMC layer first increases and then decreases, and the continuous and compactable layer is destroyed due to the decomposition of the Cu-Zn IMC layer. A discontinuous layer of Cu6Sn5 IMC is present within the Cu substrate near the decomposed region. The interface becomes rough and evident voids form after aging. The microhardness of the interface increases owing to the application of aging.

Effects of Sn element on microstructure and properties of Zn-Cu-Bi-Sn high-temperature solder

The microstructures and properties of the Zn-Cu-Bi-Sn(ZCBS) high-temperature solders with various Sn contents were studied using differential scanning calorimetry(DSC),scanning electron microscopy(SEM) and X-ray diffraction(XRD).The results indicate that the increase of Sn content can both decrease the melting temperature and melting range of ZCBS solders and it can also effectively improve the wettability on Cu substrate.The shear strength of solder joints reaches a maximum value with the Sn addition of 5%(mass fraction),which is attributed to the formation of refined β-Sn and primary ε-CuZn_5 phases in η-Zn matrix.However,when the content of Sn exceeds 5%,the shear strength decreases due to the formation of coarse β-Sn phase,which is net-shaped presented at the grain boundary.

Influence of rapid solidification on Sn-8Zn-3Bi alloy characteristics and microstructural evolution of solder/Cu joints during elevated temperature aging

The effects of rapid solidification on the microstructure and melting behavior of the Sn-8Zn-3Bi alloy were studied. The evolution of the microstructuraI characteristics of the solder/Cu joint after an isothermal aging at 150 ℃ was also analyzed to evaluate the interconnect reliability. Results showed that the Bi in Sn-8Zn-3Bi solder alloy completely dissolved in the Sn matrix with a dendritic structure after rapid solidification. Compared with as-solidified Sn-8Zn-3Bi solder alloy, the melting temperature of the rapid solidified alloy rose to close to that of the Sn-Zn eutectic alloy due to the extreme dissolution of Bi in Sn matrix. Meanwhile, the adverse effect on melting behavior due to Bi addition was decreased significantly. The interfacial intermetallic compound （IMC） layer of the solder/Cu joint was more compact and uniform. Rapid solidification process obviously depressed the formation and growth of the interfacial IMC during the high-temperature aging and improved the high-temperature stability of the Sn-8Zn-3Bi solder/Cu joint.